{"product_id":"hybrid-pvd-deposition-system","title":"Hybrid PVD Deposition System","description":"\u003ch2\u003eHybrid PVD Deposition System – ToronPVD™ DS\u003c\/h2\u003e\n\u003ch3\u003eCombined Thermal Evaporation and Magnetron Sputtering System\u003c\/h3\u003e\n\u003cp\u003eThe ToronPVD™ DS is a hybrid PVD deposition system that places four-channel thermal evaporation and DC\/RF magnetron sputtering inside a single SS304L chamber. It is designed for multilayer thin film deposition and co-deposition research. Four thermal sources rated from 10V to 250A, built around a proprietary boxed co-evaporation design, run alongside DC\/RF sputtering sources in 1, 2, and 3-inch configurations. The system reaches a base pressure of 10⁻⁸ Torr, and a loaded chamber pumps down to 10⁻⁷ Torr within one hour. A 1.5-hour cycle and LabVIEW touch screen control make four to six experiments per day possible.\u003c\/p\u003e\n\u003cp\u003eRF (13.6 MHz, 300 to 1200 W) and DC (0 to 1000 V, 2000 W) power supplies handle both insulating and conductive targets in every deposition mode. A digital MFC regulates Ar, N₂, O₂, He, CH₄, and H₂ at 0.1 SCCM, enabling reactive oxide and nitride deposition. Working pressure is tightly controlled from 1 to 100 mTorr for stable plasma generation. An optional PID heater, operating from 50 to 700 °C (±1 °C), accommodates 3\", 4\", and 6\" wafers.\u003c\/p\u003e\n\u003cp\u003eA dual-channel thickness controller supports 1 to 4 QCMs at 0.1 Å\/s precision and tracks deposition rate and cumulative thickness across both thermal and sputtering sources. Optional ICP, CCP, and DC-RF plasma cleaning can prepare the substrate before deposition. The SS304L chamber is available in prismatic or cylindrical form and features electro-polished surfaces, standard 1\", QF, CF, and ISO feedthrough ports, a UV-blocking observation window, and a rotatable shutter. At L120×W80×H180 cm, the system rolls on lockable wheels and fits through standard doorways.\u003c\/p\u003e\n\u003ch2\u003eHybrid PVD Deposition System – ToronPVD™ DS Applications\u003c\/h2\u003e\n\u003cp\u003eThe ToronPVD™ DS is built for research and production PVD laboratories that need thermal evaporation and magnetron sputtering in the same vacuum system. Running both deposition modes within one pump-down cycle shortens processing time and protects interface cleanliness. Its four-source co-evaporation capability and configurable sputtering guns make it a strong fit for heterogeneous multilayer and alloy film research programs.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eMultilayer Organic\/Inorganic Device Research:\u003c\/strong\u003e Deposit organic or metallic layers by thermal evaporation, then sputtered oxide or nitride films, all in one vacuum cycle with no venting between layers.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOLED and Organic Device Fabrication:\u003c\/strong\u003e Thermally evaporate organic emitter and transport layers, then add sputter-deposited conductive contact films for OLED and OPV device development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCo-Evaporation Alloy and Compound Film Research:\u003c\/strong\u003e Run multiple thermal sources at the same time to co-evaporate composition-controlled alloy and compound films that demand precise multi-material flux control.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Multi-Material Stack Research:\u003c\/strong\u003e Combine reactive sputtering of nitride and oxide films with thermally evaporated metallic seed or functional layers on a single deposition platform.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor Device Prototyping:\u003c\/strong\u003e Deposit metal contacts by thermal evaporation and dielectric films by RF sputtering on wafer substrates up to 6 inches, all in one pump-down session.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Research:\u003c\/strong\u003e Pair thermally evaporated metallic reflector layers with reactive RF-sputtered oxide coatings to build optical filter, anti-reflective, and mirror film stacks.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Multi-Source PVD Research:\u003c\/strong\u003e Give research programs a flexible platform for evaporation and sputtering without switching tools between deposition steps.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHybrid PVD Deposition System – ToronPVD™ DS Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronPVD™ DS brings together four-source thermal co-evaporation, DC\/RF magnetron sputtering, MFC gas control, PLC automation, and dual-channel thickness monitoring on one high-vacuum platform for multilayer and multi-material thin film research.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eFour 10V to 250A Thermal Sources in a 2×2 Co-Evaporation Configuration:\u003c\/strong\u003e High-current co-evaporation sources in a proprietary boxed design that prevents cross-contamination and makes boat and basket replacement easy.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eProprietary Boxed Source Design:\u003c\/strong\u003e The enclosed source geometry keeps evaporant from reaching neighboring crucibles, preserving composition purity in co-deposited films.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC\/RF Sputtering Sources (1\", 2\", 3\"), 85 mm Flex-Head Design:\u003c\/strong\u003e Handles magnetic and non-magnetic target materials, with a flex-head that allows flexible mounting and target alignment at every source position.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRF Power Supply (13.6 MHz, 300 to 1200 W):\u003c\/strong\u003e Supports insulating targets and reactive sputtering of oxide and nitride films at both research and production power levels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC Power Supply (0 to 1000 V, 2000 W):\u003c\/strong\u003e A high-power DC supply for sputtering metallic targets and for powering thermal co-evaporation sources.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁸ Torr Base Pressure, 10⁻⁷ Torr in One Hour (Loaded):\u003c\/strong\u003e A turbomolecular and mechanical pump stack, with cryo and dry pump options, delivers the rapid pump-down behind the 1.5-hour experiment cycle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e One measurement system spans the full pressure range needed for both thermal evaporation and sputtering deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePrecise Plasma Pressure Control (1 to 100 mTorr):\u003c\/strong\u003e Independent pressure setting maintains stable plasma conditions during sputtering and reactive deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDigital MFC Gas Control (Ar, N₂, O₂, He, CH₄, H₂) at 0.1 SCCM Sensitivity:\u003c\/strong\u003e Six-gas MFC delivery supports inert and reactive deposition in both evaporation and sputtering modes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Monitoring with 1 to 4 QCMs:\u003c\/strong\u003e Measures rate and thickness simultaneously and precisely across active thermal and sputtering source channels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional 50 to 700 °C PID Substrate Heater (±1 °C):\u003c\/strong\u003e Controls substrate temperature to support film crystallinity and adhesion, and works with 3\", 4\", and 6\" wafers as well as 1 to 10 cm sample attachments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Sample Rotation:\u003c\/strong\u003e Continuously adjustable rotation promotes uniform film thickness across the substrate surface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional ICP, CCP, and DC-RF Substrate Plasma Cleaning:\u003c\/strong\u003e Prepares the substrate surface in situ before deposition, without breaking vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Closed-Loop Water Cooling with Interlock:\u003c\/strong\u003e Thermal management blocks source operation unless coolant is flowing, protecting plasma sources and thermal source assemblies.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, and Isolation Valve Configuration:\u003c\/strong\u003e Enables precise process pressure management, and the isolation valve lets the chamber hold vacuum between experiments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304L Chamber (Prismatic or Cylindrical) with Electro-Polished Surfaces:\u003c\/strong\u003e Exceptionally clean surfaces and standard 1\", QF, CF, and ISO feedthrough ports allow flexible integration.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInternal Lighting, 100 °C Baking, UV-Blocking Window, and Rotatable Shutter:\u003c\/strong\u003e A complete set of chamber accessories for process monitoring, conditioning, and moisture removal.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEasily Upgradeable with Additional Thermal and Sputtering Sources:\u003c\/strong\u003e The modular architecture lets you add sources as research requirements grow.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLabVIEW Touch Screen Control with Full Panel Backup:\u003c\/strong\u003e Automates sequence management for all source, gas, vacuum, and rotation functions, with a manual panel backup always available.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5-Hour Experiment Cycle, 4 to 6 Experiments Per Day:\u003c\/strong\u003e Fast pump-down and process cycles support multiple runs each day.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eL120×W80×H180 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e A full-size combined system whose footprint still passes through standard doorways, allowing flexible laboratory placement.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Annual coverage for system components, design quality, and manufacturing.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp\u003eThermal evaporation and magnetron sputtering each suit material classes and deposition conditions the other cannot match, so combining them in one chamber is practical for complex multilayer device structures. Thermal evaporation heats a resistive source until it vaporizes, producing a clean metallic or organic flux well suited to contact metals and organic emitters. Magnetron sputtering uses plasma to eject atoms from a solid target, covering refractory metals, oxides, and nitrides. Performing both in a single vacuum cycle removes air-exposure contamination at organic-inorganic and metal-dielectric interfaces.\u003c\/p\u003e\n\u003cp\u003eFour thermal sources in a 2×2 co-evaporation configuration permit simultaneous multi-material deposition for alloy, composition-graded, and compound films. The proprietary boxed source design prevents cross-contamination between neighboring crucibles and simplifies source material replacement. DC\/RF sputtering in 1, 2, and 3-inch flex-head configurations handles magnetic and non-magnetic targets alongside the thermal sources. A dual-channel thickness controller with 1 to 4 QCMs tracks the combined deposition at 0.1 Å\/s across all active sources.\u003c\/p\u003e\n\u003cp\u003eThe turbomolecular and mechanical pump combination achieves a base pressure of 10⁻⁸ Torr and reaches 10⁻⁷ Torr within one hour in a loaded chamber. Wide-range vacuum control from 1000 to 10⁻⁹ Torr, together with precise 1 to 100 mTorr pressure control for plasma generation, covers every operating condition. LabVIEW touch screen control with full panel backup manages source power, gas, vacuum, and rotation sequences. An optional ICP, CCP, or DC-RF plasma cleaning unit readies substrate surfaces before deposition.\u003c\/p\u003e\n\u003ch2\u003eHybrid PVD Deposition System - ToronPVD™ DS Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eRF Power Supply\u003c\/td\u003e\n\u003ctd\u003e13.6 MHz, 300 to 1200 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDC Power Supply\u003c\/td\u003e\n\u003ctd\u003e0 to 1000 V DC, 2000 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum (Loaded, 1 hour)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (cryo and dry pump as options)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Pressure Range\u003c\/td\u003e\n\u003ctd\u003e1 to 100 mTorr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Evaporation Sources\u003c\/td\u003e\n\u003ctd\u003e4 (10V to 250A; 2×2 co-evaporation configuration)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSource Design\u003c\/td\u003e\n\u003ctd\u003eProprietary boxed (cross-contamination prevention)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Sources\u003c\/td\u003e\n\u003ctd\u003eDC\/RF; 1\", 2\", 3\" targets; 85 mm flex-head\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMagnetic\/Non-Magnetic Sputtering\u003c\/td\u003e\n\u003ctd\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂, He, CH₄, H₂; digital MFC; 0.1 SCCM sensitivity\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304L (prismatic or cylindrical); electro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heating (Optional)\u003c\/td\u003e\n\u003ctd\u003e50 to 700 °C (PID, ±1 °C)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWafer Compatibility\u003c\/td\u003e\n\u003ctd\u003e3\", 4\", 6\"; 1 to 10 cm sample attachments\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning (Optional)\u003c\/td\u003e\n\u003ctd\u003eICP, CCP, DC-RF\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s; 1 to 4 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInternal Baking\u003c\/td\u003e\n\u003ctd\u003eUp to 100 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eUV-blocking; rotatable shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling (interlock protected)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eLabVIEW touch screen; full panel backup\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Cycle Time\u003c\/td\u003e\n\u003ctd\u003e1.5 hours (4 to 6 experiments per day)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003eL120 × W80 × H180 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard doors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280617242863,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/hybrid-pvd-deposition-system6890.webp?v=1793018573","url":"https:\/\/shop.torontech.com\/es\/products\/hybrid-pvd-deposition-system","provider":"Torontech","version":"1.0","type":"link"}