{"product_id":"magnetron-sputtering-system-toronsputter-mag","title":"Magnetron Sputtering System - ToronSputter™ Mag","description":"\u003ch2\u003eMagnetron Sputtering System: ToronSputter™ Mag\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ Mag is a fully automated magnetron sputtering platform built for thin film deposition in both research and production settings, driven by DC and RF power. A DC supply rated at 0 to 1000 V and 2000 W handles conductive targets, while an RF supply operating at 13.56 MHz and 300 to 1200 W covers insulating materials and reactive processes. The system accepts one to four sources in 1 to 4-inch target diameters, allowing both single-target and multi-target deposition. Its SS304 chamber, available from 30 to 60 cm, reaches a base pressure of 10⁻⁸ Torr and pumps down to 2×10⁻⁶ Torr in 20 minutes.\u003c\/p\u003e\n\u003ch3\u003eGas Control, Pressure Regulation, and Substrate Preparation\u003c\/h3\u003e\n\u003cp\u003eThree-channel MFM gas control handles Ar, N₂, O₂, He, CH₄, and H₂, supporting both inert and reactive sputtering across a 1 to 100 mTorr range. Throttle, vent, and isolation valves allow precise pressure setting. During reactive processes, a capacitance manometer adds a further plasma pressure measurement. Substrates are prepared through PID-controlled heating from 50 to 700 °C, rotation at 2 to 30 rpm, and RF plasma cleaning via substrate biasing. Wide-range vacuum control (1000 to 10⁻⁹ Torr) and a 120 °C bake-out help maintain base pressure and chamber condition.\u003c\/p\u003e\n\u003ch3\u003eThickness Monitoring and Automated Process Control\u003c\/h3\u003e\n\u003cp\u003eA dual-channel thickness controller supports 1 to 4 QCMs with 0.1 Å\/s resolution. Managed through LabVIEW automation, it runs each layer sequence fully automatically from start to finish.\u003c\/p\u003e\n\u003ch3\u003eChamber Design, Cooling, and Footprint\u003c\/h3\u003e\n\u003cp\u003eThe SS304 chamber comes in 30, 40, 50, and 60 cm configurations with electro-polished surfaces and standard 1-inch, QF, CF, and ISO ports. Automatic start-stop closed-loop water cooling and an observation window with a rotatable shutter support monitored deposition. The unit measures 75×120 cm and sits on lockable wheels, so it passes through standard doorways. Internal lighting and 120 °C baking capability are also included.\u003c\/p\u003e\n\u003ch2\u003eMagnetron Sputtering System: ToronSputter™ Mag Applications\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ Mag supports PVD research and production facilities that need DC and RF magnetron sputtering for a broad range of conductive and insulating materials. Multi-target flexibility and precise reactive sputtering control make it suitable for many deposition tasks.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor and Microelectronics Research:\u003c\/strong\u003e Deposits metal contacts, barrier layers, and dielectric films on wafer substrates through DC and RF magnetron sputtering, with controlled rates and compositions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Deposition:\u003c\/strong\u003e Applies reactive RF sputtering to TiO₂, SiO₂, and other optical oxide coatings, using capacitance manometer pressure control to achieve stoichiometric accuracy.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Wear-Resistant Surface Engineering:\u003c\/strong\u003e Uses reactive DC and RF sputtering to produce TiN, CrN, TiAlN, and DLC films on cutting tools, molds, and mechanical components.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnergy Device Research:\u003c\/strong\u003e Sputters transparent conductive oxides, barrier layers, and metallic contacts for research on thin-film solar cells, fuel cells, and energy storage devices.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterials Science and Alloy Film Research:\u003c\/strong\u003e Runs multi-target and co-sputtering of alloys, compound films, and mixed oxides for compositional studies and structure-property research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectronics and RF Component Coating:\u003c\/strong\u003e Applies DC sputtering of Au, Al, Ti, and other conductive metals for electronics packaging, RF connectors, and precision component metallization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University PVD Laboratories:\u003c\/strong\u003e Offers a flexible multi-source platform for teaching and materials research across a wide range of thin film deposition materials and techniques.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a1_1.webp?v=1793009559\" alt=\"Magnetron Sputtering System - ToronSputter™ Mag\"\u003e\u003c\/p\u003e\n\u003ch2\u003eMagnetron Sputtering System: ToronSputter™ Mag Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ Mag combines DC and RF magnetron sputtering with three-channel MFM gas control, LabVIEW layer automation, and capacitance manometer plasma pressure monitoring. Together, these capabilities form a multi-target, high-vacuum sputtering platform.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 4 DC\/RF Magnetron Sputter Sources (1\" to 4\" Targets):\u003c\/strong\u003e A layout configurable from one to four sources supports single-material, co-sputtered, and sequenced multi-layer thin film deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC Power Supply (0 to 1000 V, 2000 W):\u003c\/strong\u003e This high-power supply drives conductive target sputtering, with deposition rate set through voltage control.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRF Power Supply (13.56 MHz, 300 to 1200 W):\u003c\/strong\u003e The RF range suits insulating target sputtering as well as reactive oxide and nitride processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e3-Channel MFM Gas Control (Ar, N₂, O₂, He, CH₄, H₂):\u003c\/strong\u003e Three independent gas channels offer real-time electronic control and display for inert and reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdditional Capacitance Manometer for Plasma Pressure:\u003c\/strong\u003e A dedicated capacitance manometer delivers precise plasma pressure measurement during reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, and Isolation Valves, 1 to 100 mTorr Precision:\u003c\/strong\u003e These valves allow accurate working pressure adjustment, supporting reactive process gas control and plasma stability.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁸ Torr Base Pressure, 2×10⁻⁶ Torr in 20 Minutes:\u003c\/strong\u003e A turbomolecular pump paired with a mechanical pump provides fast pump-down to working vacuum. Cryo and dry pumps are available as options.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control spans atmospheric pressure to deep vacuum, covering both process gas and base pressure monitoring.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLabVIEW-Based Layer-by-Layer Deposition Control:\u003c\/strong\u003e PC-based LabVIEW automation manages each deposition layer independently, supporting complex multi-layer process sequences.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Measurement with 1 to 4 QCMs:\u003c\/strong\u003e Scalable multi-sensor monitoring tracks thickness and rate across up to four QCM channels at the same time.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 700 °C PID Substrate Heating:\u003c\/strong\u003e PID-controlled substrate temperature management enables deposition at elevated temperatures, benefiting film crystallinity and adhesion.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Sample Rotation:\u003c\/strong\u003e Adjustable substrate rotation promotes uniform film thickness across the substrate surface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSample Plasma Cleaning Unit (RF via Substrate Biasing):\u003c\/strong\u003e In-situ RF plasma cleaning removes native surface oxides before deposition without breaking vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Start-Stop Closed-Loop Water Cooling:\u003c\/strong\u003e Thermal management switches cooling on and off based on system state, protecting the sources and chamber throughout operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Hold with Isolation Valve:\u003c\/strong\u003e The main chamber remains under vacuum when idle, shortening pump-down time between successive experiments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (30 to 60 cm, Prismatic or Cylindrical):\u003c\/strong\u003e Clean, electro-polished inner surfaces come in several box size options with an SS304 liner.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable port selection offers flexible integration of feedthroughs, gauges, and process gas lines.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInternal Lighting and 120 °C Baking Capability:\u003c\/strong\u003e Internal lighting enables chamber inspection, while baking supports conditioning and residual moisture removal.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFront Viewing Window with Rotatable Shutter:\u003c\/strong\u003e The window gives direct visual access for process monitoring, and the rotatable shutter allows precise deposition timing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer Control with Touch Screen Panel:\u003c\/strong\u003e A touch screen and real-time LCD displays manage all system operations automatically throughout the process.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5-Hour Experiment Cycle Time:\u003c\/strong\u003e Fast pump-down and a short process cycle support consistent multi-run throughput for research and production programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e75×120 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e The compact footprint passes through standard doorways and can be repositioned within the facility.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Annual coverage applies to system components, design, and manufacturing quality.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eMagnetron Sputtering System: ToronSputter™ Mag Theory and Method\u003c\/h2\u003e\n\u003cp\u003eIn magnetron sputtering, a process gas is ionized and the resulting ions strike a cathode target, knocking atoms loose so they condense on the substrate as a thin film. A magnetic field holds the plasma close to the target face, which raises ion density and sputtering yield even at low working pressures. DC power, applied at 0 to 1000 V, handles conductive targets. RF power at 13.56 MHz dissipates the charge that accumulates on insulators, extending the range of usable materials to oxides, nitrides, and dielectric films produced from ceramic targets.\u003c\/p\u003e\n\u003ch3\u003eMulti-Target and Reactive Sputtering\u003c\/h3\u003e\n\u003cp\u003eConfigurations with one to four sources allow sequential deposition within a single pump-down cycle, which reduces contamination between material layers. Co-sputtering from sources powered at the same time produces composition-graded and alloy films without separate deposition steps. In reactive sputtering, N₂ or O₂ enters through MFM-controlled inputs while a metallic target is sputtered, forming nitride or oxide films without the need for compound targets. Throttle valve and capacitance manometer control keep plasma pressure stable across the 1 to 100 mTorr reactive process window.\u003c\/p\u003e\n\u003ch3\u003eAutomation, Substrate Preparation, and Growth Control\u003c\/h3\u003e\n\u003cp\u003eLabVIEW automation manages the complete layer sequence, controlling shutter timing, power levels, and gas flow at each step with no operator intervention between layers. RF plasma cleaning via substrate biasing removes native oxides before deposition, improving adhesion at the film-substrate interface. PID substrate heating at 50 to 700 °C promotes film crystallinity and surface diffusion during growth. Between runs, the isolation valve keeps the main chamber under vacuum, eliminating pump-down overhead for successive depositions.\u003c\/p\u003e\n\u003ch2\u003eMagnetron Sputtering System - ToronSputter™ Mag Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eDC Power Supply\u003c\/td\u003e\n\u003ctd\u003e0 to 1000 V DC, 2000 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRF Power Supply\u003c\/td\u003e\n\u003ctd\u003e13.56 MHz, 300 to 1200 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNumber of Sputtering Sources\u003c\/td\u003e\n\u003ctd\u003e1 to 4 (DC\/RF)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTarget Diameters\u003c\/td\u003e\n\u003ctd\u003e1\", 2\", 3\", 4\"\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum (Pump-Down Time)\u003c\/td\u003e\n\u003ctd\u003e2×10⁻⁶ Torr in 20 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (cryo and dry pump as options)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputter Working Pressure Range\u003c\/td\u003e\n\u003ctd\u003e1 to 100 mTorr (throttle valve controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Pressure Measurement\u003c\/td\u003e\n\u003ctd\u003eAdditional capacitance manometer\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic or cylindrical); electro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Sizes\u003c\/td\u003e\n\u003ctd\u003e30\/40\/50\/60 cm box size\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eFront viewing window; rotatable shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInternal Lighting\u003c\/td\u003e\n\u003ctd\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBaking Capability\u003c\/td\u003e\n\u003ctd\u003eUp to 120 °C (internal)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂, He, CH₄, H₂; 3-channel MFM; real-time electronic display\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eThrottle, vent, and isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heating\u003c\/td\u003e\n\u003ctd\u003e50 to 700 °C (PID controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning\u003c\/td\u003e\n\u003ctd\u003eRF plasma via substrate biasing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s precision; 1 to 4 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; touch screen panel; real-time LCD; LabVIEW\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic start-stop closed-loop water cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Cycle Time\u003c\/td\u003e\n\u003ctd\u003e1.5 hours\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard doorways\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280235266287,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/magnetron-sputtering-system-toro.webp?v=1793009526","url":"https:\/\/shop.torontech.com\/fr\/products\/magnetron-sputtering-system-toronsputter-mag","provider":"Torontech","version":"1.0","type":"link"}