{"product_id":"load-lock-magnetron-sputtering-system","title":"Load-Lock Magnetron Sputtering System","description":"\u003ch2\u003eLoad-Lock Magnetron Sputtering System – ToronSputter™ SD\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ SD is a sputter-down load-lock magnetron sputtering system built for high-throughput PVD in both research and production settings, particularly where the main chamber vacuum must stay intact between sample exchanges. A dedicated pump brings the load-lock down to 10⁻⁶ Torr in 10 minutes, so samples can be swapped continuously without venting the main chamber, which maintains a 10⁻⁸ Torr base pressure. A magnetic-arm transfer mechanism handles loading and unloading of 2\", 3\", 4\", and 6\" substrates. This fast cycle time makes it possible to run 20 to 30 experiments per day.\u003c\/p\u003e\n\u003ch3\u003eSputter-Down Guns and Process Capabilities\u003c\/h3\u003e\n\u003cp\u003eSputter-down guns are offered in RF and DC configurations with diameters from 1 to 6 inches, featuring flex-head rotation and compression seals. The system deposits conductive materials such as Au, Al, Ti, and Ni, as well as insulating materials such as MgO, TiO₂, SiO₂, and TiN, at high deposition rates under recipe control. Digital MFC gas inlets with 0.1 sccm sensitivity deliver Ar, N₂, O₂, He, and CH₄, supporting both inert and reactive sputtering. PID-controlled substrate heating covers 50 to 600 °C with ±1 °C stability, enabling deposition onto heated substrates.\u003c\/p\u003e\n\u003ch3\u003eThermal Evaporation, Monitoring, and Control\u003c\/h3\u003e\n\u003cp\u003eThermal evaporation is available through sequential thermal sources rated from 8V to 500A and 5000W. Their design prevents cross-contamination and allows materials and sources to be replaced easily. A dual-channel thickness controller with two QCMs monitors deposition rate with 0.1 Å\/s precision. The system also provides sample rotation from 2 to 30 rpm and DC\/RF plasma cleaning. Pressure control holds the working pressure at target values using downstream and upstream flow control. Operation is available from either a computer or a control panel, both with real-time LCD displays, and LabVIEW manages shutter and thickness sequences.\u003c\/p\u003e\n\u003ch2\u003eLoad-Lock Magnetron Sputtering System – ToronSputter™ SD Applications\u003c\/h2\u003e\n\u003ch3\u003eWhere the ToronSputter™ SD Performs\u003c\/h3\u003e\n\u003cp\u003eThe ToronSputter™ SD supports high-throughput PVD research and production environments where main chamber vacuum integrity, substrate cleanliness, and experiment cycle time are all top priorities. Its load-lock architecture and sputter-down configuration suit multi-layer coating programs as well as research work that calls for frequent substrate changes.\u003c\/p\u003e\n\u003ch3\u003eKey Application Areas\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Throughput PVD Research Facilities:\u003c\/strong\u003e Run multiple substrate depositions each day without venting the main chamber, supporting iterative thin film research with fast sample turnover.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor and Microelectronics Fabrication:\u003c\/strong\u003e Perform sputter-down deposition of metal contacts, barrier layers, and dielectric films on 2\" to 6\" wafers under a clean, continuously maintained vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Tool Surface Engineering:\u003c\/strong\u003e Apply reactive sputtering of TiN, CrN, TiAlN, and DLC coatings to cutting tools and molds at high deposition rates with recipe-controlled processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Production:\u003c\/strong\u003e Deposit TiO₂, SiO₂, and other optical coatings, using downstream and upstream pressure control to achieve stoichiometric reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectronics and RF Component Coating:\u003c\/strong\u003e Use DC and RF sputter deposition of Au, Al, Ti, and other conductors for electronics, RF packaging, and precision connector metallization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Research Programs:\u003c\/strong\u003e Benefit from a flexible multi-source platform for materials science, device physics, and surface engineering research, with rapid load-lock sample exchange.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMedical Device and Implant Coating:\u003c\/strong\u003e Sputter TiN, DLC, and biocompatible metallic films under clean vacuum with recipe-controlled process sequences.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-1-973038565_1.webp?v=1793002455\" alt=\"Load-Lock Magnetron Sputtering System\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-2-701422218.webp?v=1793002438\" alt=\"Load-Lock Magnetron Sputtering System\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eLoad-Lock Magnetron Sputtering System – ToronSputter™ SD Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ SD combines a load-lock sample exchange system, sputter-down gun configuration, MFC gas control, and PID substrate heating on a high-vacuum platform built for high-throughput research and production sputtering.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-3-1735877884.webp?v=1793002437\" alt=\"Load-Lock Magnetron Sputtering System\"\u003e\u003c\/p\u003e\n\u003ch3\u003eVacuum and Sample Handling\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eDedicated Load-Lock Pump, 10⁻⁶ Torr in 10 Minutes:\u003c\/strong\u003e A separate pumping system evacuates the load-lock independently, so samples can be introduced without disturbing the main chamber vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁸ Torr Main Chamber Base Pressure:\u003c\/strong\u003e A turbomolecular and mechanical pump combination, with a dry pump option, reaches the base pressure needed for high-purity magnetron sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMagnetic Arm Sample Transfer, 2\" to 6\" Substrates:\u003c\/strong\u003e The magnetic arm loads and unloads substrates from 2\" to 6\" in diameter, providing flexible substrate compatibility.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e20 to 30 Experiments Per Day Throughput:\u003c\/strong\u003e The load-lock architecture allows rapid sample exchange and shortens the time between depositions, supporting high-volume research and production programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control spans the full pressure range, covering both process gas and deep base vacuum monitoring.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, Isolation, and Gate Valve Configuration:\u003c\/strong\u003e A comprehensive valve set manages every pressure transition, and the isolation valve keeps the main chamber under vacuum when idle.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSputtering Sources and Deposition\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 6-Inch RF and DC Sputter Guns with Flex-Head Rotation:\u003c\/strong\u003e A wide range of gun diameters, along with self-axis rotation and compression seals, provides flexible target configuration and reliable vacuum sealing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eConductor and Insulator Deposition at High Rates:\u003c\/strong\u003e Recipe-controlled, high-rate sputtering deposits conductors (Au, Al, Ti, Ni) and insulators (MgO, TiO₂, SiO₂, TiN).\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDigital MFC Gas Inputs (Ar, N₂, O₂, He, CH₄) at 0.1 sccm Sensitivity:\u003c\/strong\u003e Mixed gas delivery with digital flow control supports both inert and reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDownstream and Upstream Pressure Control:\u003c\/strong\u003e Working pressure can be fixed at desired values through downstream or upstream mass flow control, enabling precise reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 600 °C PID Substrate Heating with ±1 °C Sensitivity:\u003c\/strong\u003e Closed-loop temperature control supports deposition on heated substrates across a wide range, benefiting film crystallinity and adhesion.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Sample Rotation with DC\/RF Plasma Cleaning:\u003c\/strong\u003e Adjustable substrate rotation with PC speed control is paired with DC\/RF plasma cleaning to remove native oxides before deposition.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eThermal Evaporation and Thickness Monitoring\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e8V to 500A, 5000W Thermal Sources for Co-Evaporation:\u003c\/strong\u003e High-power sequential and co-evaporation thermal sources feature a design that prevents cross-contamination and allows easy material replacement.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Monitoring with Two QCMs:\u003c\/strong\u003e Two independent channels measure deposition rate and cumulative thickness simultaneously with high precision.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLoad-Lock Adaptable to E-Beam and Thermal Source Systems:\u003c\/strong\u003e The load-lock architecture can be configured for platforms that combine magnetron sputtering with e-beam and thermal evaporation sources.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eChamber Design and Configuration\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (Prismatic or Cylindrical) with Electro-Polished Surfaces:\u003c\/strong\u003e The feather-touch, electro-polished interior includes an SS304 liner, and water-cooled chamber surfaces are available when needed.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-Inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable port selection allows upgrades with additional thermal and sputtering sources without modifying the chamber.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eUV-Blocking Observation Window with LabVIEW Shutter Control:\u003c\/strong\u003e A rotatable door shutter handles process timing, and LabVIEW manages the sample shutter and thickness control integration.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eAutomation, Safety, and Support\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer and Panel Control with LCD Displays:\u003c\/strong\u003e All deposition operations run automatically under computer control, with panel override and real-time LCD status.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInterlock-Protected Automatic Water Cooling:\u003c\/strong\u003e Closed-loop water cooling switches on and off automatically, and an interlock blocks sputtering or evaporation unless coolant is flowing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTwo-Year Warranty for Materials, Design, and Workmanship:\u003c\/strong\u003e Comprehensive two-year coverage applies to system components, design, and manufacturing quality.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eLoad-Lock Magnetron Sputtering System – ToronSputter™ SD Theory and Method\u003c\/h2\u003e\n\u003ch3\u003eLoad-Lock Principle\u003c\/h3\u003e\n\u003cp\u003eA load-lock is a small, separately pumped antechamber that lets substrates move in and out without exposing the main process chamber to atmospheric pressure. In conventional systems, the entire main chamber is vented to atmosphere for every sample change, and a full pump-down cycle must finish before each deposition run. A load-lock uses gate valves to isolate the two vacuum spaces, so the main chamber stays at base pressure while samples are loaded and removed. As a result, the time between consecutive depositions drops from hours to minutes, which makes 20 to 30 experiments per day possible.\u003c\/p\u003e\n\u003ch3\u003eSputter-Down Magnetron Sputtering\u003c\/h3\u003e\n\u003cp\u003eIn a sputter-down magnetron configuration, the targets sit above the substrate and sputtered atoms travel downward, which limits particulate contamination from falling debris. Sputter-up configurations work the other way: gravity pulls target flakes and loose particles straight onto the growing film surface. The magnetron's magnetic field confines the plasma close to the target face, improving sputtering efficiency and supporting high deposition rates at low working pressures. DC power handles conductive targets, while RF power at 13.56 MHz extends the process to insulating materials.\u003c\/p\u003e\n\u003ch3\u003eVacuum, Cooling, and Evaporation Support\u003c\/h3\u003e\n\u003cp\u003eThe main chamber reaches a 10⁻⁸ Torr base pressure using a turbomolecular and mechanical pump combination, and a separate pump brings the load-lock down to 10⁻⁶ Torr in 10 minutes. Throttle, vent, isolation, and gate valves govern every pressure transition, and the isolation valve keeps the main chamber under continuous vacuum. A water-cooling system with an automatic on-off interlock prevents the sputtering guns or thermal sources from operating without active coolant flow. Thermal sources rated from 8V to 500A and 5000W enable co-evaporation and sequential multi-material deposition within the same run.\u003c\/p\u003e\n\u003ch2\u003eLoad-Lock Magnetron Sputtering System - ToronSputter™ SD Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eMain Chamber Base Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLoad-Lock Vacuum Level\u003c\/td\u003e\n\u003ctd\u003e10⁻⁶ Torr in 10 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (dry pump optional); dedicated load-lock pump\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eThrottle, vent, isolation, and gate valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic or cylindrical); electro-polished; SS304 liner\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Surface Cooling\u003c\/td\u003e\n\u003ctd\u003eWater-cooled surfaces (when needed)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eUV-blocking; rotatable door shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Configuration\u003c\/td\u003e\n\u003ctd\u003eSputter-down\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Guns\u003c\/td\u003e\n\u003ctd\u003e1 to 6 inches; RF and DC; flex-head; self-axis rotation; compression seal\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Transfer\u003c\/td\u003e\n\u003ctd\u003eMagnetic transfer arm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Sizes\u003c\/td\u003e\n\u003ctd\u003e2\", 3\", 4\", 6\"\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heating\u003c\/td\u003e\n\u003ctd\u003e50 to 600 °C (PID controlled, ±1 °C)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm (PC controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning\u003c\/td\u003e\n\u003ctd\u003eDC\/RF plasma\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂, He, CH₄ and others; digital MFC; 0.1 sccm sensitivity\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePressure Control Method\u003c\/td\u003e\n\u003ctd\u003eDownstream and upstream flow control\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s precision; 2 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Sources\u003c\/td\u003e\n\u003ctd\u003e8V to 500A, 5000W (sequential and co-evaporation)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling (interlock protected)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; panel control; real-time LCD; LabVIEW\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Throughput\u003c\/td\u003e\n\u003ctd\u003e20 to 30 experiments per day\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e2 years (materials, design, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279703507183,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/load-lock-magnetron-sputtering-s.webp?v=1793002375","url":"https:\/\/shop.torontech.com\/es\/products\/load-lock-magnetron-sputtering-system","provider":"Torontech","version":"1.0","type":"link"}