Load-Lock Sputter-Up Deposition System
Get personalized pricing for your specific requirements
- Manufacturer warranty included
- Calibration certificate on request
- Worldwide shipping and installation support
- Application specialists available before you buy
Load-Lock Sputter-Up Deposition System – ToronSputter™ SU
Load-Lock Magnetron Sputtering System – Sputter-Up
The Load-Lock Sputter-Up Deposition System integrates upward-facing magnetron sputtering sources and organic effusion cells within a single load-lock chamber, allowing inorganic and organic thin films to be deposited together. In the sputter-up layout, targets sit beneath a downward-facing substrate, which supports confocal deposition geometry and the integration of multiple sources. A dedicated load-lock pump reaches 10⁻⁶ Torr in 10 minutes, while the main chamber holds a base pressure of 10⁻⁸ Torr. Samples are exchanged through the load-lock with a magnetic arm, making 20 to 30 experiments per day possible.
Organic Evaporation, Inorganic Sputtering, and Thermal Sources
Organic evaporation relies on PID-controlled effusion cells operating from 50 to 800 °C with ±1 °C stability, suited to depositing organic semiconductor and OLED materials. For inorganic films, 1 to 6-inch RF and DC sputtering guns deposit conductors and insulators such as Au, Al, TiN, and SiO₂ at high rates under recipe control. Digital MFC gas inlets with 0.1 sccm sensitivity support both inert and reactive sputtering. High-power thermal sources rated at 8V to 500A, 5000W add sequential evaporation and co-evaporation within the same run.
Substrate Heating, Thickness Monitoring, and Process Control
PID-controlled substrate heating from 50 to 600 °C at ±1 °C, together with 2 to 30 rpm rotation and DC/RF plasma cleaning, enables deposition onto heated substrates. A dual-channel thickness controller with two QCMs monitors deposition rate and cumulative thickness at 0.1 Å/s resolution. Vacuum control covers 10⁻¹ to 10⁻⁹ Torr and includes downstream and upstream pressure-fixing capability. An automatic on-off water cooling interlock and a UV-blocking observation window with LabVIEW shutter control handle process safety and deposition timing.
Load-Lock Sputter-Up Deposition System – ToronSputter™ SU Applications
Combined Sputtering and Organic Evaporation for Thin Film Research
The Load-Lock Sputter-Up Deposition System supports organic and inorganic thin film research that calls for sputter deposition and organic evaporation on one continuous-vacuum platform. Its confocal sputter-up geometry, organic effusion cells, and load-lock design make it well suited to multilayer organic-inorganic device fabrication and high-throughput PVD research programs.
Key Application Areas
- OLED and Organic Light-Emitting Device Fabrication: Organic emitter and transport layers are deposited by effusion cell, and metal electrode layers by sputtering, all in situ with no air exposure between steps.
- Organic Photovoltaic Cell Research: Sputter-up deposition of transparent contact layers and reactive-sputtered oxide films, together with effusion-deposited organic active layers, supports OPV device prototyping.
- Perovskite Solar Cell Development: Organic hole-transport layers and metallic contacts are deposited in a single vacuum environment, which reduces defects caused by exposure to atmospheric moisture and oxygen.
- Organic Semiconductor and OFET Research: Effusion cells provide precise deposition of small-molecule organic semiconductors, while confocal sputter-up metallization forms the device contacts.
- Optical Thin Film Research: Reactive sputter-up deposition of TiO₂, SiO₂, and other optical coatings, paired with downstream pressure control, delivers stoichiometric accuracy.
- Hard Coating and Surface Engineering: Reactive RF sputtering of TiN, CrN, DLC, and related films from below-mounted, upward-facing targets coats tooling and mechanical components.
- High-Throughput Multi-Material PVD Research: Load-lock sample exchange enables 20 to 30 experiments per day, supporting iterative multilayer organic-inorganic deposition programs.
 |
 |
Load-Lock Sputter-Up Deposition System – ToronSputter™ SU Key Features
High-Vacuum Platform for Combined Organic-Inorganic Thin Film Research
The Load-Lock Sputter-Up Deposition System brings together confocal sputter-up magnetron guns, Knudsen effusion cells for organic materials, MFM gas control, and load-lock sample exchange in one high-vacuum platform built for combined organic-inorganic thin film research.
Deposition Sources and Chamber Geometry
- 50 to 800 °C Effusion Cells for Organic Evaporation (±1 °C PID): Knudsen effusion cells deliver precise deposition of organic semiconductors, OLED emitters, and hole-transport materials in the same chamber as the sputtering sources, a combination that sets this system apart from sputter-down configurations.
- 1 to 6-Inch RF and DC Sputter-Up Guns with Flex-Head Rotation: Upward-facing guns feature self-axis rotation and compression seals, creating a confocal multi-source deposition geometry aimed at downward-facing substrates.
- Confocal Sputter-Up Geometry: Multiple gun axes converge at a shared point at the center of the substrate. This improves co-deposition uniformity and allows multi-material deposition without repositioning the substrate.
- 8V to 500A, 5000W Thermal Sources for Co-Evaporation: High-power thermal sources support sequential and co-evaporation, with a design that prevents cross-contamination and makes material replacement easy.
- Load-Lock Adaptable to E-Beam and Thermal Source Systems: The load-lock architecture can be configured for platforms that combine magnetron sputtering with e-beam and thermal evaporation sources.
Vacuum Performance and Sample Handling
- 10⁻⁸ Torr Main Chamber Base Pressure: A turbomolecular and mechanical pump combination, with a dry pump option, sustains the base pressure needed for high-purity organic and inorganic film deposition.
- Dedicated Load-Lock Pump, 10⁻⁶ Torr in 10 Minutes: A separate pumping system evacuates the load-lock without disturbing the vacuum in the main chamber, and it can be adapted to e-beam and thermal source platforms.
- Magnetic Arm Sample Transfer, 2" to 6" Substrates: A magnetic arm loads and unloads substrates from 2" to 6" in diameter, with easy sample exchange options.
- 20 to 30 Experiments Per Day: The load-lock design allows rapid sample cycling, which supports high-throughput multilayer research and iterative device fabrication programs.
- Throttle, Vent, Isolation, and Gate Valve Configuration: A comprehensive valve set manages every pressure transition, and the isolation valve keeps the main chamber under continuous vacuum while idle.
- Wide-Range Vacuum Control (10⁻¹ to 10⁻⁹ Torr) with Pressure Fixing: Vacuum measurement and downstream or upstream pressure-fixing capability provide precise reactive sputtering process windows.
Process Control and Monitoring
- 50 to 600 °C PID Substrate Heating with ±1 °C Sensitivity: Closed-loop substrate temperature control helps manage film crystallinity, adhesion, and interface quality across a wide temperature range.
- 2 to 30 rpm Sample Rotation with DC/RF Plasma Cleaning: PC-controlled substrate rotation promotes deposition uniformity, while DC/RF plasma cleaning removes surface oxides before deposition begins.
- Digital MFC Gas Inputs (Ar, N₂, O₂, He, CH₄) at 0.1 sccm Sensitivity: MFC-controlled mixed gas delivery supports both inert and reactive sputtering processes.
- 0.1 Å/s Dual-Channel Thickness Monitoring with Two QCMs: Rate and thickness are measured simultaneously across the organic and inorganic deposition channels.
- UV-Blocking Observation Window with LabVIEW Shutter Control: A rotatable door shutter and a LabVIEW-integrated sample shutter provide precise deposition timing and tie into thickness control.
- Fully Automatic Computer and Panel Control with LCD Displays: Computer control runs all deposition operations automatically, with panel override and real-time process monitoring on LCD displays.
- Interlock-Protected Automatic Water Cooling: Closed-loop water cooling switches on and off automatically, and an interlock blocks source operation unless coolant is flowing.
Chamber Construction and Configuration
- SS304 Chamber (Prismatic or Cylindrical) with Electro-Polished Surfaces: The feather-touch, electro-polished interior includes an SS304 liner, and water-cooled chamber surfaces are available when needed.
- Standard 1-Inch, QF, CF, and ISO Feedthrough Ports: Configurable port selection allows upgrades with additional thermal and sputtering sources.
Warranty
- Two-Year Warranty for Materials, Design, and Workmanship: Comprehensive two-year coverage applies to system components, design, and manufacturing quality.
Load-Lock Sputter-Up Deposition System – ToronSputter™ SU Theory and Method
Sputter-Up Geometry and Confocal Deposition
In sputter-up magnetron sputtering, the targets sit below a downward-facing substrate, so its deposition surface receives sputtered flux traveling upward. This substrate-down, source-up layout supports confocal arrangements in which several gun axes meet at the center of the substrate, which improves composition uniformity during co-deposition. Because the downward-facing substrate sits directly above the organic effusion cells, organic and inorganic layers can be deposited sequentially or simultaneously within one vacuum cycle. Load-lock access lets samples move in and out through the antechamber while the main chamber stays under vacuum.
Organic Evaporation and Thickness Monitoring
Organic materials are evaporated from Knudsen effusion cells, rather than from the high-current boats used for inorganic metals. PID control at ±1 °C across 50 to 800 °C keeps the molecular flux stable, which matters because organic materials react disproportionately to small temperature changes. QCM thickness monitoring at 0.1 Å/s follows organic and inorganic film growth in real time across two channels. In the sputter-up configuration, organic and metallic sources share the same side of the chamber, so both can be deposited onto the same substrate face without repositioning.
Vacuum Architecture and Pressure Control
The main chamber maintains a 10⁻⁸ Torr base pressure using a turbomolecular and mechanical pump combination, and a separate load-lock pump reaches 10⁻⁶ Torr in 10 minutes. Throttle, vent, isolation, and gate valves govern every vacuum transition, and the main chamber remains continuously under vacuum whenever the system is idle. Vacuum measurement and control cover 10⁻¹ to 10⁻⁹ Torr, with downstream or upstream pressure-fixing capability. High-power thermal sources rated at 8V to 500A, 5000W complement sputtering by adding co-evaporation and sequential deposition capability.
Load-Lock Sputter-Up Deposition System - ToronSputter™ SU Technical Specifications
| Parameter | Specification |
|---|---|
| Deposition Configuration | Sputter-up (substrate-down, sources-up) |
| Organic Evaporation | Knudsen effusion cells; 50 to 800 °C; PID controlled; ±1 °C |
| Main Chamber Base Pressure | 10⁻⁸ Torr |
| Load-Lock Vacuum Level | 10⁻⁶ Torr in 10 minutes |
| Vacuum Control Range | 10⁻¹ to 10⁻⁹ Torr |
| Pump Configuration | Turbomolecular + Mechanical (dry pump optional); dedicated load-lock pump |
| Valve Configuration | Throttle, vent, isolation, and gate valves |
| Chamber Material | SS304 (prismatic or cylindrical); electro-polished; SS304 liner |
| Chamber Surface Cooling | Water-cooled surfaces (when needed) |
| Feedthrough Ports | Standard 1-inch, QF, CF, ISO |
| Observation Window | UV-blocking; rotatable door shutter |
| Sputtering Guns | 1 to 6 inches (upward-facing); RF and DC; flex-head; self-axis rotation; compression seal |
| Thermal Sources | 8V to 500A, 5000W (sequential and co-evaporation) |
| Sample Transfer | Magnetic transfer arm |
| Sample Sizes | 2", 3", 4", 6" |
| Substrate Heating | 50 to 600 °C (PID controlled, ±1 °C) |
| Sample Rotation Speed | 2 to 30 rpm (PC controlled) |
| Plasma Cleaning | DC/RF plasma |
| Gas Inputs | Ar, N₂, O₂, He, CH₄ and others; digital MFC; 0.1 sccm sensitivity |
| Pressure Control Method | Downstream and upstream flow control |
| Thickness Monitoring | Dual-channel; 0.1 Å/s precision; 2 QCMs |
| Cooling System | Automatic closed-loop water cooling (interlock protected) |
| Control System | Fully automatic computer control; panel control; real-time LCD; LabVIEW |
| Experiment Throughput | 20 to 30 experiments per day |
| Warranty | 2 years (materials, design, and workmanship) |
Important Delivery Information
Delivery time varies upon stock availability. Our standard dispatch and shipping times are generally within 1 week, however for some high demand items the delivery may be extended to 2-3 weeks.
Need it urgently? Contact us here to check stock and organize faster shipping.
Orders:
Purchaser acknowledges that when placing an order on the Torontech:
A. the placing of the order signifies the purchaser's assent to place said order at the Torontech and that the order will be accepted by the successful processing of the order by Torontech WorldWide LC.
B. the purchaser typing their name when requested to do so by the Torontech constitutes a signature to contract
C. the purchaser has the full authority to enter into the contract for such entity, and such grant of authority was indicated by purchaser by placement of the order through the Torontech.
D. A minimum handling fee will be applied to the shipping total for all orders.
Shipping within the U.S.A.:
All orders will be shipped best way prepaid, via courier for smaller packages or via Freight forwarders for larger crates. A handling fee may be applicable to orders. Title to merchandise transfers to the purchaser upon delivery to the carrier. Loss or damage in transit is the responsibility of the purchaser. Torontech WorldWide will provide assistance with information needed for processing claims.
Shipping outside of the U.S.A.:
All orders will be shipped best way, via courier for smaller packages or via Freight forwarders for larger crates. A low handling fee may be applicable. Title to merchandise transfers to the purchaser upon delivery to the carrier. Loss or damage in transit is the responsibility of the purchaser. Torontech WorldWide will provide assistance with information needed for processing claims. Export fees, duties, taxes, and customs clearance are the responsibility of the purchaser.
Shipping insurance is not included, please contact our sales representatives if you need shipping insurance.
Partial shipment: Torontech WorldWide reserves the right to make partial shipments unless otherwise instructed by the purchaser.
Payment terms: All payments to Torontech WorldWide are to be made in U.S. Dollars (USD)
A. Credit Card - Torontech WorldWide will accept Visa, Master Card, AMEX or Discover. Required information from the purchaser is the credit card number, 3 digit security code, expiration date, card holder's name (exactly as it appears on the card), billing address, and valid telephone number for us to use in case of difficulty. Torontech WorldWide reserves the right to delay shipment pending verification of credit card validity.
B. Wire Transfer - Transfer must be made to Torontech and confirmed for the full purchase amount (merchandise, handling and shipping) prior to shipment. Please contact us by phone at 1.877.884.TEST (8378)(outside U.S. +1.905.944.9825) or by fax at +1.954.697.8211 for bank information.
C. Open Account - Available to U.S.A. and Canadian customers only. Terms on open accounts are Net 30 days from date of shipment. Torontech WorldWide reserves the right to refuse shipment of new orders if any unpaid invoices are older than 30 days. Purchasers may apply for an open account by providing:
their bank information
3 credit references from other suppliers
Please allow 5 business days for confirmation of credit and creation of an open account.
Return Policy:
Torontech WorldWide may accept return of purchased merchandise within North America for refund or credit under the following conditions -
- There may be an additional restocking fee charged to the transaction if items are already shipped to customer.
- Goods must be returned to Torontech WorldWide within 5 days of the date of the receipt of the purchased goods.
- All freight, duties, customs, and other related shipping charges for the returned merchandise are borne by the purchaser. Shipments made freight collect will be refused.
- Merchandise must be returned properly packaged in brand new, salable condition, along with original packaging and all documentation, accessories and certificates.
- Purchaser has confirmed return authorization directly with Torontech.
- Merchandise is regular catalog item. Special order items can not be returned.
- All returned merchandise is subject to inspection by Torontech. Torontech reserves the right to refuse return of any merchandise that is used, damaged, or not part of the current published price list. In the case Torontech does not accept the returned merchandise, reasonable attempts will be made to notify the Buyer and the merchandise will be returned to Buyer as they were received by Torontech. Damaged merchandise that can be restored to original condition and thus accepted for return will be evaluated on an individual basis. The purchaser will be advised of additional expenses for the repair and restoration of the returned item. After approval, these expenses will be charged to the purchaser in addition to the restocking fee.
Change of Terms:
The acceptance of any order by Torontech WorldWide is subject to purchaser's assent to all of the terms and conditions set forth herein. Purchaser's assent to these terms and conditions shall be presumed from the purchaser's placement of an order through the Torontech. Any and all other terms and conditions are expressly rejected, and no addition or modification of terms and conditions shall be binding without the prior agreement of Torontech WorldWide in writing.
Complete Agreement:
The terms and conditions in the Torontech web site, incorporated herein by reference, including forms, acknowledgements, quotations, invoices and sales terms and conditions constitute the entire and exclusive agreement between the purchaser and Torontech WorldWide
Information:
Torontech Inc makes every effort to insure the accuracy of the product information displayed on its web sites, but makes no warranties, expressed or implied, as to the accuracy of the data portrayed on the web sites. Torontech Inc reserves the right to change product information, including pricing information at any time without notice.
Trademarks and Copyrights:
The WorldofTest.com Torontech contains trademarked product names. Product names are not to be reproduced or used in any fashion by any party other than Torontech without the express written consent of Torontech International Inc.. All pictures, descriptions, and other content of this web site are copyrighted by Torontech Inc and may not be used without the express written permission of Torontech Inc. Purchaser acknowledges that they have no right, title, or interest in the trademarks or copyrights in the products, and purchaser covenants that it will take no action to register or otherwise interfere with such rights. Please contact us with any requests for permission or questions about our trademarks.
Warranty Disclaimer:
No warranty or affirmation of fact, express or implied, other than expressly set forth herein is made or authorized by Torontech Inc. Torontech Inc disclaims any and all liability for product defect claims. Torontech Inc does not express or imply a warranty that any product on the web site(s) is fit for a particular purpose. Torontech Inc honors the product warranty as published and made available by Torontech Inc. Warranty claims for products not manufactured by Torontech are the responsibility of the manufacturer. Torontech Inc will always make its best good faith effort to resolve warranty claims.
Force Majeure:
Torontech Inc shall not be liable for any delay in or impairment of performance resulting in whole or in part from Acts of God, service interruptions, labor disruptions, insurrections, governmental decrees or controls, war risks, severe weather, supplies or raw materials, inability to procure or ship products, inability to obtain permits and/or licenses, or any other circumstances or causes beyond the control of Torontech Inc in the conduct of its business.
Torontech Inc Privacy Policy
I. What legal provisions govern our data processing practices? How and from where (internal/external sources) is personal data acquired? What are the rights of the user (web site visitor/registered customer)?
1. General
As a general principle, no personal details need to be provided when visiting our Internet site. Data made available to us by you is treated in strict confidence and in accordance with the provisions of the Federal Data Protection Act. With a few exceptions (see point 2 below), our web server only registers non-personal (anonymous) data concerning the use of our site. Specifically, the log files of our web server, as a general rule, only contain the user's IP address, the last page visited by the user, the browser used, date, time and the file requested. This anonymous data, however, does not permit conclusions to be drawn about the individual users, and merely serves to prepare statistics on the use of our Internet site for the purpose of its improvement. At the same time, great importance is placed on ensuring that usage data is not linked with personal data.
2. Personal data
Person-related data (personal data) is only used if the newsletter is ordered (by email), product(s) is (are) ordered, or to supply product information. We undertake to use the personal data entrusted to us only for the purposes stated. Purchase history is retained for assistance with future customer needs.
II. What security measures are used to protect personal data? What are the user's options for processing personal data?
3. Technical measures
Databases are optimally protected against third party access, loss, misuse and falsification through the use of appropriate technical means. In order to determine the popularity of individual topic areas, cookies are used in those sections. These text files are stored on your hard disk and facilitate your use of our Internet site. Thanks to these cookies, there is no need for specific registration each time you visit a section requiring registration, and we can supply you with the personalized contents you request.
It is for you to decide whether you want to work with cookies and, if so, which kind (permanently stored on the hard disk or only placed for the time of the browser activity). However, we draw your attention to the fact that access to fields requiring registration is only possible with activated cookies.
III. What data is communicated to third parties and for what purposes?
4. Communication of personal data
Personal data entrusted to us by you is not communicated, leased or sold to third parties.
IV. Which department answers questions about the processing of personal data?
5. Contact
In the light of the rapid technical developments in connection with the Internet, we make every effort to constantly improve our Internet site and technical precautions, including those connected with data protection. We will keep you suitably informed about such measures. Any changes will be published here. Further information is available at any time by contacting Torontech Inc.
Disclaimer of liability Torontech Inc shall not be liable for direct, indirect or consequential losses resulting from or in connection with access to, use of or queries to the Torontech web site or its links with other web sites, even if Torontech Inc has previously been informed of the possibility of such losses. No guarantee is provided as to the accuracy of the information disseminated via the Torontech Inc web site. In addition, Torontech Inc guarantees neither the reliability nor the completeness of the information contained on its web site. The information made available on the Torontech and WorldofTest.com web site may be amended at any time without prior notice. In particular, Torontech Inc shall not be liable for losses caused by transmission errors, technical faults and interruptions, breakdowns or an unlawful interference with the user's data processing system or the generally accessible systems and transmission networks. Nor shall Torontech Inc be liable for losses resulting from breakdowns, interruptions or overloads occurring to any data processing systems. If certain links are activated on the Torontech and WorldofTest.com web site, the user may under certain circumstances leave the Torontech web site. Torontech Inc assumes no responsibility for the contents, products or services offered or other information or offers contained on these linked web sites.
