{"product_id":"rf-dc-magnetron-sputtering-system","title":"RF\/DC Magnetron Sputtering System","description":"\u003ch2\u003eRF\/DC Magnetron Sputtering System: ToronSputter™ RFDC\u003c\/h2\u003e\n\u003ch3\u003eMulti-Target Deposition and Power Supplies\u003c\/h3\u003e\n\u003cp\u003eThe ToronSputter™ RFDC is a magnetron sputtering system built for multi-target thin film deposition. It accommodates targets up to 6 inches in diameter and supports configurations of 1 to 4 sources. The RF power supply (13.6 MHz, 300 to 1200 W) is suited to insulating and reactive targets, while the DC power supply (600 V, 1.7 A) serves metallic film deposition.\u003c\/p\u003e\n\u003ch3\u003eChamber, Vacuum Performance, and Automation\u003c\/h3\u003e\n\u003cp\u003eThe SS304 chamber, available in sizes from 30 to 60 cm, reaches a base pressure of 10⁻⁷ Torr. A working vacuum of 10⁻⁶ Torr is achieved within 30 minutes. Fully automated LabVIEW control and a 1.5-hour process cycle deliver consistent daily throughput. Wide-range vacuum control (1000 to 10⁻⁹ Torr) and chamber baking at 120 °C help maintain base pressure and a clean process environment.\u003c\/p\u003e\n\u003ch3\u003eGas Control and Pressure Regulation\u003c\/h3\u003e\n\u003cp\u003eThree-channel MFM gas control with real-time display handles Ar, N₂, O₂, He, CH₄, and H₂, supporting both inert and reactive sputtering across a 1 to 100 mTorr range. Throttle, vent, and isolation valves allow precise pressure setting. During reactive processes, a capacitance manometer adds a further plasma pressure measurement.\u003c\/p\u003e\n\u003ch3\u003eSubstrate Preparation\u003c\/h3\u003e\n\u003cp\u003eSubstrates are prepared before deposition using PID-controlled heating from 50 to 600 °C and rotation from 3 to 30 rpm. RF plasma cleaning through substrate biasing completes the preparation step.\u003c\/p\u003e\n\u003ch3\u003eThickness Control and Multi-Layer Sequences\u003c\/h3\u003e\n\u003cp\u003eA dual-channel thickness controller supports 1 to 4 QCMs with 0.1 Å\/s resolution. Managed through LabVIEW automation, it runs multi-layer deposition sequences fully automatically.\u003c\/p\u003e\n\u003ch3\u003eLarge-Substrate Capability and Production Coating\u003c\/h3\u003e\n\u003cp\u003eThe extended target range, up to 6 inches, allows deposition on larger substrates and increases throughput for production coating programs.\u003c\/p\u003e\n\u003ch3\u003eFootprint, Ports, and Process Support\u003c\/h3\u003e\n\u003cp\u003eThe system occupies a 75×120 cm footprint and sits on lockable wheels, so it passes through standard doorways. Standard 1-inch, QF, CF, and ISO ports provide flexible feedthrough and source configurations. Automatic start-stop closed-loop water cooling and internal baking up to 120 °C complete the process support system.\u003c\/p\u003e\n\u003ch2\u003eRF\/DC Magnetron Sputtering System: ToronSputter™ RFDC Applications\u003c\/h2\u003e\n\u003ch3\u003eWhere the ToronSputter™ RFDC Fits\u003c\/h3\u003e\n\u003cp\u003eThe ToronSputter™ RFDC is designed for research and production PVD facilities that need large-target magnetron sputtering with both RF and DC source options, reactive gas capability, and automated multi-layer deposition. Its 6-inch target option makes the system a strong match for larger substrate programs and higher-throughput coating work.\u003c\/p\u003e\n\u003ch3\u003eKey Application Areas\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor and Microelectronics Fabrication:\u003c\/strong\u003e DC sputtering lays down metallic contacts, seed layers, and barrier films, while RF sputtering forms oxide and nitride dielectric layers. Multi-source runs can be performed on 6-inch wafer substrates.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Coating Production:\u003c\/strong\u003e Reactive RF sputtering produces TiO₂, SiO₂, and multi-layer optical stacks. Capacitance manometer pressure control supports stoichiometric accuracy across extended coating runs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Tool Surface Engineering:\u003c\/strong\u003e Reactive sputtering of TiN, CrN, and TiAlN coats tooling and mechanical components, and the 6-inch target capacity supports higher deposition rates.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTransparent Conductive Oxide Deposition:\u003c\/strong\u003e RF sputtering of ITO, AZO, and other TCO films serves solar cell, display panel, and flexible electronics applications that call for uniform large-area coverage.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterials Science and Alloy Film Research:\u003c\/strong\u003e Multi-target and co-sputtered alloy, compound, and mixed oxide films enable composition-structure-property studies and new materials development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnergy Device and Photovoltaic Research:\u003c\/strong\u003e The system sputters metallic back contacts, oxide buffer layers, and TCO front contacts for thin-film solar cell and energy device research programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Multi-Source Research:\u003c\/strong\u003e A flexible RF\/DC platform supports multi-layer thin film studies across conducting, semiconducting, and insulating materials, all within a single automated system.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a3_a0c1e6af-ce55-49e7-9d47-1c41e04f51d7.webp?v=1793010536\" alt=\"RF\/DC Magnetron Sputtering System\"\u003e\u003c\/p\u003e\n\u003ch2\u003eRF\/DC Magnetron Sputtering System: ToronSputter™ RFDC Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ RFDC combines RF and DC magnetron sputtering in a multi-target, high-vacuum platform. It supports 6-inch targets and features three-channel MFM gas control, LabVIEW-driven layer automation, and capacitance manometer monitoring of plasma pressure.\u003c\/p\u003e\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 4 DC\/RF Sources with 6-Inch Target Capability:\u003c\/strong\u003e The source layout is configurable and accepts 1\", 2\", 3\", 4\", and 6\" target diameters. It suits single-target, co-sputtered, and sequenced multi-layer deposition programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRF Power Supply (13.6 MHz, 300 to 1200 W):\u003c\/strong\u003e This supply covers the RF power range needed for sputtering insulating targets and for reactive oxide and nitride deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC Power Supply (600 V, 1.7 A):\u003c\/strong\u003e The DC supply sputters conductive metallic targets with a controlled deposition rate.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e3-Channel MFM Gas Control (Ar, N₂, O₂, He, CH₄, H₂):\u003c\/strong\u003e Electronic control and real-time display for three independent gas channels support both inert and reactive sputtering processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdditional Capacitance Manometer for Plasma Pressure:\u003c\/strong\u003e A dedicated gauge, independent of the main vacuum gauge, measures plasma pressure precisely during reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, and Isolation Valves with 1 to 100 mTorr Precision:\u003c\/strong\u003e These valves allow precise working pressure adjustment for reactive process control and stable plasma conditions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁷ Torr Base Pressure, 10⁻⁶ Torr in 30 Minutes:\u003c\/strong\u003e A turbomolecular and mechanical pump combination delivers this performance. Cryo and dry pumps are available as options.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control span atmospheric pressure to deep vacuum for every process mode.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLabVIEW-Based Layer-by-Layer Deposition Control:\u003c\/strong\u003e PC-controlled automation manages each deposition layer independently, so complex multi-layer sequences run without operator intervention.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Measurement with 1 to 4 QCMs:\u003c\/strong\u003e Scalable multi-sensor thickness and rate monitoring supports up to four simultaneous QCM channels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 600 °C PID Substrate Heating:\u003c\/strong\u003e PID-controlled substrate temperature across a wide process range supports film crystallinity and adhesion.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e3 to 30 rpm Sample Rotation:\u003c\/strong\u003e Adjustable substrate rotation promotes uniform film thickness across the substrate surface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSample Plasma Cleaning Unit (RF via Substrate Biasing):\u003c\/strong\u003e In-situ RF plasma cleaning removes native surface oxides before deposition without breaking vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Start-Stop Closed-Loop Water Cooling:\u003c\/strong\u003e Thermal management switches cooling on and off according to system state, protecting the sources and chamber throughout operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Hold with Isolation Valve:\u003c\/strong\u003e The main chamber remains under vacuum when idle, which shortens pump-down time between successive experiments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (30 to 60 cm, Prismatic or Cylindrical):\u003c\/strong\u003e Clean, electro-polished inner surfaces are available in multiple box sizes, with an SS304 liner.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable port selection offers flexible integration of feedthroughs, gauges, and process gas.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInternal Lighting and 120 °C Baking Capability:\u003c\/strong\u003e Internal lighting enables chamber inspection, and baking supports conditioning and moisture removal.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFront Viewing Window with Rotatable Shutter:\u003c\/strong\u003e A direct line of sight allows process monitoring, while the rotatable shutter enables precise deposition timing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer Control with Touch Screen Panel:\u003c\/strong\u003e A touch screen and real-time LCD displays handle all system operations automatically.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5-Hour Experiment Cycle Time:\u003c\/strong\u003e Fast pump-down and a short process cycle support multiple runs per day.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e75×120 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e The compact footprint passes through standard doorways and can be repositioned within the facility.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTwo-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Coverage for system components, design, and manufacturing quality extends to two years, double the standard one-year term.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003ch3\u003ePrinciples of Magnetron Sputtering\u003c\/h3\u003e\n\u003cp\u003eIn magnetron sputtering, a process gas is ionized and the resulting ions strike a cathode target. The impact ejects atoms, which then condense on the substrate and build up a thin film. A magnetic field holds the plasma close to the target face, raising ion density and sputtering yield even at low working pressures. A 600 V DC supply sputters conductive targets, whereas 13.6 MHz RF power dissipates the charge that accumulates on insulating and oxide targets. The 6-inch target format adds source material capacity and widens the usable deposition area for larger substrates.\u003c\/p\u003e\n\u003ch3\u003eMulti-Target, Co-Sputtering, and Reactive Deposition\u003c\/h3\u003e\n\u003cp\u003eA configuration of one to four sources permits sequential deposition within a single pump-down cycle, which limits contamination between material layers. Co-sputtering from sources powered at the same time produces composition-graded and alloy films without separate deposition steps. For reactive sputtering, N₂ or O₂ enters through MFM-controlled inputs while a metallic target is sputtered, forming nitride or oxide films without the need for compound targets. Throttle valve and capacitance manometer control keep plasma pressure stable across the 1 to 100 mTorr reactive process window.\u003c\/p\u003e\n\u003ch3\u003eAutomation and Substrate Preparation\u003c\/h3\u003e\n\u003cp\u003eLabVIEW automation manages the entire layer sequence, including shutter timing, power levels, and gas flow at each step, with no operator intervention between layers. RF plasma cleaning through substrate biasing removes native oxides before deposition and improves adhesion at the film-substrate interface. PID substrate heating from 50 to 600 °C encourages film crystallinity and surface diffusion during growth. Between runs, the isolation valve keeps the main chamber under vacuum, removing pump-down overhead for successive depositions.\u003c\/p\u003e\n\u003ch2\u003eRF\/DC Magnetron Sputtering System - ToronSputter™ RFDC Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\" style=\"height: 627.2px;\"\u003e\n\u003cthead\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003cth style=\"height: 19.6px;\"\u003eParameter\u003c\/th\u003e\n\u003cth style=\"height: 19.6px;\"\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eRF Power Supply\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e13.6 MHz, 300 to 1200 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eDC Power Supply\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e600 V DC, 1.7 A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eNumber of Sputtering Sources\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1 to 4 (DC\/RF)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eTarget Diameters\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1\", 2\", 3\", 4\", 6\"\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eBase Pressure\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.2px;\"\u003e\n\u003ctd style=\"height: 39.2px;\"\u003eWorking Vacuum (Pump-Down Time)\u003c\/td\u003e\n\u003ctd style=\"height: 39.2px;\"\u003e10⁻⁶ Torr in 30 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003ePump Configuration\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eTurbomolecular + Mechanical (cryo and dry pump as options)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eSputter Working Pressure Range\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1 to 100 mTorr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003ePlasma Pressure Measurement\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eAdditional capacitance manometer\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eChamber Material\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eSS304 (prismatic or cylindrical); electro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eChamber Sizes\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e30\/40\/50\/60 cm box size\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eObservation Window\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eFront viewing window; rotatable shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eInternal Lighting\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eBaking Capability\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eUp to 120 °C (internal)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eGas Inputs\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eAr, N₂, O₂, He, CH₄, H₂; 3-channel MFM; real-time electronic display\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eValve Configuration\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eThrottle, vent, and isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eSubstrate Heating\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e50 to 600 °C (PID controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e3 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003ePlasma Cleaning\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eRF plasma via substrate biasing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eDual-channel; 0.1 Å\/s precision; 1 to 4 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.2px;\"\u003e\n\u003ctd style=\"height: 39.2px;\"\u003eControl System\u003c\/td\u003e\n\u003ctd style=\"height: 39.2px;\"\u003eFully automatic computer control; touch screen panel; real-time LCD; LabVIEW\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eCooling System\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eAutomatic start-stop closed-loop water cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eExperiment Cycle Time\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1.5 hours\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eFootprint\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003ePasses through standard doorways\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eMobility\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eWarranty\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e2 years (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280281600239,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/rfdc-magnetron-sputtering-system.webp?v=1793010510","url":"https:\/\/shop.torontech.com\/fr\/products\/rf-dc-magnetron-sputtering-system","provider":"Torontech","version":"1.0","type":"link"}