{"title":"Sputter Coaters, Carbon Coaters \u0026 Thermal Evaporators","description":"\u003cp\u003eTorontech provides a comprehensive selection of desktop sputter coaters and vacuum coating systems designed for a range of research applications. The product lineup includes low- to high-vacuum sputter coaters, such as the DSR1 and DST1, widely used for electron microscopy sample preparation, as well as high-vacuum sputter coating and thermal evaporation systems, including the DST2-TG and DST3-T. Various optional features are available, including a plasma cleaner, to support thin film deposition for research purposes.\u003c\/p\u003e\n\u003cp\u003eOur engineering team designs and manufactures sputter coater and vacuum coating system components in accordance with high-quality standards. Prestigious universities and research centers are among our valued customers, many of whom have expressed satisfaction with this advanced range of sputter coating and vacuum coating solutions.\u003c\/p\u003e","products":[{"product_id":"spin-coaters","title":"Spin Coaters","description":"\u003ch2\u003eThin Film Coating Solutions\u003c\/h2\u003e\n\u003cp\u003eSpin coating is a go-to technique in materials science, semiconductor research, photovoltaics, and thin film technology. A liquid is dispensed onto a flat substrate and spread outward by centrifugal force, leaving a highly uniform film that can be reproduced run after run. For laboratories, universities, and industrial facilities that need controlled, repeatable thin film deposition, a spin coater is a fundamental instrument.\u003c\/p\u003e\n\u003cp\u003eThe ToronSC™ series brings together five CE-certified spin coaters that address the entire range of spin coating needs. Choices include entry-level electric units for student laboratories, programmable high-speed systems for advanced semiconductor and photovoltaic research, and large-format vacuum chuck instruments designed for 8-inch wafers. Each ToronSC™ spin coating machine is engineered for precision, reproducibility, and practical use in research and quality-control environments.\u003c\/p\u003e\n\u003cp\u003ePerhaps you need a basic spin coater for polymer film deposition, an anti-corrosion spin coating machine to handle aggressive chemical precursors, or a programmable multi-recipe system for intricate multilayer coating sequences. In every case, the ToronSC™ series offers a model matched to your application, substrate size, and process requirements.\u003c\/p\u003e\n\u003ch2\u003eReady to Configure Your Spin Coating Solution?\u003c\/h2\u003e\n\u003cp\u003eResearch laboratories, university departments, and industrial R\u0026amp;D facilities will find a full CE-certified spin coater lineup in the ToronSC™ series, suited to every thin film coating application. Get in touch with Torontech to go over substrate requirements, process chemistry, optional accessories, and pricing, and learn which ToronSC™ spin coating machine fits your workflow best.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cp\u003eToronSC™ spin coaters serve thin film deposition work in a wide spread of research and industrial disciplines:\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eSemiconductor \u0026amp; Photolithography\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003ePhotoresist coating of silicon wafers by spin coating, supporting academic and industrial photolithography research and process development\u003c\/li\u003e\n\u003cli\u003eSol-gel spin coating to form dielectric and passivation films in semiconductor device fabrication research\u003c\/li\u003e\n\u003cli\u003eAnti-reflection and protective layers applied to optical and photonic device substrates\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003ePhotovoltaics \u0026amp; Energy Research\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003ePerovskite absorber layer spin coating to support next-generation solar cell research and efficiency optimization\u003c\/li\u003e\n\u003cli\u003eElectron and hole transport layers deposited from sol-gel or nanoparticle solutions to build photovoltaic device stacks\u003c\/li\u003e\n\u003cli\u003eBattery electrode functional coating: spin coating of active material slurries and protective coatings onto current collector substrates\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eMaterials Science \u0026amp; Chemistry Research\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eMetal oxide thin films formed from sol-gel precursors for catalysis, sensing, and optoelectronic applications\u003c\/li\u003e\n\u003cli\u003ePolymer thin film coating for encapsulation, dielectric, and electroactive layer studies in printed electronics\u003c\/li\u003e\n\u003cli\u003eSpin coating of nanoparticle suspensions for functional surface modification and fabrication of nanostructured thin films\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSpecialty \u0026amp; Controlled Atmosphere Coating\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eAnti-corrosion spin coating with strong acid and alkali solutions, using the PP-chamber ToronSC™ 2000C and ToronSC™ 1000P models\u003c\/li\u003e\n\u003cli\u003eArgon-filled glovebox spin coating for atmosphere-sensitive organic, perovskite, and battery material films\u003c\/li\u003e\n\u003cli\u003eCoating of large-format substrates (up to 8\" wafers or 5\"×5\" panels) on the ToronSC™ 350P for advanced device research\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eWhy Choose the ToronSC™ Series for Your Thin Film Coating?\u003c\/h2\u003e\n\u003cp\u003eThe spin coater you pick shapes film quality, process reproducibility, operational safety, and long-term laboratory productivity. ToronSC™ spin coating machines were designed with all of these factors in mind, spanning a range of application needs and budget levels.\u003c\/p\u003e\n\u003col\u003e\n\u003cli\u003e\n\u003cp\u003eA Spin Coater for Every Application and Substrate Size\u003cbr\u003eMost suppliers offer only one or two models, so researchers end up bending their process to suit what the instrument can do. The ToronSC™ series takes a different route with five purpose-built spin coating machines, from a 4\" vacuumless electric spin coater up to a programmable 8\" large-format vacuum chuck model. Pick the instrument that suits your substrate, process chemistry, and programming needs, with nothing sacrificed.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eAnti-Corrosion Design for Aggressive Chemistry\u003cbr\u003eTypical spin coaters use aluminum chambers, which degrade quickly under strong acids, alkalis, and reactive sol-gel precursors. The ToronSC™ 2000C and ToronSC™ 1000P instead feature full polypropylene chambers that are chemically inert toward aggressive coating solutions, including the strong acid and alkali precursors used in perovskite, metal oxide, and electrolyte thin film research.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eGlovebox and Inert Atmosphere Compatibility\u003cbr\u003eA number of ToronSC™ models are built to run inside a glovebox under argon or nitrogen. This lets you coat atmosphere-sensitive and moisture-sensitive materials without exposing the substrate or solution to ambient humidity or oxygen. The ToronSC™ 1000P also comes with a built-in gas inlet port on its cover, so the atmosphere can be controlled without a full glovebox enclosure.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eProgrammable Multi-Step Spin Coating Recipes\u003cbr\u003eProgramming capability peaks with the ToronSC™ 1000P, which stores 12 programs, each holding up to 6 independent speed\/time segments. Recipe storage and multi-step control at this level are critical for reproducible multilayer spin coating, photoresist profile optimization, and intricate sol-gel sequences that go beyond a simple two-step dispense-and-spread protocol.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eVacuum Chuck Fixation for Film Uniformity\u003cbr\u003eFour of the five ToronSC™ models hold the substrate with a vacuum chuck, keeping it firmly centered throughout the full spin cycle. Because the substrate cannot shift, centrifugal-force-induced warping is reduced and the substrate stays level during coating. Each of these effects translates directly into better film thickness uniformity across the substrate.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eCE Certified Across the Full Series\u003cbr\u003eEvery ToronSC™ spin coater is CE certified, confirming compliance with European safety, electromagnetic compatibility, and environmental protection requirements. This certification supports use in regulated laboratory and industrial environments across North America, Europe, and international markets, and offers reassurance about product quality and design standards.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cp\u003eComplete Ready-to-Use Packages\u003cbr\u003eEach ToronSC™ spin coating machine is delivered as a complete package with an oilless vacuum pump, suitable vacuum chucks, a 20 mL syringe, a wastewater filter, and every connection needed, so it is ready to go on arrival without sourcing further accessories. Optional accessories, including heating covers, additional chuck sizes, and centering tools, expand what the instrument can do as your application requirements grow.\u003c\/p\u003e\n\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003ch2\u003eProduct Comparison\u003c\/h2\u003e\n\u003cp\u003eThe table below provides a side-by-side comparison of all five ToronSC™ spin coater models. Use the 'Best For' column to match the right spin coating machine to your application.\u003c\/p\u003e\n\u003ctable class=\"table\" border=\"1\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eModel\u003c\/th\u003e\n\u003cth\u003eProduct Name\u003c\/th\u003e\n\u003cth\u003eMax Substrate\u003c\/th\u003e\n\u003cth\u003eSpeed Range\u003c\/th\u003e\n\u003cth\u003ePrograms\u003c\/th\u003e\n\u003cth\u003eChamber\u003c\/th\u003e\n\u003cth\u003eBest For\u003c\/th\u003e\n\u003cth\u003eCE\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eToronSC™ 100\u003c\/td\u003e\n\u003ctd\u003eElectric Spin Coater\u003c\/td\u003e\n\u003ctd\u003e4\" (100 mm)\u003c\/td\u003e\n\u003ctd\u003e500–8,000 rpm\u003c\/td\u003e\n\u003ctd\u003eAdjustable\u003c\/td\u003e\n\u003ctd\u003eAluminum\/PP disk\u003c\/td\u003e\n\u003ctd\u003eEntry-level; vacuumless; glovebox Ar use\u003c\/td\u003e\n\u003ctd\u003e✓\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eToronSC™ 350\u003c\/td\u003e\n\u003ctd\u003eVacuum Spin Coater\u003c\/td\u003e\n\u003ctd\u003e4\" (100 mm)\u003c\/td\u003e\n\u003ctd\u003e500–8,000 rpm\u003c\/td\u003e\n\u003ctd\u003e2 segments\u003c\/td\u003e\n\u003ctd\u003eAluminum cast \/ PP disk\u003c\/td\u003e\n\u003ctd\u003eStandard lab vacuum spin coating; sol-gel \u0026amp; photoresist\u003c\/td\u003e\n\u003ctd\u003e✔\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eToronSC™ 350P\u003c\/td\u003e\n\u003ctd\u003eProgrammable Vacuum Spin Coater\u003c\/td\u003e\n\u003ctd\u003e8\" (200 mm) \/ 5\"×5\"\u003c\/td\u003e\n\u003ctd\u003e500–6,000 rpm\u003c\/td\u003e\n\u003ctd\u003e2 segments\u003c\/td\u003e\n\u003ctd\u003ePolypropylene (PP)\u003c\/td\u003e\n\u003ctd\u003eLarge wafer \u0026amp; panel coating; sol-gel; optional heating\u003c\/td\u003e\n\u003ctd\u003e✔\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eToronSC™ 1000P\u003c\/td\u003e\n\u003ctd\u003eProgrammable Hi-Speed Spin Coater\u003c\/td\u003e\n\u003ctd\u003e5\" (127 mm)\u003c\/td\u003e\n\u003ctd\u003e500–10,000 rpm\u003c\/td\u003e\n\u003ctd\u003e12 programs × 6 segments\u003c\/td\u003e\n\u003ctd\u003ePolypropylene (PP)\u003c\/td\u003e\n\u003ctd\u003eComplex multi-step recipes; semiconductor \u0026amp; PV research\u003c\/td\u003e\n\u003ctd\u003e✔\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eToronSC™ 2000C\u003c\/td\u003e\n\u003ctd\u003eAnti-Corrosion Spin Coater\u003c\/td\u003e\n\u003ctd\u003e6\" (152 mm)\u003c\/td\u003e\n\u003ctd\u003e500–8,000 rpm\u003c\/td\u003e\n\u003ctd\u003e2 segments\u003c\/td\u003e\n\u003ctd\u003ePolypropylene (PP)\u003c\/td\u003e\n\u003ctd\u003eCorrosive acid\/alkali coatings; glovebox Ar use\u003c\/td\u003e\n\u003ctd\u003e✔\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eSelect the Right ToronSC™ Spin Coater\u003c\/h2\u003e\n\u003cp\u003eUse this quick selection guide to match a spin coater to your application:\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eToronSC™ 100 — Entry-Level Electric Spin Coater\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eSelect this model for a simple, affordable spin coating machine that needs no vacuum infrastructure\u003c\/li\u003e\n\u003cli\u003eIdeal for: student labs, first-time spin coating users, and glovebox deployment for inert-atmosphere coating\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eToronSC™ 350 — Vacuum Spin Coater\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eSelect this model for standard sol-gel and photoresist spin coating on substrates 4\" and smaller, with vacuum chuck precision\u003c\/li\u003e\n\u003cli\u003eIdeal for: general-purpose research labs, university groups, and routine thin film deposition workflows\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eToronSC™ 350P — Programmable Vacuum Spin Coater\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eSelect this model for large-format spin coating of 8\" wafers or 5\"×5\" panels with sol-gel and functional coating solutions\u003c\/li\u003e\n\u003cli\u003eIdeal for: scaled-up thin film research, pilot production evaluation, and large substrate coating with optional in-situ heating\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eToronSC™ 1000P — Programmable Hi-Speed Spin Coater\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eSelect this model if your process demands multi-step programming, speeds up to 10,000 rpm, or corrosive coating chemistry\u003c\/li\u003e\n\u003cli\u003eIdeal for: advanced semiconductor research, photovoltaic absorber layers, and multilayer spin coating with complex recipes\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eToronSC™ 2000C — Anti-Corrosion Spin Coater\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eSelect this model when coating solutions are strongly acidic or alkaline, or when argon atmosphere glovebox use is needed\u003c\/li\u003e\n\u003cli\u003eIdeal for: perovskite research, metal oxide sol-gel, battery electrode coating, and other corrosive chemistry applications\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51259070873839,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/spin-coaters103795790.webp?v=1792774866"},{"product_id":"magnetron-sputtering-system","title":"Magnetron Sputtering System","description":"\u003ch2\u003eMagnetron Sputtering System\u003c\/h2\u003e\n\u003cp\u003eThe ToronSP-400 Magnetron Sputtering System is a box-type Physical Vapor Deposition (PVD) platform built around a prismatic or cylindrical vacuum chamber. It supports 1 to 4 DC\/RF sputtering sources, so multi-layered thin films can be deposited from up to four different materials in a single system.\u003c\/p\u003e\n\u003cp\u003eThe ToronVak Sputter System can be configured to match specific user requirements, making it suitable for producing multilayered nanoscale metallic, oxide, carbide, or nitride films. Compatible materials include Ni, Fe, Au, Zr, Ti, Si, SiO₂, ZnO, TiO₂, Si₃N₄, SiC, and more.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a2_dba5cdac-c630-400b-baef-baedd6cf9b0b.webp?v=1792775130\" alt=\"Magnetron Sputtering System\"\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor \u0026amp; Microelectronics\u003c\/strong\u003e – Deposits multilayer thin films for integrated circuits, sensors, and optoelectronic devices, delivering high precision and uniformity at the nanoscale.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterials Science \u0026amp; Nanotechnology\u003c\/strong\u003e – Supports the development of advanced metallic, oxide, carbide, and nitride coatings for research, prototyping, and functional material innovation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptics \u0026amp; Photonics\u003c\/strong\u003e – Produces anti-reflective, conductive, and dielectric coatings on optical components, lasers, and photonic devices to enhance performance.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnergy \u0026amp; Renewable Technologies\u003c\/strong\u003e – Creates thin-film coatings for solar cells, fuel cells, and energy storage devices, improving both efficiency and durability.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAerospace \u0026amp; Automotive Engineering\u003c\/strong\u003e – Applies wear-resistant, corrosion-resistant, and thermal barrier coatings to critical components for greater reliability under extreme conditions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSurface Engineering \u0026amp; Coating Services\u003c\/strong\u003e – Delivers precision deposition of tailored thin films on a variety of substrates for industrial applications, prototyping, and specialized contract coating projects.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eResearch \u0026amp; Development\u003c\/strong\u003e – Offers a versatile platform for universities, laboratories, and corporate R\u0026amp;D centers to explore new materials, deposition techniques, and multilayer coating processes.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures\u003c\/h2\u003e\n\u003col\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automated Touchscreen Control\u003c\/strong\u003e – Real-time LCD display for smooth, intuitive operation\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Quality Vacuum Chamber\u003c\/strong\u003e – Prismatic or cylindrical SS304 chamber with electro-polished surfaces, available in 30, 40, 50, and 60 cm sizes\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnhanced Visibility \u0026amp; Access\u003c\/strong\u003e – Front viewing window and rotatable shutter\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVersatile Connectivity\u003c\/strong\u003e – Standard 1\", QF, CF, and ISO ports\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptimized Internal Systems\u003c\/strong\u003e – Built-in lighting and a baking system reaching up to 120°C\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePower Supply Options\u003c\/strong\u003e – RF: 13.6 MHz, 300–1200 W | DC: 0–1000 V, 2000 W\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh Vacuum Performance\u003c\/strong\u003e – Base pressure of 10⁻⁸ Torr; reaches 2x10⁻⁶ Torr in 20 minutes\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdvanced Pumping System\u003c\/strong\u003e – Turbomolecular and mechanical pump, with cryo and dry pump options\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control\u003c\/strong\u003e – Precision monitoring from 1000 to 10⁻⁹ Torr\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCustomizable Sample Processing\u003c\/strong\u003e – PID-controlled heating (50–700°C) and adjustable sample rotation (2–30 rpm)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePlasma Cleaning Unit\u003c\/strong\u003e – RF plasma cleaning through RF biasing\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEfficient Cooling System\u003c\/strong\u003e – Closed-loop water cooling with automatic start-stop\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePrecision Coating Control\u003c\/strong\u003e – Dual-channel thickness rate measurement (0,1Å\/s) with 1–4 QCMs\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFlexible Sputtering Options\u003c\/strong\u003e – 1–4 DC\/RF magnetron sputter sources (1”, 2”, 3”, 4”)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eGas Flow Management\u003c\/strong\u003e – Mass flow meter-controlled inputs (Ar, N₂, O₂, He, CH₄, H₂) with 3-channel real-time control\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePressure Regulation\u003c\/strong\u003e – Throttle, vent, and isolation valves for precise pressure adjustment (1–100 mTorr)\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptimized Experiment Cycle\u003c\/strong\u003e – 1.5-hour cycle time\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Retention\u003c\/strong\u003e – Isolation valve keeps the chamber under vacuum when idle\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSmart PC Control\u003c\/strong\u003e – LabVIEW-based automation for multi-layer coatings\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdditional Precision Monitoring\u003c\/strong\u003e – Capacitance manometer for accurate plasma pressure measurement\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact \u0026amp; Mobile Design\u003c\/strong\u003e – 75x120 cm footprint with lockable wheels; fits through standard doors\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eReliable Build\u003c\/strong\u003e – One-year warranty covering design, materials, and craftsmanship\u003c\/li\u003e\n\u003c\/ol\u003e\n\u003ch2\u003eTheory of Operation\u003c\/h2\u003e\n\u003cp\u003eA magnetron sputtering system deposits thin films of metal or other materials onto a substrate. It is a core tool for coatings used in electronics, optics, tooling, and research, where film thickness and purity must be tightly controlled.\u003c\/p\u003e\n\u003ch2\u003eSputtering in a Plasma\u003c\/h2\u003e\n\u003cp\u003eThe process takes place in a vacuum chamber filled with a small amount of inert gas, typically argon. A high voltage applied to the target, which is the source material, ionizes the gas and forms a plasma. Positively charged argon ions accelerate toward the target and dislodge atoms from its surface, a process known as sputtering. These atoms cross the chamber and condense on the substrate, building up a film.\u003c\/p\u003e\n\u003ch2\u003eThe Role of the Magnetron\u003c\/h2\u003e\n\u003cp\u003eMagnets positioned behind the target generate a magnetic field that holds electrons close to the target surface. This concentrates the plasma where it is needed, increasing the sputtering rate and allowing the system to deposit films faster and at lower pressure. The outcome is a dense, uniform coating with good adhesion, produced under controlled, repeatable conditions.\u003c\/p\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51259080147183,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/magnetron-sputtering-system11200.webp?v=1792775167"},{"product_id":"desk-sputter-coater-dsr1","title":"Desk Sputter Coater- DSR1","description":"\u003ch2\u003eDSR1 Desk Sputter Coater\u003c\/h2\u003e\n\u003cp\u003eThe DSR1 Desk Sputter Coater is a compact coating system that deposits thin films of noble metals, including gold (Au), palladium (Pd), platinum (Pt) and gold\/palladium (Au\/Pd), onto non-conductive or poorly conductive specimens. It produces uniform, fine-grain films within a short cycle time.\u003c\/p\u003e\n\u003cp\u003eThe resulting coating is well suited to scanning electron microscopy (SEM) analysis. This desk magnetron coater delivers consistent, reproducible results through a fully automated process. Its ergonomic layout and small footprint make it easy to set up and simple to operate.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eScanning Electron Microscopy (SEM):\u003c\/strong\u003e Applies fine-grain conductive coatings to non-conductive samples, which reduces charging and improves image quality.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterial Science Research:\u003c\/strong\u003e Deposits even noble metal films for structural and surface analysis of polymers, ceramics and composites.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eNanotechnology:\u003c\/strong\u003e Prepares specimens with thin, uniform coatings for nanoscale characterization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLife Sciences and Biological Studies:\u003c\/strong\u003e Coats biological samples to improve contrast and stability during SEM observation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eQuality Control and Industrial R\u0026amp;D:\u003c\/strong\u003e Provides repeatable thin-film coatings for manufacturing and product testing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePlasma Cleaning Applications:\u003c\/strong\u003e Removes surface contaminants, which strengthens coating adhesion and analytical accuracy.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTeaching and Training Laboratories:\u003c\/strong\u003e Offers a dependable, easy-to-use platform for SEM sample preparation in academic settings.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eTwo-stage direct drive rotary vane pump with a 4 m³\/h capacity\u003c\/li\u003e\n\u003cli\u003eHigh-precision quartz crystal thickness monitor\u003c\/li\u003e\n\u003cli\u003eIntuitive touchscreen interface for straightforward control of the coating process and fast data entry\u003c\/li\u003e\n\u003cli\u003eUser-friendly software with network update capability\u003c\/li\u003e\n\u003cli\u003ePrecise coating rate control for finer grain structures\u003c\/li\u003e\n\u003cli\u003eManual or automatic sputtering, by time or by thickness\u003c\/li\u003e\n\u003cli\u003eGLAD sputtering capability\u003c\/li\u003e\n\u003cli\u003ePlasma cleaning function\u003c\/li\u003e\n\u003cli\u003eEasily interchangeable specimen stages (planetary rotation or rotation stage included as standard)\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty\u003c\/li\u003e\n\u003cli\u003eCE conformity for safety compliance\u003c\/li\u003e\n\u003cli\u003eWorldwide public and product liability insurance coverage, protecting against property damage or personal injury caused by Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eColor Touchscreen Control\u003c\/h2\u003e\n\u003cp\u003eThe DSR1 is equipped with a 7-inch color touchscreen that provides full automatic control and simple data entry, so even first-time users can operate it with confidence. Vacuum level, current and deposition information can be viewed as digital readouts or as curves. The system also stores data for the last 300 coatings, which you can review on the history page.\u003c\/p\u003e\n\u003ctable class=\"table\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\n\u003cfigure\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcr1.webp?v=1792775699\" alt=\"Desk Sputter Coater- DSR1\"\u003e\u003c\/figure\u003e\n\u003c\/td\u003e\n\u003ctd\u003e\n\u003cfigure\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcr2.webp?v=1792775696\" alt=\"Desk Sputter Coater- DSR1\"\u003e\u003c\/figure\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eSample Holder Options\u003c\/h2\u003e\n\u003cp\u003eThe DSR1 supports several sample stage configurations to match different requirements. The standard stage rotates and offers adjustable height and angle for easy customization. For even coverage on porous specimens, the rotary planetary stage is the recommended option.\u003c\/p\u003e\n\u003ctable width=\"100%\" style=\"width: 100.029%;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e \u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dscr11.webp?v=1792775740\" alt=\"Desk Sputter Coater- DSR1\"\u003e\n\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dscr12.webp?v=1792775741\" alt=\"Desk Sputter Coater- DSR1\"\u003e\u003c\/td\u003e\n\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003e\u003cbr\u003e\u003c\/p\u003e\n\u003ch2\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dscr1_3_11zon.webp?v=1792775659\" alt=\"Desk Sputter Coater- DSR1\"\u003e\u003c\/h2\u003e\n\u003ch2\u003ePhysical Vapor Deposition (PVD) Principles\u003c\/h2\u003e\n\u003cp\u003eIf you analyze samples by SEM or TEM every day, you know that a dependable coating system is essential for high-stakes imaging. The Torontech DSR1 Desk Sputter Coater is a budget-friendly, high-performance solution that works on the principle of Physical Vapor Deposition (PVD).\u003c\/p\u003e\n\u003cp\u003eIn this process, energized Argon ions strike a solid metal target at high speed. The impact releases tiny metal atoms, which travel across the vacuum and settle on your specimen as an even, ultra-thin coating.\u003c\/p\u003e\n\u003cp\u003eThis is known as a collision cascade. When Argon ions hit the metal target, they pass their energy along through a rapid series of impacts. Atoms at the target surface are ejected, resulting in a clean, predictable transfer of material onto the specimen being examined.\u003c\/p\u003e\n\u003ch2\u003ePlasma Generation and Magnetron Technology\u003c\/h2\u003e\n\u003cp\u003eTo accelerate these ions, the DSR1 generates a glow discharge in a low-pressure environment. Powered by a robust two-stage direct drive rotary vane pump (4 m³\/h capacity), it reaches a vacuum of less than 40 millitorr. Applying a negative charge to the metal target within the Argon-filled chamber produces a dense plasma.\u003c\/p\u003e\n\u003cp\u003eBasic DC charging is sufficient for routine SEM preparation, but the DSR1 also includes a built-in 2-inch magnetron cathode, which yields an ultra-fine, nearly invisible grain and makes the whole process more efficient. Plasma cleaning is integrated as well, clearing surface contaminants before any metal is deposited so that high-resolution imaging results are crisp and spotless.\u003c\/p\u003e\n\u003ch2\u003ePrecision Process Control\u003c\/h2\u003e\n\u003cp\u003eOperating this desk sputter coater involves adjusting a few key settings that determine deposition speed and film thickness. By fine-tuning these parameters on the intuitive 7-inch color touchscreen, you can balance top-tier coating quality with practical budget limits.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eVoltage and Current:\u003c\/strong\u003e Adjust the power input to set how forcefully the ions strike the target.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eGas Mix and Pressure:\u003c\/strong\u003e Pure Argon combined with the precise electronic leak valve helps prevent grainy or uneven coatings.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCoating Angle:\u003c\/strong\u003e Interchangeable specimen stages (such as the rotary planetary stage) and GLAD (Glancing Angle Deposition) help ensure that every microscopic recess is evenly covered.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDeposition Monitoring:\u003c\/strong\u003e The built-in high-precision quartz crystal thickness monitor supports manual or fully automatic sputtering based on exact thickness. It logs your last 300 runs and sends process curves to your PC over USB.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTarget Materials and Microscopy Optimization\u003c\/h2\u003e\n\u003cp\u003eYour microscopy results depend heavily on the noble metal installed in the DSR1's 170 mm Pyrex cylinder chamber. Covering a specimen with a thin metal layer prevents static buildup on non-conductive items and brings out surface details under the microscope.\u003c\/p\u003e\n\u003cp\u003eTargets can be swapped quickly to suit your analysis:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eGold (Au) and Gold\/Palladium (Au\/Pd):\u003c\/strong\u003e The classic choice. Both are highly conductive with a very fine texture, making them an excellent match for biological samples.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePlatinum (Pt) and Iridium (Ir):\u003c\/strong\u003e These produce an exceptionally smooth finish, which is ideal for ultra-high-resolution FE-SEM imaging.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSilver (Ag):\u003c\/strong\u003e Offers excellent conductivity for specific material science applications that call for a reflective surface without the cost of gold.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eWith metal layers applied this reliably by the DSR1 desk sputter coater, your samples are ready to reveal every fine detail.\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"deb4bd8\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003eThese specifications provide detailed information about the product's size, weight, power requirements, and key features.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eChamber dimensions: 170 mm outer diameter (OD) x 140 mm Pyrex cylinder\u003c\/li\u003e\n\u003cli\u003eOverall dimensions: 47 cm height x 46 cm width x 37 cm depth\u003c\/li\u003e\n\u003cli\u003eShipping weight (including vacuum pump): 42 kg\u003c\/li\u003e\n\u003cli\u003ePower requirements: 220V-240V, 50\/60Hz, 10A\u003c\/li\u003e\n\u003cli\u003e80 Watt DC switching power supply\u003c\/li\u003e\n\u003cli\u003eHigh-precision thickness monitor\u003c\/li\u003e\n\u003cli\u003eUltimate vacuum: Less than 40 millitorr\u003c\/li\u003e\n\u003cli\u003e2-inch magnetron cathode\u003c\/li\u003e\n\u003cli\u003eElectronic shutter\u003c\/li\u003e\n\u003cli\u003eElectronic leak valve\u003c\/li\u003e\n\u003cli\u003eData transfer via USB port for curves and sputtering process data to PC\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"1f1cc08\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch2\u003eOptions and Accessories\u003c\/h2\u003e\n\u003cdiv\u003e\n\u003cp\u003eThese are the optional accessories and components that can be used with the system.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal sensors\u003c\/li\u003e\n\u003cli\u003ePlanetary Sample Rotation\u003c\/li\u003e\n\u003cli\u003eSpare glass chamber\u003c\/li\u003e\n\u003cli\u003eSputtering targets\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51259128217839,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/desk-sputter-coater-dsr188766856.webp?v=1792775676"},{"product_id":"pld-pulsed-laser-deposition-system","title":"PLD Pulsed Laser Deposition System","description":"\u003ch2\u003ePLD Pulsed Laser Deposition System\u003c\/h2\u003e\n\u003cp\u003eThe PLD-T is a versatile high vacuum thin film deposition platform that combines Pulsed Laser Deposition with Thermal Evaporation in a single system. It deposits a broad range of materials, including complex compounds and crystalline structures, onto substrates with minimal setup.\u003c\/p\u003e\n\u003cp\u003ePulsed Laser Deposition relies on efficient non-thermal ablation, which keeps the stoichiometry of the target material intact. With this technique, the system can deposit nitrides, oxides, superlattices, polymers, and composites.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003ePulsed Laser Deposition (PLD):\u003c\/strong\u003e Delivers precise, stoichiometric transfer of complex materials such as oxides, nitrides, polymers, and composites.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCrystalline Thin Films:\u003c\/strong\u003e Supports the growth of superlattices and advanced crystalline structures for semiconductor and optoelectronic applications.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Evaporation:\u003c\/strong\u003e Handles metal and dielectric thin film deposition from boat, basket, or coil evaporation sources.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eScanning Electron Microscopy (SEM) and TEM Sample Preparation:\u003c\/strong\u003e Creates high-quality coatings on non-conductive specimens and support grids.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSpectroscopic and Structural Studies:\u003c\/strong\u003e Produces uniform thin films well suited to EDS\/WDS, EBSD, and optical characterization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThin Film Research and Development:\u003c\/strong\u003e Serves microelectronics, nanotechnology, superconductor, and solar cell investigations.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePlasma Cleaning and Substrate Preparation:\u003c\/strong\u003e Leaves surfaces free of contamination for accurate, reproducible thin film growth.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and Research Laboratories:\u003c\/strong\u003e Offers a flexible platform for teaching, advanced training, and multidisciplinary research projects.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eTarget Manipulator:\u003c\/strong\u003e Adjustable rotation speed for precise positioning.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Sources:\u003c\/strong\u003e Three thermal sources with a special feedthrough for enhanced functionality.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eReal-Time Thickness Measurement:\u003c\/strong\u003e A quartz crystal monitoring system with 1 nm precision for accurate readings.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eUser-Friendly Interface:\u003c\/strong\u003e An intuitive touch screen for simple control of the coating process and fast data entry.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePlasma Cleaning:\u003c\/strong\u003e Built-in plasma cleaning for optimal substrate preparation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eUpgradable Software:\u003c\/strong\u003e Easy-to-use software that can be updated over the network for improved performance.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSample Handling:\u003c\/strong\u003e A rotary sample holder and electronic shutter for efficient sample management.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMotorized Boat Selection:\u003c\/strong\u003e Motorized functionality for selecting and handling boat materials.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSubstrate Heating:\u003c\/strong\u003e A 500 °C substrate heater for controlled deposition processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWarranty and Insurance:\u003c\/strong\u003e A two-year system warranty, plus worldwide public and product liability insurance coverage against property damage or personal injury caused by Vac Coat systems.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/img.webp?v=1792781763\" alt=\"PLD Pulsed Laser Deposition System\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch2\u003eThermal Evaporation Sources (Boat\/Basket\/Coil)\u003c\/h2\u003e\n\u003cp\u003eThe Pulsed Laser Deposition System accommodates three independent, heat-resistant thermal evaporation sources, which can be configured as boats, baskets, or coils. These sources are built for efficient material evaporation without transferring contamination to other materials. Source holder length is adjustable from 5 to 10 cm to meet specific customer requirements.\u003c\/p\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\" style=\"width: 100.029%;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/img2.webp?v=1792781762\" alt=\"PLD Pulsed Laser Deposition System\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch2\u003eTarget Manipulator\u003c\/h2\u003e\n\u003cp\u003eThe PLD system includes a multi-target manipulator that holds three targets, each 2 cm in diameter. The targets are standard size, and every target manipulator is motorized, enabling precise target rotation and positioning throughout the deposition process.\u003c\/p\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eIntuitive Touch Screen Control with Vibrant Display\u003c\/h2\u003e\n\u003cp\u003eThe PLD-T Pulsed Laser Deposition System features a user-friendly 7-inch color touch screen that makes control and monitoring simple. The screen supports fully automatic operation and effortless data entry, so even users with limited experience can run it confidently.\u003c\/p\u003e\n\u003cp\u003eVacuum levels, current status, and deposition information appear directly on the touch screen in both digital readouts and graphical curves. A history page also stores data from the last 300 coatings for later review and analysis. This capability improves efficiency and keeps the coating workflow smooth from start to finish.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/img3.webp?v=1792781816\" alt=\"PLD Pulsed Laser Deposition System\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/img4.webp?v=1792781816\" alt=\"PLD Pulsed Laser Deposition System\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003eThese specifications outline the key components and features of the Pulsed Laser Deposition and Thermal Evaporator System, highlighting its strengths in vacuum operation, power supply, gas flow control, data analysis, and ease of use.\u003c\/p\u003e\n\u003ch2\u003eOptions and Accessories for PLD-T\u003c\/h2\u003e\n\u003cp\u003e\u003cstrong\u003eThermal Evaporation Sources\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eAvailable in boat, basket, or coil configurations to match different deposition requirements.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSubstrate Heater\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eHeats up to 500 °C for precise substrate temperature control during deposition.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eEvaporation Source Materials\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eA variety of materials are compatible with the thermal evaporation sources, giving users a wide range of deposition options.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eQuartz Crystal Sensors\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eEssential for high-precision, real-time thickness monitoring.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eSealing Gaskets\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eDesigned for effective sealing to maintain airtight conditions throughout the deposition process.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eThese options and accessories extend the versatility and functionality of the PLD-T system, allowing tailored, efficient thin film deposition while maintaining high precision and control.\u003c\/p\u003e\n\u003ch2\u003eSpecifications of Pulsed Laser Deposition \u0026amp; Thermal Evaporator System:\u003c\/h2\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cstrong\u003eVacuum System:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eHigh vacuum turbomolecular pump for efficient vacuum operation.\u003c\/li\u003e\n\u003cli\u003eDiaphragm backing pump to support the vacuum system.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003eVacuum Measurement: \u003c\/strong\u003eFull range vacuum measuring gauge to accurately measure vacuum levels.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eReal-time Thickness Measurement: \u003c\/strong\u003eQuartz crystal monitoring system with 1 nm precision for accurate measurement.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003ePower Supply: \u003c\/strong\u003e5 KW high current power supply for effective operation.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eGas Flow Control: \u003c\/strong\u003ePrecision Mass Flow meter (MFC) for precise control of gas flows.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eData Recording and Analysis: \u003c\/strong\u003eCapability to record and plot coating parameters graphs for detailed analysis.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eData Transfer: \u003c\/strong\u003eAbility to transfer curves and deposition process data to a PC via a USB port for further analysis and documentation.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eUtilities: \u003c\/strong\u003ePower Requirements: 220V-240V, 50\/60HZ, 16A.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eDimensions: \u003c\/strong\u003eBox Dimensions: 50 cm H x 60 cm W x 47 cm D.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003eWeight: \u003c\/strong\u003eShipping Weight: 70 kg.\u003c\/p\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51259219738863,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/pld-pulsed-laser-deposition-syst.webp?v=1792781587"},{"product_id":"desk-sputter-carbon-coater-dscr-300","title":"Desk Sputter \u0026 Carbon Coater – DSCR-300","description":"\u003ch2\u003eDesk Sputter \u0026amp; Carbon Coater – DSCR-300\u003c\/h2\u003e\n\u003ch3\u003eLarge-Chamber Sputtering and Carbon Coating in a Compact System\u003c\/h3\u003e\n\u003cp\u003eThe DSCR-300 is a large-chamber desk sputter coater and carbon coater that combines sputtering and carbon coating in one compact unit. It is fitted with 3-inch or 4-inch water-cooled magnetron cathodes, giving laboratories flexible options for sample preparation.\u003c\/p\u003e\n\u003ch3\u003eCoating Larger and Multiple Specimens\u003c\/h3\u003e\n\u003cp\u003eThe generous chamber suits larger samples, handling specimens up to 12 cm in diameter with a 3-inch magnetron or up to 15 cm with a 4-inch magnetron. It can also coat several smaller specimens of comparable diameter in a single run.\u003c\/p\u003e\n\u003ch3\u003eWater-Cooled Magnetrons for Extended Sputtering\u003c\/h3\u003e\n\u003cp\u003eWater-cooled magnetrons allow longer sputtering times. This makes the DSCR-300 a practical choice for depositing both thick and thin films across a wide range of applications.\u003c\/p\u003e\n\u003ch2 dir=\"ltr\" aria-level=\"4\"\u003eKey Applications\u003c\/h2\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eFine-grain deposition of noble metals, well suited to SEM and FE-SEM sample preparation\u003c\/li\u003e\n\u003cli\u003eFormation of conductive layers on specimens\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eSimple, straightforward operation\u003c\/li\u003e\n\u003cli\u003eUser-friendly software supporting both fully automatic and semi-automatic control\u003c\/li\u003e\n\u003cli\u003eIntuitive touchscreen interface for smooth control of the coating process and fast data entry\u003c\/li\u003e\n\u003cli\u003eEasy loading and unloading of specimens\u003c\/li\u003e\n\u003cli\u003eRepeatable film thickness deposition\u003c\/li\u003e\n\u003cli\u003ePrecise, reproducible coatings\u003c\/li\u003e\n\u003cli\u003eHigh-resolution fine coatings, with a grain size on the order of 2 nm for gold\u003c\/li\u003e\n\u003cli\u003eLow-voltage sputtering\u003c\/li\u003e\n\u003cli\u003eGLAD (Glancing Angle Deposition) sputtering\u003c\/li\u003e\n\u003cli\u003ePlasma cleaning\u003c\/li\u003e\n\u003cli\u003eNo cooling system needed for thin layers\u003c\/li\u003e\n\u003cli\u003eCarbon coating in both flash and pulse modes\u003c\/li\u003e\n\u003cli\u003eDual carbon fiber source for depositing thicker layers\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty for added peace of mind\u003c\/li\u003e\n\u003cli\u003eCE conformity, confirming compliance with safety standards\u003c\/li\u003e\n\u003cli\u003eWorldwide public and product liability insurance coverage, protecting against property damage or personal injury caused by Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2 dir=\"ltr\" aria-level=\"4\"\u003eSample Stages\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe large Desk Sputter and Carbon Coater provides flexible sample stage configurations, accommodating sizes up to 15 cm based on the user’s specific requirements. The stages are rotatable, offer adjustable height settings, and can be swapped out easily for added convenience.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-DSCR-300-4-Inch-Sample-Holde.webp?v=1792782313\" alt=\"Desk Sputter \u0026amp; Carbon Coater – DSCR-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-DSCR-300-2-Inch-Sample-Holde.webp?v=1792782312\" alt=\"Desk Sputter \u0026amp; Carbon Coater – DSCR-300\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003e\u003cbr\u003e\u003c\/p\u003e\n\u003ch2\u003eSEM Sample Preparation\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eNon-conductive and poorly conductive specimens typically need preparation before they can be examined under a Scanning Electron Microscope (SEM). The standard techniques for this step are sputter deposition and carbon evaporation. Our system offers fully automated operation, so even first-time users can run it with confidence. The intuitive software also displays deposition data graphically, keeping the system accessible and cost-effective.\u003c\/p\u003e\n\u003ch2 dir=\"ltr\" aria-level=\"4\"\u003eCarbon Coating Head\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe system comes with an interchangeable head dedicated to carbon coating. It can hold three carbon fibers, each 0.8 mm in diameter, which allows carbon layers to be deposited on large samples. This configuration is especially well suited to applications involving Energy Dispersive X-ray Spectroscopy (EDX).\u003c\/p\u003e\n\u003ch2 dir=\"ltr\" aria-level=\"4\"\u003eColor Touchscreen Control\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe DSCR-300 features a 7-inch color touchscreen that provides fully automatic control and data entry, making operation straightforward for inexperienced users. Vacuum levels, current readings, and deposition information can be monitored directly on the screen, in either digital form or graphical curves. The system also stores data from the last 300 coatings, which can be reviewed anytime on the history page.\u003c\/p\u003e\n\u003ctable width=\"100%\" style=\"width: 100.029%;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DSCR-Touch-Screen-Sq.webp?v=1792782423\" alt=\"Desk Sputter \u0026amp; Carbon Coater – DSCR-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/vac-product-DST1-300-Monitor-Squ.webp?v=1792782421\" alt=\"Desk Sputter \u0026amp; Carbon Coater – DSCR-300\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe DSCR-300 desk sputter coater delivers versatile deposition on a wide range of substrates. This makes it a good fit for thin film applications in fields such as micro and nanoelectronics, as well as SEM sample preparation.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eThe system can sputter noble metals, including gold (Au), palladium (Pd), platinum (Pt), and gold\/palladium (Au\/Pd), onto non-conductive or poorly conductive specimens. The DSCR-300 can also apply carbon films.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003ePlease note that sputtering oxidizing metals requires a turbomolecular pump, which can be added to either the DSCT-300 or the DSCT-170 system. The DSCR is a rotary-pumped coater that can be configured for both DC sputtering and carbon fiber (thread) coating through interchangeable heads, all within a single instrument.\u003c\/p\u003e\n\u003cdiv class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/div\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"3dc4780\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eChamber Size: 300 mm OD x 150 mm Pyrex cylinder chamber\u003c\/li\u003e\n\u003cli\u003eDimensions: 58 cm H x 50 cm W x 63 cm D\u003c\/li\u003e\n\u003cli\u003eMagnetron Cathode Options: 3 or 4 inches\u003c\/li\u003e\n\u003cli\u003eShipping Weight: 42 kg\u003c\/li\u003e\n\u003cli\u003ePower Supply: 220V-240V, 50\/60Hz, 10A\u003c\/li\u003e\n\u003cli\u003eDC Power Supply Output: 200 Watts\u003c\/li\u003e\n\u003cli\u003eUltimate Vacuum: Less than 5*10^-2 Torr\u003c\/li\u003e\n\u003cli\u003eData Transfer: Curves and sputtering process data can be transferred via USB port to a PC\u003c\/li\u003e\n\u003cli\u003eVacuum Pump: Two-stage, direct drive, 12 m^3\/h, rotary vane pump\u003c\/li\u003e\n\u003cli\u003eVacuum Gauge: Thermocouple vacuum gauge\u003c\/li\u003e\n\u003cli\u003eQuartz Crystal Thickness Monitor: Precision of 1 nm\u003c\/li\u003e\n\u003cli\u003eAutomatic Venting Valve\u003c\/li\u003e\n\u003cli\u003eData Storage: Capability to save the data from the last 300 coatings\u003c\/li\u003e\n\u003cli\u003eVacuum Pump Weight: 20 kg\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"92fd5f6\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003eSpare glass chamber\u003c\/li\u003e\n\u003cli\u003eSputtering targets\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003cli\u003eCarbon rod evaporation head\u003c\/li\u003e\n\u003cli\u003eHigh current power supply for carbon rod\u003c\/li\u003e\n\u003cli\u003eCarbon fiber\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51260801384687,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/desk-sputter-carbon-coater-dscr.webp?v=1792782564"},{"product_id":"thermal-evaporation-system","title":"Thermal Evaporation System","description":"\u003ch2 dir=\"ltr\"\u003eThermal Evaporation System – ToronTES™ 1000 | Automated Multilayer Thin Film Deposition\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe ToronTES™ 1000 is a fully automated thermal evaporation system built for sequential and simultaneous multilayer thin film deposition. Its 2×2 channel co-evaporation configuration supports four thermal evaporation sources, powered by a 12 V, 200 A supply with a voltage-current display for precise evaporation control. The SS304 prismatic or cylindrical chamber (30 to 60 cm box size) reaches a 10⁻⁷ Torr base pressure and a 10⁻⁶ Torr working vacuum in just 30 minutes. With a 1.5-hour cycle time and touch screen control, researchers can complete multiple deposition runs every day.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003e\u003cstrong\u003eAccurate Rate and Thickness Control\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eA dual-channel thickness controller supports 1 to 4 QCMs with 0.1 Å\/s resolution and averaged-value output, tracking deposition rate across all co-evaporation sources. Mass flow meter controlled gas inputs with isolation valves allow Ar and N₂ chamber backfill. An optional RF plasma cleaning unit provides in-situ substrate surface preparation. The isolation valve preserves chamber vacuum between experiments, while fully automated layer-by-layer deposition manages each coating sequence. Automatic closed-loop water cooling and 120 °C internal baking keep the system ready between runs.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003e\u003cstrong\u003eHeated Deposition and Fast Pump-Down\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eAn optional 50 to 600 °C PID substrate heater with 2 to 30 rpm rotation enables heated deposition on a wide range of substrate configurations. The turbomolecular and mechanical pump combination, with cryo and dry pump options, delivers the high pumping speed required for the 30-minute pump-down cycle.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003e\u003cstrong\u003eCompact, Flexible Chamber Integration\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eThe system’s 75×120 cm footprint sits on lockable wheels and passes through standard doors, making installation and relocation simple. Standard 1\", QF, CF, and ISO feedthrough ports, along with a front viewing window and rotatable shutter, support flexible chamber integration for varied lab setups.\u003c\/p\u003e\n\u003ch2 dir=\"ltr\"\u003eThermal Evaporation System – ToronTES™ 1000 Applications | Thin Film Deposition for Research and Production\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe ToronTES™ 1000 thermal evaporation system supports research and production thin film laboratories that need multilayer and co-evaporated metallic and inorganic film deposition with automated control and consistent deposition rates. Its 2×2 co-evaporation configuration and QCM-based thickness control suit research programs focused on heterogeneous multilayer stacks, alloy films, and compositionally graded layers.\u003c\/p\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003e\n\u003cstrong\u003eMetal Thin Film and Contact Deposition:\u003c\/strong\u003e Thermal evaporation of Au, Al, Cr, Ag, and other metallic films for semiconductor contacts, interconnects, and electrode metallization in device research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMultilayer Thin Film Deposition:\u003c\/strong\u003e Sequential evaporation of different material layers in a single pump-down cycle for optical coatings, magnetic multilayers, and functional device stacks.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCo-Evaporation Alloy Film Research:\u003c\/strong\u003e Simultaneous dual-source co-evaporation of alloy and compound films, with composition tuned through the relative power settings of each source channel.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOLED and Organic Device Research:\u003c\/strong\u003e Thermal evaporation of metallic contact and charge-transport layers onto organic device structures that call for clean, high-vacuum metallic film deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Mirror and Reflective Coating Deposition:\u003c\/strong\u003e High-rate evaporation of metallic reflectors for optical components, photonic devices, and telescope mirror fabrication.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSolar Cell and Energy Device Research:\u003c\/strong\u003e Thermal evaporation of metallic back contacts, absorber layers, and thin-film stack components for photovoltaic and energy device research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Thin Film Research:\u003c\/strong\u003e An automated multilayer deposition platform for teaching and materials research across metallic and inorganic thin film systems.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2 dir=\"ltr\"\u003eThermal Evaporation System – ToronTES™ 1000 Key Features | Automated Co-Evaporation Platform\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe ToronTES™ 1000 thermal evaporation system combines a 2×2 co-evaporation source configuration, dual-channel QCM thickness monitoring, MFM gas control, and full LabVIEW-compatible automation in a compact, high-vacuum thin film deposition platform.\u003c\/p\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003e\n\u003cstrong\u003e2×2 Channel, 12 V to 200 A Co-Evaporation Sources with Power Display:\u003c\/strong\u003e Four thermal sources with a voltage-current display for controlled sequential and simultaneous two-material deposition in a single pump-down cycle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Monitoring with 1 to 4 QCMs:\u003c\/strong\u003e Multi-sensor thickness and rate monitoring with averaged-value output for improved measurement accuracy across co-deposition source channels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automated Layer-by-Layer Deposition:\u003c\/strong\u003e Each coating layer runs under automatic control, with no operator intervention needed between deposition steps.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTouch Screen and LCD Panel Control:\u003c\/strong\u003e A touch screen interface manages all system operations, with real-time status shown on the LCD display.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁷ Torr Base Pressure, 10⁻⁶ Torr in 30 Minutes:\u003c\/strong\u003e A turbomolecular and mechanical pump stack, with cryo and dry pump options, delivers fast pump-down for the 1.5-hour experiment cycle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control from atmospheric pressure down to deep vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (30 to 60 cm, Prismatic or Cylindrical):\u003c\/strong\u003e Clean, electro-polished surfaces in multiple box sizes to match different substrate and source configurations.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-Inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable feedthrough selection for flexible gauge, source, and process gas integration.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMFM Controlled Gas Inputs with Ar or N₂ Chamber Backfill:\u003c\/strong\u003e Mass flow meter controlled gas delivery with isolation valves for selective chamber atmosphere management and post-deposition backfill.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Hold with Isolation Valve:\u003c\/strong\u003e The chamber stays under vacuum between experiments, cutting pump-down time and shielding film surfaces from atmospheric exposure.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional 50 to 600 °C PID Sample Heating:\u003c\/strong\u003e Substrate temperature management for film crystallinity and deposition onto heated substrates.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Adjustable Sample Rotation:\u003c\/strong\u003e Continuous speed adjustment for uniform film thickness across the substrate surface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional Sample Surface Cleaning by RF Plasma:\u003c\/strong\u003e In-situ RF plasma cleaning of substrate surfaces before deposition, without breaking vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Closed-Loop Water Cooling:\u003c\/strong\u003e Thermal management of evaporation sources and chamber components during high-power co-evaporation runs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInternal Lighting and 120 °C Baking Capability:\u003c\/strong\u003e Chamber inspection lighting, plus baking for conditioning and residual moisture removal between runs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFront Viewing Window with Rotatable Shutter:\u003c\/strong\u003e Direct visual access for process monitoring, with a rotatable shutter for precise deposition timing and chamber protection.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5-Hour Experiment Cycle Time:\u003c\/strong\u003e Rapid pump-down and process execution allow multiple deposition runs per day.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e75×120 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e A compact footprint that passes through standard doors and allows flexible laboratory placement.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Annual coverage for system components and manufacturing quality.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2 dir=\"ltr\"\u003eThermal Evaporation System – ToronTES™ 1000 Theory and Method | How Resistive Thermal Evaporation Works\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThermal evaporation deposits thin films by resistively heating a source material in high vacuum until it vaporizes. The released atoms travel upward and condense on the substrates above. A high-current supply drives current through a resistive boat, coil, or basket, rapidly heating the source to its vapor pressure threshold. Below 10⁻⁵ Torr, atoms travel without scattering and condense uniformly as a thin film. The ToronTES™ 1000’s 12 V to 200 A power supply with a voltage-current display gives the operator direct control over the evaporation rate throughout deposition.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003e\u003cstrong\u003eCo-Evaporation and Sequential Deposition\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eThe 2×2 co-evaporation configuration powers two channels simultaneously, each serving two sources, so two materials can be deposited in a single pump-down cycle. Co-evaporation produces alloy and compound films whose composition is set by the relative evaporation rates of each channel. A dual-channel QCM controller with 1 to 4 sensors and averaged-value output monitors each material’s rate in real time. Sequential operation of separate channels deposits distinct material layers without changing the substrate position or venting the chamber.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003e\u003cstrong\u003eVacuum, Atmosphere, and Process Preparation\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eThe turbomolecular and mechanical pump combination reaches a 10⁻⁷ Torr base pressure, monitored across a wide-range 1000 to 10⁻⁹ Torr measurement system. This supports both metallic evaporation and multilayer deposition. MFM-controlled Ar or N₂ gas inputs allow selective chamber backfill and controlled atmosphere conditions. An optional 50 to 600 °C PID substrate heater with 2 to 30 rpm rotation, together with optional RF plasma cleaning, extends the range of process preparation options. Automatic closed-loop water cooling and 120 °C internal baking keep the system in good condition between depositions.\u003c\/p\u003e\n\u003ch2\u003eThermal Evaporation System - ToronTES™ 1000 Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Sources\u003c\/td\u003e\n\u003ctd\u003e2×2 channel co-evaporation configuration (4 sources)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSource Power Supply\u003c\/td\u003e\n\u003ctd\u003e12V to 200A per channel; voltage-current power display\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum (Pump-Down Time)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁶ Torr in 30 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (cryo and dry pump as options)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic or cylindrical); electro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Sizes\u003c\/td\u003e\n\u003ctd\u003e30\/40\/50\/60 cm box size\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heating (Optional)\u003c\/td\u003e\n\u003ctd\u003e50 to 600 °C (PID controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm (adjustable)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning (Optional)\u003c\/td\u003e\n\u003ctd\u003eRF plasma (substrate surface)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s; 1 to 4 QCMs; averaged value\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eMFM controlled; Ar or N₂ backfill; isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInternal Baking\u003c\/td\u003e\n\u003ctd\u003eUp to 120 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eFront viewing window; rotatable shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; touch screen; real-time LCD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Cycle Time\u003c\/td\u003e\n\u003ctd\u003e1.5 hours\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard doors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51260881273071,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/thermal-evaporation-system816718.webp?v=1792782938"},{"product_id":"high-vacuum-single-magnetron-target-desk-sputter-coater-dst1-170","title":"High Vacuum, Single Magnetron Target Desk Sputter Coater DST1-170","description":"\u003ch2\u003eHigh Vacuum, Single Magnetron Target Desk Sputter Coater DST1-170\u003c\/h2\u003e\n\u003cp\u003eThe DST1-170 is a high vacuum desk sputter coater with a single magnetron target, built specifically for preparing samples for Scanning Electron Microscope (SEM) analysis. It can deposit a broad range of materials, including gold (Au), platinum\/palladium (Pt\/Pd) alloy, silver (Ag), chromium (Cr), tungsten (W), iridium (Ir), and others.\u003c\/p\u003e\n\u003cp\u003eThe system produces uniform, high-quality films with fine grain sizes, making it well suited to specimens that require high-resolution, high-quality characterization, such as FE-SEM, EDS\/WDS, TEM, and EBSD work. A 2-inch magnetron cathode and an 80-watt switching DC power supply make the DST1-170 a good fit for a wide variety of research and thin film applications.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eFine-grain structural deposition for SEM and FE-SEM sample preparation\u003c\/li\u003e\n\u003cli\u003eNano and microelectronic applications\u003c\/li\u003e\n\u003cli\u003eSolar cell manufacturing\u003c\/li\u003e\n\u003cli\u003eOptical component coating\u003c\/li\u003e\n\u003cli\u003eThin film sensor development\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e90 L\/s high vacuum turbomolecular pump (Leybold)\u003c\/li\u003e\n\u003cli\u003eTwo-stage rotary vane pump serving as the backing pump\u003c\/li\u003e\n\u003cli\u003eFull-range vacuum gauge (Leybold)\u003c\/li\u003e\n\u003cli\u003eISO-KF 63 butterfly valve\u003c\/li\u003e\n\u003cli\u003e80-watt DC power supply\u003c\/li\u003e\n\u003cli\u003eQuartz crystal thickness monitor with 1 nanometer precision and 1 Ångström resolution\u003c\/li\u003e\n\u003cli\u003eIntuitive touchscreen interface for straightforward coating process control and quick data entry\u003c\/li\u003e\n\u003cli\u003eUser-friendly software with network update capability\u003c\/li\u003e\n\u003cli\u003eAdjustable coating rate control for achieving finer grain structures\u003c\/li\u003e\n\u003cli\u003eManual and automatic sputtering modes, based on either time or thickness\u003c\/li\u003e\n\u003cli\u003eGLAD (Glancing Angle Deposition) sputtering capability\u003c\/li\u003e\n\u003cli\u003ePlasma cleaning function\u003c\/li\u003e\n\u003cli\u003eRecording and plotting of coating parameter graphs\u003c\/li\u003e\n\u003cli\u003eBuilt-in electronic shutter\u003c\/li\u003e\n\u003cli\u003eEasily interchangeable specimen stages, with a rotation stage included as standard\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty\u003c\/li\u003e\n\u003cli\u003eVac Coat products carry worldwide public and product liability insurance, providing protection against property damage or personal injury caused by Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eClean Vacuum Performance\u003c\/h2\u003e\n\u003cp\u003eThe vacuum chamber is constructed from cylindrical Pyrex. The DST1-170 has an internally mounted 90 L\/s turbomolecular pump, backed by a 4 m³\/h two-stage rotary vane pump. This configuration creates a clean vacuum environment free of the oil contamination commonly associated with standard diffusion pumps.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dst1.webp?v=1792872005\" alt=\"High Vacuum, Single Magnetron Target Desk Sputter Coater DST1-170\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dst2.webp?v=1792872004\" alt=\"High Vacuum, Single Magnetron Target Desk Sputter Coater DST1-170\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eTouchscreen Control\u003c\/h2\u003e\n\u003cp\u003eThe DST1-170 includes a 7-inch color touchscreen with fully automatic control and simple data entry, so even inexperienced users can operate it with ease. Vacuum levels, current, and deposition information can be viewed as digital readouts or as curves. The system also stores data from the last 300 coatings, which can be reviewed on the history page.\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"11652c7\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eUltimate Vacuum: Less than 7 x 10^-7 Torr\u003c\/li\u003e\n\u003cli\u003ePrecise control of sputtering rate for achieving finer grain structures\u003c\/li\u003e\n\u003cli\u003eIndependent power control of sputtering, regardless of pressure\u003c\/li\u003e\n\u003cli\u003eElectronic leak valve for Argon gas\u003c\/li\u003e\n\u003cli\u003eCapability to record and plot coating parameter graphs\u003c\/li\u003e\n\u003cli\u003eConvenient data transfer of curves and deposition process data via USB port to PC\u003c\/li\u003e\n\u003cli\u003ePower requirements: 220V-240V, 50\/60Hz, 16A\u003c\/li\u003e\n\u003cli\u003eShipping Weight: 36 kilograms\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"a9e6c36\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cstrong\u003eOptions and Accessories:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal\u003c\/li\u003e\n\u003cli\u003ePlanetary sample rotation\u003c\/li\u003e\n\u003cli\u003eSpare glass chamber\u003c\/li\u003e\n\u003cli\u003eSputtering targets\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51260951101679,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/high-vacuum-single-magnetron-tar.webp?v=1792871965"},{"product_id":"load-lock-equipped-coating-system","title":"Load-Lock Equipped Coating System","description":"\u003ch2\u003eLoad-Lock Equipped Coating System\u003c\/h2\u003e\n\u003cp\u003eThe ToronTS-450 coating system, fitted with Load-Lock chambers, speeds up processing and improves coating quality. Samples are loaded and unloaded through the Load-Lock chamber, and a magnetic transfer arm carries each one into the main chamber.\u003c\/p\u003e\n\u003ch2\u003eCompatible Deposition Systems\u003c\/h2\u003e\n\u003cp\u003eThis upgrade can be added to Thermal, Sputtering, E-Beam, and HiPIMS systems across our product line. With the ToronVak Load-Lock configuration, coating runs in a high-vacuum environment of 10⁻⁷ Torr, and a fresh wafer can be loaded every 15 minutes.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a1_5b667dce-7349-404d-a72a-77029a4dd7d6.webp?v=1792993557\" alt=\"Load-Lock Equipped Coating System\"\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor and Wafer Fabrication:\u003c\/strong\u003e Supports high-throughput thin film deposition on wafers while keeping contamination risk low. Continuous processing and frequent sample exchange keep production moving.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMicroelectronics and Optoelectronics:\u003c\/strong\u003e Delivers precise coatings of conductors and insulators for sensors, MEMS devices, photodetectors, and other optoelectronic components, all under stable vacuum conditions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnergy and Photovoltaics:\u003c\/strong\u003e Produces advanced coatings for solar cells and energy storage devices, building high-efficiency multilayer thin films through reactive sputtering and thermal sources.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAerospace and Automotive Engineering:\u003c\/strong\u003e Applies durable metallic and dielectric coatings to critical components, improving performance, wear resistance, and thermal stability.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDisplay and Optical Coatings:\u003c\/strong\u003e Deposits transparent, anti-reflective, and conductive layers on glass, optics, and display substrates, with recipe-controlled uniformity.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSurface Engineering and Industrial Coating Services:\u003c\/strong\u003e Offers a dependable platform for contract coating operations, allowing efficient multi-sample processing with less downtime.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eResearch and Development:\u003c\/strong\u003e Provides a flexible system for universities, laboratories, and corporate R\u0026amp;D teams exploring new thin film materials, coating techniques, and multilayer architectures.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003col\u003e\n\u003cli\u003e\n\u003cstrong\u003eChamber Design:\u003c\/strong\u003e The prismatic or cylindrical vacuum chamber is built from SS304 and finished with an electro-polished, feather-touch inner surface. Water-cooled surfaces are available as an option.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePort Configuration:\u003c\/strong\u003e Standard 1\", QF, CF, and ISO ports make it simple to add more thermal or sputter sources later.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eObservation and Control:\u003c\/strong\u003e A UV-blocking observation window, a rotatable door shutter, and a LabVIEW-programmed sample shutter work together to give precise thickness control.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum System:\u003c\/strong\u003e Turbo-molecular, mechanical, and dry pumps provide fast pump-down and bring the main chamber to a base pressure of 10⁻⁸ Torr.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLoad-Lock Performance:\u003c\/strong\u003e Dedicated pumps reach 10⁻⁶ Torr in 10 minutes, and the load-lock can be configured for sputtering, e-beam, and thermal sources.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eValves and Isolation:\u003c\/strong\u003e Throttle, vent, isolation, and gate valves keep the chamber under vacuum while it sits idle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomated Control:\u003c\/strong\u003e Deposition runs fully automatically through software or panel control, with real-time LCD displays.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCooling System:\u003c\/strong\u003e An automatic closed-loop water cooling system includes interlock protection, which prevents power activation unless proper vacuum conditions are present.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSputtering Capabilities:\u003c\/strong\u003e RF- and DC-driven sputtering guns from 1\" to 6\" feature flex heads, self-axis rotation, and compression sealing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterial Coating:\u003c\/strong\u003e The system coats conductors (Au, Al, Ti, Ni) and insulators (MgO, TiO₂, SiO₂, TiN) at high rates, with recipe-based control.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Precision:\u003c\/strong\u003e Downstream and upstream regulation allow adjustable vacuum control from 1000 to 10⁻⁹ Torr.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSample Heating and Rotation:\u003c\/strong\u003e PID-controlled heating spans 50 to 600°C with ±1°C sensitivity, and rotation is adjustable from 2 to 30 rpm. DC\/RF plasma cleaning is also included.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLoading Mechanism:\u003c\/strong\u003e A magnetic transfer arm handles 2\", 3\", 4\", and 6\" samples with ease.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThickness Measurement:\u003c\/strong\u003e Two QCMs provide dual-channel thickness-rate measurement with 0.1 Å\/s precision.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Sources:\u003c\/strong\u003e Thermal sources rated at 8V to 500A and 4000W support sequential and co-evaporation. Their design limits cross-contamination and allows quick source replacement.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEffusion Cells:\u003c\/strong\u003e Cells operating from 50 to 800°C (±1°C) are available for organic evaporation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eGas Mixing and Sputtering:\u003c\/strong\u003e Digital MFC-controlled gas inputs (Ar, N₂, O₂, He, CH₄, and others) offer 0.1 sccm sensitivity for reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEfficiency:\u003c\/strong\u003e A 1.5-hour experiment cycle makes it possible to run 10 to 15 experiments per day.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWarranty:\u003c\/strong\u003e A 2-year warranty covers materials, design, and craftsmanship.\u003c\/li\u003e\n\u003c\/ol\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279022063855,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/load-lock-equipped-coating-syste.webp?v=1792993585"},{"product_id":"vacuum-annealing-furnace","title":"Vacuum Annealing Furnace","description":"\u003ch2\u003eVacuum Annealing Furnace – ToronVF™ Anneal\u003c\/h2\u003e\n\u003ch3\u003eHigh-Vacuum Thermal Processing from 50 to 700 °C\u003c\/h3\u003e\n\u003cp\u003eToronVF™ Anneal is a high-vacuum annealing furnace built for thermal annealing, bake-out, quenching, and general heat treatment across a 50 to 700 °C range. A PID-controlled furnace sits inside an SS304 vacuum chamber and achieves a base pressure of 10⁻⁷ Torr, with heating rates adjustable from 1 to 20 °C\/minute. Quenching and cooling rates of up to ±50 °C\/minute make the system well suited to rapid thermal processing cycles and time-sensitive heat treatment programs. Each cycle is managed through a programmable 10-step PID profile, expandable to 40 steps, with independent setpoint, ramp, and soak parameters for every step.\u003c\/p\u003e\n\u003ch3\u003eClean Chamber and Wide-Range Vacuum System\u003c\/h3\u003e\n\u003cp\u003eThe electro-polished SS304 vacuum chamber delivers clean internal surfaces, making it a strong match for contamination-sensitive annealing work. The vacuum system covers a wide pressure range from 1000 to 10⁻⁹ Torr. A turbomolecular pump and a mechanical pump come standard and reach 10⁻⁶ Torr within 30 minutes, while a dry pump is available as an option. Isolation valves let operators backfill the chamber with Ar or N₂ as needed, and power failure protection holds the chamber under vacuum whenever the system is idle. Fast cycle times allow two to three experiments per day, depending on load volume.\u003c\/p\u003e\n\u003ch3\u003eFlexible Working Volume and Controlled Atmosphere Options\u003c\/h3\u003e\n\u003cp\u003eThe working volume is adjustable from 1 to 3 m³, accommodating a range of batch sizes and loading configurations. Optional mass flow meter gas inputs for Ar, N₂, O₂, He, and other gases support controlled-atmosphere processing alongside vacuum annealing and bake-out applications. An optional 100 amu residual gas analyzer identifies outgassing species and tracks chamber cleanliness before and during heat treatment.\u003c\/p\u003e\n\u003ch3\u003eCompact Footprint and Intuitive Controls\u003c\/h3\u003e\n\u003cp\u003eThe system occupies a 75×120 cm footprint and rolls on lockable wheels for easy positioning. A touch screen panel with real-time LCD control rounds out the package.\u003c\/p\u003e\n\u003ch3\u003eClean, Oxidation-Free Heat Treatment for Research and Production\u003c\/h3\u003e\n\u003cp\u003eThe ToronVF™ Anneal supports research and production facilities that need clean, oxidation-free heat treatment of metallic, ceramic, and semiconductor materials, where an atmospheric furnace would cause surface oxidation, scale, or unwanted phase reactions. Bake-out mode, quenching capability, an optional controlled atmosphere, and programmable multi-step profiles make it suitable for a wide range of thermal processing programs.\u003c\/p\u003e\n\u003ch2\u003eKey Applications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Annealing and Stress Relief:\u003c\/strong\u003e Heat treatment of metals, alloys, and semiconductors from 50 to 700 °C under high vacuum for stress relief, recrystallization, and grain growth, without surface oxidation or contamination.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMagnetic Material Processing:\u003c\/strong\u003e Vacuum annealing of permanent magnets, soft magnetic alloys, and amorphous metals to develop magnetic properties, tune coercivity, and reduce hysteresis loss.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Quenching and Rapid Thermal Processing:\u003c\/strong\u003e Rapid cooling at up to ±50 °C\/minute for martensite formation, retained austenite management, and metastable phase trapping in alloy systems.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBake-Out and Degassing of Vacuum Components:\u003c\/strong\u003e High-temperature bake-out of vacuum chambers, electrodes, feedthroughs, and other components to desorb adsorbed water and hydrocarbons before assembly or use.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHydrogen Removal and Dehydrogenation:\u003c\/strong\u003e Vacuum annealing to outgas hydrogen from titanium, zirconium, steel, and other hydrogen-susceptible materials following electroplating, forming, or joining processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThin Film and Semiconductor Post-Deposition Annealing:\u003c\/strong\u003e Vacuum annealing of thin film samples to activate dopants, improve crystallinity, and lower interface defect densities in semiconductor and photovoltaic device research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePhase Transformation and Sintering Research:\u003c\/strong\u003e Programmable multi-step vacuum thermal cycles for phase diagram studies, solid-state reaction research, and ceramic or powder metallurgy sintering programs.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eA Scalable Vacuum Heat Treatment Platform\u003c\/h2\u003e\n\u003cp\u003eThe ToronVF™ Anneal brings together a PID-controlled high-vacuum furnace, multi-step programmable thermal profiles, rapid quenching, optional residual gas analysis, and fully automated computer control. All of this sits on a scalable vacuum heat treatment platform with an adjustable 1 to 3 m³ working volume.\u003c\/p\u003e\n\u003ch2\u003eFeature Overview\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 700 °C PID-Controlled Vacuum Furnace:\u003c\/strong\u003e Precise temperature control inside an SS304 vacuum chamber delivers clean heat treatment free from atmospheric contamination.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eProgrammable PID Temperature Profile (10 to 40 Steps):\u003c\/strong\u003e Multi-step thermal cycle control with independent setpoint, ramp rate, and soak time for each step, supporting complex annealing and heat treatment schedules.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdjustable Heating Rate (1 to 20 °C\/Minute):\u003c\/strong\u003e An operator-selectable ramp rate adapts to material thermal mass, phase transformation requirements, and process sensitivity.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eQuenching and Rapid Cooling at ±50 °C\/Minute:\u003c\/strong\u003e High-rate thermal transitions for martensitic hardening, metastable phase formation, and transformation-sensitive heat treatment applications.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 3 m³ Adjustable Working Volume:\u003c\/strong\u003e A configurable chamber volume accommodates different batch sizes and loading configurations across research and production programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁷ Torr Base Pressure, 10⁻⁶ Torr in 30 Minutes:\u003c\/strong\u003e The turbomolecular and mechanical pump combination provides fast pump-down for efficient cycling.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTurbomolecular and Mechanical Pump (Dry Pump Option):\u003c\/strong\u003e The standard pump configuration reaches the base vacuum needed for clean annealing, and a dry pump is available for oil-free system requirements.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control span atmospheric pressure to deep vacuum, covering every process mode.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional 100 amu Residual Gas Analyzer:\u003c\/strong\u003e Compositional monitoring of outgassed species during bake-out and annealing supports contamination identification and process verification.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional Mass Flow Meter Gas Inputs (Ar, N₂, O₂, He):\u003c\/strong\u003e Controlled-atmosphere capability for gas quench, inert backfill, and atmosphere-assisted processing alongside vacuum annealing modes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIsolation Valves with Ar or N₂ Chamber Backfill:\u003c\/strong\u003e Provides a controlled atmosphere after annealing for inert cool-down, gas quench, or specific post-treatment requirements.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePower Failure Protection with Vacuum Hold:\u003c\/strong\u003e An isolation valve maintains chamber vacuum during a power loss, protecting sensitive samples and preserving the process environment.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRapid Cycle Times (2 to 3 Experiments Per Day):\u003c\/strong\u003e Fast pump-down and efficient cycle design allow multiple heat treatment runs per day, depending on load volume.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Electro-Polished Vacuum Chamber:\u003c\/strong\u003e Clean, low-outgassing chamber surfaces reduce contamination risk in high-purity annealing processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eClosed-Loop Water Cooling (When Needed):\u003c\/strong\u003e Thermal management of furnace and chamber components during sustained high-temperature operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer Control with Touch Screen and LCD Panel:\u003c\/strong\u003e Temperature, pressure, and process parameters are managed automatically, with real-time monitoring throughout each heat treatment cycle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e75×120 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e A compact footprint allows flexible placement on laboratory and production floors.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTwo-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Extended coverage that reflects the system's role as a long-term research and production investment.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eVacuum Annealing Furnace – ToronVF™ Anneal Theory and Method\u003c\/h2\u003e\n\u003ch3\u003ePrinciples of Vacuum Annealing\u003c\/h3\u003e\n\u003cp\u003eVacuum annealing heats materials under low-pressure conditions. Removing oxygen and other reactive gases from the environment prevents surface oxidation and interstitial contamination during heat treatment. Below 10⁻⁵ Torr, residual gas concentrations are too low to contaminate the material surface, so surface chemistry stays intact while grain boundary diffusion drives microstructural development. Typical applications include stress relief, recrystallization, hydrogen outgassing, phase transformation, and magnetic property development. After annealing, a controlled Ar or N₂ backfill adjusts the cooling rate to support a controlled transformation or a quench.\u003c\/p\u003e\n\u003ch3\u003eProgrammable Thermal Cycles and Quenching\u003c\/h3\u003e\n\u003cp\u003eA programmable PID profile, expandable to 40 steps, governs every annealing cycle, with an independent setpoint, heating rate, and soak time for each step. This multi-step flexibility supports complex schedules, including multi-stage annealing with intermediate hold temperatures, stress-relief ramps, and controlled cooling sequences. Quenching at up to ±50 °C\/minute enables rapid thermal transitions for martensite formation, metastable phase trapping, and transformation-sensitive processes. Adjustable heating rates of 1 to 20 °C\/minute work alongside the quench capability to give precise control over the full thermal cycle.\u003c\/p\u003e\n\u003ch3\u003eBake-Out and Vacuum System Monitoring\u003c\/h3\u003e\n\u003cp\u003eBake-out at temperatures up to 700 °C desorbs water, solvents, and hydrocarbons from chamber surfaces and components, which lowers the effective base pressure. The turbomolecular pump continuously removes the desorbed species throughout the thermal cycle, so chamber cleanliness improves with each bake-out run. An optional 100 amu residual gas analyzer tracks outgassed species and verifies chamber cleanliness before sensitive downstream processes. Wide-range vacuum measurement from 1000 to 10⁻⁹ Torr and isolation valve protection round out the vacuum system.\u003c\/p\u003e\n\u003ch2\u003eVacuum Annealing Furnace - ToronVF™ Anneal Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eFurnace Temperature Range\u003c\/td\u003e\n\u003ctd\u003e50 to 700 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTemperature Control\u003c\/td\u003e\n\u003ctd\u003ePID\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eHeating Rate\u003c\/td\u003e\n\u003ctd\u003e1 to 20 °C\/minute (adjustable)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eQuenching \/ Cooling Rate\u003c\/td\u003e\n\u003ctd\u003eUp to ±50 °C\/minute\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTemperature Profile\u003c\/td\u003e\n\u003ctd\u003e10-step programmable PID (expandable to 40 steps)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum (Pump-Down Time)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁶ Torr in 30 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eStainless Steel Type 304; electro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Volume\u003c\/td\u003e\n\u003ctd\u003e1 to 3 m³ (adjustable)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (dry pump as option)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs (Optional)\u003c\/td\u003e\n\u003ctd\u003eMFM controlled; Ar, N₂, O₂, He, and others\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Backfill\u003c\/td\u003e\n\u003ctd\u003eAr or N₂ (via isolation valves)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eResidual Gas Analyzer (Optional)\u003c\/td\u003e\n\u003ctd\u003e100 amu\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eClosed-loop water cooling (when needed)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Failure Protection\u003c\/td\u003e\n\u003ctd\u003eYes; isolation valve maintains vacuum\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; touch screen; real-time LCD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Throughput\u003c\/td\u003e\n\u003ctd\u003e2 to 3 per day (depending on load volume)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e2 years (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279055421679,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/vacuum-annealing-furnace16558885.webp?v=1792993932"},{"product_id":"high-vacuum-single-magnetron-target-desk-sputter-coater-dst1-300","title":"High Vacuum, Single Magnetron Target Desk Sputter Coater DST1-300","description":"\u003ch2 dir=\"ltr\" aria-level=\"4\"\u003eHigh Vacuum Single Magnetron Target Desk Sputter Coater DST1-300\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe DST1-300 is a high vacuum desktop sputter coater with a single magnetron target. This flexible coating system deposits films on semiconductors, dielectrics, and both oxidizing and non-oxidizing metals. It produces uniform, fine-grain thin films in a short cycle time.\u003c\/p\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"5\"\u003eApplications\u003c\/h3\u003e\n\u003cp dir=\"ltr\"\u003eThe Desk Carbon Coater DCR is a compact carbon fiber coating system for preparing samples for scanning electron microscopy (SEM), transmission electron microscopy (TEM), and X-ray analysis (EDX).\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eThe system comes in two configurations:\u003c\/p\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003e\n\u003cstrong\u003eDCR:\u003c\/strong\u003e A rotary-pumped carbon coater suited to SEM sample preparation, EDS\/WDS, and thin film applications.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDCT:\u003c\/strong\u003e A turbo-pumped carbon coater designed for FE-SEM, EDS\/WDS, TEM, EBSD, and thin film applications. This high vacuum coater creates high-quality, uniform carbon films with fine grain sizes. These films suit specimens that call for high-resolution, high-quality characterization.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"5\"\u003eFeatures and Advantages\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eHigh vacuum turbomolecular pump with a pumping speed of 90 l\/s or 350 l\/s\u003c\/li\u003e\n\u003cli\u003eUltimate pressure of 7 x 10-6 Torr or 7 x 10-7 Torr, matching the two pumping speeds respectively\u003c\/li\u003e\n\u003cli\u003eTwo-stage rotary vane pump serving as the backing pump\u003c\/li\u003e\n\u003cli\u003eFull-range vacuum gauge (Leybold)\u003c\/li\u003e\n\u003cli\u003eHigh-precision quartz crystal thickness monitor\u003c\/li\u003e\n\u003cli\u003e600 W DC power supply\u003c\/li\u003e\n\u003cli\u003eIntuitive touchscreen interface for simple coating process control and fast data entry\u003c\/li\u003e\n\u003cli\u003eUser-friendly software with network update capability\u003c\/li\u003e\n\u003cli\u003eAdjustable coating rate control for achieving finer grain structures\u003c\/li\u003e\n\u003cli\u003eManual and automatic sputtering modes, both timed and thickness-based\u003c\/li\u003e\n\u003cli\u003eGLAD (Glancing Angle Deposition) sputtering capability\u003c\/li\u003e\n\u003cli\u003ePlasma cleaning function\u003c\/li\u003e\n\u003cli\u003eRecording and plotting of coating parameter graphs\u003c\/li\u003e\n\u003cli\u003eElectronic shutter included\u003c\/li\u003e\n\u003cli\u003eEasily interchangeable specimen stages, with a rotation stage supplied as standard\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty\u003c\/li\u003e\n\u003cli\u003eGlobal public and product liability insurance coverage on all Vac Coat products, protecting against property damage or personal injury caused by Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"5\"\u003eColor Touchscreen Control\u003c\/h3\u003e\n\u003cp dir=\"ltr\"\u003eThe DST1-300 features a user-friendly 7-inch color touchscreen with fully automatic control and data entry, so even inexperienced users can operate it with confidence. From the touchscreen, operators can run the system and monitor vacuum levels, current values, and deposition details, shown as digital readouts or graphical curves.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eThe system also stores data from the last 300 coatings, which you can review on the history page.\u003c\/p\u003e\n\u003ctable width=\"100%\" style=\"height: 10px; width: 100.029%;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dst11.webp?v=1792994284\" alt=\"High Vacuum, Single Magnetron Target Desk Sputter Coater DST1-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dst12-1.webp?v=1792994284\" alt=\"High Vacuum, Single Magnetron Target Desk Sputter Coater DST1-300\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"5\"\u003eClean Vacuum Environment\u003c\/h3\u003e\n\u003cp dir=\"ltr\"\u003eThe vacuum chamber is a cylindrical Pyrex vessel measuring 300 mm in outer diameter (OD) and 200 mm in height (H). An internally mounted 90 l\/s turbomolecular pump, supported by a two-stage rotary pump, evacuates the chamber. This setup provides a clean vacuum, free of the oil contamination typically associated with conventional diffusion pumps.\u003c\/p\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"5\"\u003eTheory and Method\u003c\/h3\u003e\n\u003cp dir=\"ltr\"\u003eThe DST1-300 offers a spacious chamber and is available with a 2-, 3-, or 4-inch magnetron and a water-cooled cathode. It is well suited to coating large specimens up to 15 cm in diameter, or several smaller specimens of similar size. Unlimited sputtering time makes it a strong choice for depositing thick layers.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eThis single target coater includes a 600 W DC power supply. An optional 300 W RF power supply with an auto-matching box adds further flexibility. Its high vacuum system deposits a wide range of materials onto different surfaces, serving thin film applications such as micro- and nanoelectronics and SEM sample preparation.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eThe DST1-300 magnetron sputter coater coats semiconductors, dielectrics, and both oxidizing and non-oxidizing metals. It quickly produces uniform thin films with fine-grain sizes.\u003c\/p\u003e\n\u003cdiv data-id=\"71ac334\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003eThis system is suitable for various applications, including:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eDeposition of metal, semiconductor, and dielectric films\u003c\/li\u003e\n\u003cli\u003eNano and microelectronic applications\u003c\/li\u003e\n\u003cli\u003eSolar cell manufacturing\u003c\/li\u003e\n\u003cli\u003eCoating of optical components\u003c\/li\u003e\n\u003cli\u003eDevelopment of thin film sensors\u003c\/li\u003e\n\u003cli\u003eProduction of magnetic thin film devices\u003c\/li\u003e\n\u003cli\u003eApplications in computer memory\u003c\/li\u003e\n\u003cli\u003eAchieving fine-grain structural deposition for SEM and FE-SEM sample preparation\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eIt offers versatility across a range of industries and research areas.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"1353f75\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eSubstrate bias voltage\u003c\/li\u003e\n\u003cli\u003eRF generator and auto matching box\u003c\/li\u003e\n\u003cli\u003eSubstrate heater (up to 500°C)\u003c\/li\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003eSpare vacuum cylindrical glass chamber\u003c\/li\u003e\n\u003cli\u003eThermal evaporation system with one source\u003c\/li\u003e\n\u003cli\u003eSputtering targets\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279101722863,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/high-vacuum-single-magnetron-tar_1.webp?v=1792994320"},{"product_id":"turbo-pumped-desk-carbon-coater-dct","title":"Turbo Pumped Desk Carbon Coater- DCT","description":"\u003ch2\u003eTurbo Pumped Desk Carbon Coater – DCT\u003c\/h2\u003e\n\u003cp\u003eThe Turbo Pumped Desk Carbon Coater (DCT) is a high vacuum, turbo-pumped system built for a wide range of sample preparation needs, including FE-SEM, EDS\/WDS, TEM, EBSD, and thin film work. It deposits uniform, fine-grain carbon films of consistently high quality, making it a strong match for specimens that call for high-resolution imaging and top-tier characterization.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eField Emission Scanning Electron Microscopy (FE-SEM):\u003c\/strong\u003e Creates ultra-thin, conductive carbon layers that support high-resolution imaging.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnergy Dispersive and Wavelength Dispersive Spectroscopy (EDS\/WDS):\u003c\/strong\u003e Delivers contamination-free carbon coatings suited to accurate elemental analysis.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTransmission Electron Microscopy (TEM):\u003c\/strong\u003e Lays down uniform, fine-grain carbon layers that are essential for specimen support films.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectron Backscatter Diffraction (EBSD):\u003c\/strong\u003e Produces stable, conductive coatings that enhance diffraction pattern quality.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThin Film Research:\u003c\/strong\u003e Makes high-quality carbon thin films possible for nanotechnology and materials science work.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePorous and Delicate Samples:\u003c\/strong\u003e Uses planetary rotation stages to coat fragile structures evenly without damaging them.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eQuality Control and Industrial R\u0026amp;D:\u003c\/strong\u003e Supports dependable surface preparation for product testing and characterization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and Training Laboratories:\u003c\/strong\u003e Offers repeatable, user-friendly operation for teaching advanced microscopy techniques.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal thickness monitor with 1 nanometer precision and 1 Ångström resolution\u003c\/li\u003e\n\u003cli\u003eBoth pulsed and flash carbon fiber coating modes\u003c\/li\u003e\n\u003cli\u003eIntuitive touchscreen for simple control and real-time monitoring of the coating process, with fast data entry\u003c\/li\u003e\n\u003cli\u003eEasy-to-use software that can be updated over the network\u003c\/li\u003e\n\u003cli\u003eRecords coating parameters and plots them as graphs\u003c\/li\u003e\n\u003cli\u003eEasily interchangeable specimen stages, with a rotation stage included as standard\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty for added peace of mind\u003c\/li\u003e\n\u003cli\u003eCE conformity, confirming compliance with safety standards\u003c\/li\u003e\n\u003cli\u003eWorldwide public and product liability insurance coverage, protecting against property damage or personal injury caused by Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTouch Screen Control\u003c\/h2\u003e\n\u003cp\u003eThe Desk Carbon Coater is operated through a 7-inch color touchscreen that provides fully automatic control and data input, so even first-time users can work with it confidently. From this screen, operators can run the system and monitor vacuum levels, current readings, and deposition details, displayed either as digital values or as graphical curves. The system also stores records of the last 300 coatings, which can be pulled up at any time from the history page.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\n\u003cdiv style=\"text-align: start;\"\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dct1.webp?v=1792994736\" alt=\"Turbo Pumped Desk Carbon Coater- DCT\"\u003e\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/ccdct.webp?v=1792994736\" alt=\"Turbo Pumped Desk Carbon Coater- DCT\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eSample Holder of Vacuum Carbon Coater\u003c\/h2\u003e\n\u003cp\u003eThis turbo-pumped carbon coater supports versatile sample stage configurations that can be tailored to user requirements. The stages rotate, offer adjustable height, and swap out easily. For uniform coverage, particularly on porous specimens, the rotary planetary sample stage is the recommended choice.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/ccdct4.webp?v=1792994734\" alt=\"Turbo Pumped Desk Carbon Coater- DCT\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/ccdct3.webp?v=1792994733\" alt=\"Turbo Pumped Desk Carbon Coater- DCT\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"208d279\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eHigh vacuum turbo pump with a capacity of 90 l\/s (Leybold)\u003c\/li\u003e\n\u003cli\u003eTwo-stage rotary vane vacuum pump used as backing pumps\u003c\/li\u003e\n\u003cli\u003eFull range vacuum gauge (Leybold)\u003c\/li\u003e\n\u003cli\u003eVacuum chamber dimensions: 170 mm OD x 140 mm\u003c\/li\u003e\n\u003cli\u003e0-25 A switching pulsed DC power supply\u003c\/li\u003e\n\u003cli\u003eUltimate Vacuum: Less than 7 x 10^-7 torr\u003c\/li\u003e\n\u003cli\u003eDimensions: 450 mm (height) x 500 mm (width) x 370 mm (depth)\u003c\/li\u003e\n\u003cli\u003ePower requirements: 220V-240V, 50\/60Hz, 10A\u003c\/li\u003e\n\u003cli\u003eIntuitive touch screen with a colored display unit\u003c\/li\u003e\n\u003cli\u003eSample holder with planetary rotation capability\u003c\/li\u003e\n\u003cli\u003ePlasma Cleaning functionality\u003c\/li\u003e\n\u003cli\u003eElectronic shutter for precise control\u003c\/li\u003e\n\u003cli\u003eCoating process automatically controlled independently of pressure\u003c\/li\u003e\n\u003cli\u003ePrecision metering valve for fine vacuum pressure control\u003c\/li\u003e\n\u003cli\u003eReal-time plots displaying coating parameters\u003c\/li\u003e\n\u003cli\u003eConvenient data transfer of coating data plots via USB port to PC\u003c\/li\u003e\n\u003cli\u003eShipping Weight: 46 kilograms\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"9200552\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e\u003cstrong\u003eOptions and Accessories:\u003c\/strong\u003e\u003c\/p\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eHead and power supply for carbon rod\u003c\/li\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003ePlanetary sample rotation\u003c\/li\u003e\n\u003cli\u003eSpare vacuum glass chamber\u003c\/li\u003e\n\u003cli\u003eCarbon fiber\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279162310895,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/turbo-pumped-desk-carbon-coater.webp?v=1792994846"},{"product_id":"bell-jar-thermal-evaporation-system","title":"Bell-Jar Thermal Evaporation System","description":"\u003ch2 dir=\"ltr\" aria-level=\"4\"\u003eBell-Jar Thermal Evaporation System | ToronEva™ Bell Jar\u003c\/h2\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eAutomated Thin Film Deposition for Research Laboratories\u003c\/h3\u003e\n\u003cp dir=\"ltr\"\u003eThe ToronEva™ Bell Jar is a fully automated thermal evaporation system designed for thin film deposition in research and development settings. Resistive heating inside a high-vacuum chamber allows it to produce metal, oxide, and organic films at base pressures as low as 10⁻⁷ Torr. Panel-based control, short cycle times, and an adjustable source-to-substrate distance make operation straightforward and help conserve evaporation material. The chamber accommodates 4-inch wafers, 1×3-inch lamellae, and a range of other substrate sizes, so it adjusts readily as deposition needs change.\u003c\/p\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eHigh-Vacuum Performance and Compact Design\u003c\/h3\u003e\n\u003cp dir=\"ltr\"\u003ePairing a turbomolecular pump with a mechanical pump, and equipped with an SS316 flex hose and a dust filter, the system reaches 10⁻⁶ Torr in less than 30 minutes. Its vacuum range extends from 1000 to 10⁻⁹ Torr, with automatic vent, back-fill, and chamber-hold functions. The bell jar comes in either Pyrex glass or SS304. At 75×120 cm, the footprint is compact enough to pass through a standard 85 cm doorway, and lockable wheels allow easy positioning. A closed-cycle water cooler with automatic on\/off control manages the heat load during long deposition runs.\u003c\/p\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eSequential and Co-Evaporation Capability\u003c\/h3\u003e\n\u003cp dir=\"ltr\"\u003eThe ToronEva™ Bell Jar supports both sequential and co-evaporation processes, with an optional four-source configuration for either 4×1 sequential or 2×2 co-evaporation. A servo-controlled shutter serves two thermal sources at the same time. A dual-channel thickness monitor with one QCM tracks deposition rate and cumulative film thickness in real time. The proprietary source-chamber geometry prevents cross-contamination between materials, keeping film purity intact across consecutive runs. Sample rotation from 2 to 30 rpm promotes uniform deposition across the substrate surface.\u003c\/p\u003e\n\u003ch2\u003eBell-Jar Thermal Evaporation System | ToronEva™ Bell Jar Applications\u003c\/h2\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronevatm-bell-jar-1385438475.webp?v=1792995191\" alt=\"Bell-Jar Thermal Evaporation System\"\u003e\u003c\/p\u003e\n\u003ch3\u003eWhere the ToronEva™ Bell Jar Is Used\u003c\/h3\u003e\n\u003cp\u003eThe ToronEva™ Bell Jar meets thin film deposition needs in research institutions, university laboratories, and specialized industrial facilities that require a laboratory vacuum coater for controlled thin-film processes. Its flexible chamber configuration and choice of sample holders make it a good match for many substrate types and deposition materials.\u003c\/p\u003e\n\u003ch3\u003eKey Application Areas\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Research:\u003c\/strong\u003e Deposits metal, oxide, and organic films for fundamental materials science and device physics studies in campus laboratories.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor Device Fabrication:\u003c\/strong\u003e Forms metal contacts, gate electrodes, and dielectric layers on silicon wafers for transistor and IC prototype development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Research:\u003c\/strong\u003e Applies reflective and anti-reflective coatings to glass and crystal substrates for photonics and optical component development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOrganic Electronics and OLED Research:\u003c\/strong\u003e Provides controlled deposition of organic and metallic layers for organic photovoltaic cells, OLEDs, and thin-film transistor prototypes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMEMS and NEMS Fabrication:\u003c\/strong\u003e Supports metallization and functional film deposition during microelectromechanical and nanoelectromechanical device development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSolar Cell Research:\u003c\/strong\u003e Deposits contact layers and absorber films for laboratory-scale photovoltaic cell prototyping and efficiency studies.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterials Science and Surface Engineering:\u003c\/strong\u003e Enables thin film characterization studies that demand precise control over film thickness, composition, and deposition rate.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eBell-Jar Thermal Evaporation System | ToronEva™ Bell Jar Key Features\u003c\/h2\u003e\n\u003ch3\u003eBuilt for Reproducible, Contamination-Free Deposition\u003c\/h3\u003e\n\u003cp\u003eThe ToronEva™ Bell Jar delivers high-vacuum performance together with features focused on repeatability, contamination control, and simple operation in research laboratory environments.\u003c\/p\u003e\n\u003ch3\u003eVacuum and Automation Features\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automated Vacuum Management:\u003c\/strong\u003e Panel control and quick cycle times cut down operator steps and preparation time between consecutive deposition runs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁷ Torr Base Pressure with Fast Pump-Down:\u003c\/strong\u003e The system reaches a 10⁻⁶ Torr working pressure in less than 30 minutes, shortening cycle time during multi-run sessions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTurbomolecular and Mechanical Pump Stack:\u003c\/strong\u003e The paired pumps, together with an SS316 flex hose and dust filter, deliver clean, low-contamination vacuum across the full operating range.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e An integrated control and measurement system with automatic vent and back-fill removes the need for manual valve operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Touch Vent Control:\u003c\/strong\u003e A single button starts the automatic vacuum management sequence, making chamber access simple without stepwise manual procedures.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePower-Failure Auto Shut-Off with Vacuum Hold:\u003c\/strong\u003e The system shuts down safely when power is lost and keeps the chamber under vacuum, protecting samples and preserving the deposition environment.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIntegrated Closed-Cycle Water Cooler:\u003c\/strong\u003e Automatic thermal management switches cooling on and off as needed, protecting the system during continuous operation.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eChamber and Sample Handling\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003ePyrex Glass or SS304 Bell Jar:\u003c\/strong\u003e Operators can choose the chamber material that suits their process chemistry, and standard 1-inch ports allow flexible feedthrough integration.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVersatile Sample Holder Selection:\u003c\/strong\u003e Holders accommodate 4-inch wafers, 1×3-inch lamellae, and small to large samples, all with straightforward loading.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdjustable Source-Substrate Distance:\u003c\/strong\u003e Repositioning the source relative to the substrate optimizes deposition angle and rate distribution without any chamber modification.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Internal Protection Jacket:\u003c\/strong\u003e This jacket shields the chamber interior from direct evaporant exposure, extending service intervals and simplifying cleanup after deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Sample Rotation:\u003c\/strong\u003e Adjustable substrate rotation distributes vapor flux evenly, improving film thickness uniformity across the substrate area.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eEvaporation Sources and Process Control\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional Four-Source Configuration:\u003c\/strong\u003e Supports 4×1 sequential or 2×2 co-evaporation to deposit alloy, compound, or multilayer films in a single pump-down cycle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2000 W Thermal Evaporation Power Supply:\u003c\/strong\u003e An output range of 10 V to 200 A handles both low-melting organics and high-temperature metals in one unit.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCross-Contamination Elimination Design:\u003c\/strong\u003e Proprietary source-chamber geometry prevents evaporant cross-contact between sources and chamber walls, preserving material purity.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDual-Channel Thickness Monitor with QCM:\u003c\/strong\u003e Provides real-time monitoring of deposition rate and cumulative film thickness across two independent sources at once.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eServo-Controlled Dual-Source Shutter:\u003c\/strong\u003e One shared, servo-actuated shutter starts and stops deposition for both thermal sources simultaneously.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eUsability, Footprint, and Warranty\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eOperator-Friendly Interface:\u003c\/strong\u003e An intuitive control layout and clear display shorten the learning curve for new users and speed up daily laboratory operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact Mobile Platform:\u003c\/strong\u003e The 75×120 cm footprint sits on lockable wheels, offering stable positioning while still allowing the system to be moved within the laboratory.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard Doorway Clearance:\u003c\/strong\u003e The system fits through a standard 85 cm doorway, removing installation and relocation barriers in buildings with conventional corridor widths.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Full Warranty:\u003c\/strong\u003e Coverage for design, materials, and workmanship gives laboratories confidence in long-term reliability and manufacturer accountability.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eBell-Jar Thermal Evaporation System | ToronEva™ Bell Jar Theory and Method\u003c\/h2\u003e\n\u003ch3\u003eHow Thermal Evaporation Works\u003c\/h3\u003e\n\u003cp\u003eThermal evaporation forms thin films by heating a source material to its vaporization point inside a high-vacuum chamber. A high-current, low-voltage power supply passes electrical current through a resistive source, such as a tungsten boat, coil, or basket. The vaporized atoms then move in straight lines through the vacuum and condense on substrate surfaces positioned above the source. Below 10⁻⁵ Torr, residual gas molecules are too sparse to scatter the vapor atoms, which results in high-purity films.\u003c\/p\u003e\n\u003ch3\u003eVacuum System and Power Supply\u003c\/h3\u003e\n\u003cp\u003eFilm quality depends on the vacuum system just as much as on the source material. A turbomolecular pump backed by a mechanical pump evacuates the chamber to base pressures below 10⁻⁷ Torr, bringing residual gas contamination down to negligible levels. Automatic vent and back-fill functions allow the operator to cycle the chamber without manual valve operation, while a hold-vacuum mode preserves the environment between depositions. The 2000 W (10 V to 200 A) power supply covers both low-melting organics and high-temperature refractory metals in a single unit.\u003c\/p\u003e\n\u003ch3\u003eThickness Monitoring and Uniformity\u003c\/h3\u003e\n\u003cp\u003eA dual-channel deposition controller and a quartz crystal microbalance (QCM) track film thickness in real time. As film mass builds up on the oscillating QCM crystal, its resonant frequency shifts in proportion to the deposited thickness, a relationship described by the Sauerbrey equation. The controller continuously converts this frequency shift into a thickness reading without interrupting deposition. Sample rotation at 2 to 30 rpm spreads the vapor flux evenly across the substrate, improving film uniformity.\u003c\/p\u003e\n\u003ch2\u003eBell-Jar Thermal Evaporation System - ToronEva™ Bell Jar Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Evaporation Power Supply\u003c\/td\u003e\n\u003ctd\u003e2000 W (10 V – 200 A)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum Level (Pump-Down Time)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁶ Torr in ≤30 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Hose\u003c\/td\u003e\n\u003ctd\u003eSS316 flex hose with dust filter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBell-Jar Material\u003c\/td\u003e\n\u003ctd\u003ePyrex glass or SS304 cylinder\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBell-Jar Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInternal Protection Jacket\u003c\/td\u003e\n\u003ctd\u003eSS304 cylindrical\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Holder Options\u003c\/td\u003e\n\u003ctd\u003e4-inch wafer; 1×3-inch lamellae; small and large samples\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSource-to-Substrate Distance\u003c\/td\u003e\n\u003ctd\u003eAdjustable\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel thickness monitor + one QCM\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStandard Number of Thermal Sources\u003c\/td\u003e\n\u003ctd\u003e2\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOptional Source Configuration\u003c\/td\u003e\n\u003ctd\u003e4 sources (4×1 sequential or 2×2 co-evaporation)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShutter\u003c\/td\u003e\n\u003ctd\u003eServo-controlled, common to two thermal sources\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eClosed-cycle water cooler (automatic on\/off)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Management Functions\u003c\/td\u003e\n\u003ctd\u003eAutomatic vent, back-fill, and chamber-hold\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard 85 cm doorway\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279227027695,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/bell-jar-thermal-evaporation-sys.webp?v=1792995177"},{"product_id":"desk-sputter-carbon-coater-dscr","title":"Desk Sputter \u0026 Carbon Coater - DSCR","description":"\u003ch2\u003eDesk Sputter \u0026amp; Carbon Coater – DSCR\u003c\/h2\u003e\n\u003cp\u003eThe Desk Sputter \u0026amp; Carbon Coater DSCR is a compact benchtop coating system that brings sputtering and carbon coating together in a single instrument. It sputters noble metals such as gold (Au), palladium (Pd), platinum (Pt), and gold\/palladium (Au\/Pd) onto non-conductive or poorly conductive specimens, and it can also deposit carbon films onto samples.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cp\u003eThe DSCR desk sputter coater was developed as a sample preparation tool for Scanning Electron Microscopy (SEM). A built-in rotary pump reaches a vacuum level below 50 mTorr, a range that suits both noble metal sputter coating and carbon fiber evaporation coating.\u003c\/p\u003e\n\u003cp\u003eFor sputter deposition of oxidizing metals, Field Emission SEM (FE-SEM), SEM with Energy Dispersive X-ray Spectroscopy (SEM EDX), and Transmission Electron Microscopy (TEM) sample preparation, other models such as the DST1, DSCT, and DCT are recommended, as they are better matched to these requirements.\u003c\/p\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eSimple, straightforward operation\u003c\/li\u003e\n\u003cli\u003eIntuitive touchscreen for managing the coating process and entering data quickly\u003c\/li\u003e\n\u003cli\u003eEasy-to-use software with both fully automatic and semi-automatic control modes\u003c\/li\u003e\n\u003cli\u003eQuick, effortless specimen loading and unloading\u003c\/li\u003e\n\u003cli\u003eConsistent film thickness for repeatable results\u003c\/li\u003e\n\u003cli\u003ePrecise, reproducible coatings\u003c\/li\u003e\n\u003cli\u003eHigh-resolution fine coatings, with gold grain size on the order of 2 nm\u003c\/li\u003e\n\u003cli\u003eLow-voltage sputtering\u003c\/li\u003e\n\u003cli\u003eGLAD (Glancing Angle Deposition) sputtering\u003c\/li\u003e\n\u003cli\u003ePlasma cleaning\u003c\/li\u003e\n\u003cli\u003eNo cooling system required\u003c\/li\u003e\n\u003cli\u003eCarbon coating in both flash and pulse modes\u003c\/li\u003e\n\u003cli\u003eDual carbon fiber configuration for thicker layer deposition\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty for added peace of mind\u003c\/li\u003e\n\u003cli\u003eCE conformity, confirming compliance with safety standards\u003c\/li\u003e\n\u003cli\u003eWorldwide public and product liability insurance coverage, protecting against property damage or personal injury caused by Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003ePulsed Carbon Fiber Evaporation\u003c\/h2\u003e\n\u003cp\u003eThe compact chamber of this desk vacuum sputter and carbon coater supports pulsed carbon fiber evaporation. Short pulses give finer, more controlled deposition and significantly reduce the debris commonly associated with conventional carbon deposition.\u003c\/p\u003e\n\u003ch2\u003eCarbon Coating Head\u003c\/h2\u003e\n\u003cp\u003eThe DSCR features an interchangeable carbon coating head. It can hold two carbon fibers, each 0.8 mm in diameter, making it possible to deposit thicker carbon films whenever an application calls for them.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DCT-Carbon-Fiber-Eva.webp?v=1792995490\" alt=\"Desk Sputter \u0026amp; Carbon Coater - DSCR\"\u003e\u003c\/p\u003e\n\u003ch2\u003eColor Touchscreen Control\u003c\/h2\u003e\n\u003cp\u003eThe DSCR, also referred to as the Desk SEM Coater, comes with a 7-inch color touchscreen that provides full automatic control and data entry. The interface is simple enough for users with limited experience. Vacuum levels, current readings, and deposition details can be monitored directly on the screen, shown either as digital values or as graphical curves. The system also stores data from the last 300 coatings, which can be reviewed easily on the history page.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DSCR-Touch-Screen-Sq_c0a5798c-2e91-47eb-9002-2b9fe1e54f87.webp?v=1792995502\" alt=\"Desk Sputter \u0026amp; Carbon Coater - DSCR\"\u003e\u003c\/p\u003e\n\u003ch2\u003eSample Stages\u003c\/h2\u003e\n\u003cp\u003eThe DSCR supports several sample stage configurations to meet different user needs. The stages rotate, offer adjustable height, and are easy to swap. The rotary planetary sample stage is especially well suited to achieving uniform coatings, particularly on porous specimens.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DSR1-Sample-Holder-S.webp?v=1792995546\" alt=\"Desk Sputter \u0026amp; Carbon Coater - DSCR\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DSR1-Sample-Planetar.webp?v=1792995542\" alt=\"Desk Sputter \u0026amp; Carbon Coater - DSCR\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DSR1-Sample-Planetar_1.webp?v=1792995543\" alt=\"Desk Sputter \u0026amp; Carbon Coater - DSCR\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DSR1-Sample-Rotation.webp?v=1792995541\" alt=\"Desk Sputter \u0026amp; Carbon Coater - DSCR\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp\u003eThe Desk Sputter and Carbon Coater includes a rotary pump and can be configured for DC sputtering and carbon fiber (thread) coating using interchangeable heads, all within one instrument. The DSCR is a flexible machine built for preparing samples for scanning electron microscopy (SEM).\u003c\/p\u003e\n\u003cp\u003eTo observe non-conductive or poorly conductive specimens in a scanning electron microscope, their surface conductivity must be raised during sample preparation before SEM imaging.\u003c\/p\u003e\n\u003cp\u003eSputter deposition and carbon evaporation are both standard sample preparation methods in electron microscopy. The full automation option keeps the system easy to run, even for operators with minimal experience. Software with graphical interfaces makes deposition information easier to interpret and improves overall usability.\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003e\n\u003ci class=\"fa-solid fa-file-pen\"\u003e\u003c\/i\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"de557b9\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eTwo-stage, direct-drive rotary vane pump with a pumping capacity of 4m3\/h\u003c\/li\u003e\n\u003cli\u003eVacuum chamber made of Pyrex with dimensions of 170 mm outer diameter (OD) x 140 mm\u003c\/li\u003e\n\u003cli\u003eOverall dimensions: 45 cm (height) x 50 cm (width) x 37 cm (depth)\u003c\/li\u003e\n\u003cli\u003eEquipped with a 2-inch magnetron cathode\u003c\/li\u003e\n\u003cli\u003eUltimate Vacuum: Less than 50 millitorr\u003c\/li\u003e\n\u003cli\u003eSample stage with planetary rotation capability\u003c\/li\u003e\n\u003cli\u003eIncludes a thermocouple vacuum gauge\u003c\/li\u003e\n\u003cli\u003eQuartz crystal thickness monitor with a precision of 1 nanometer\u003c\/li\u003e\n\u003cli\u003eElectrical control shutter for precise control of coating process\u003c\/li\u003e\n\u003cli\u003eAutomatic venting valve for operational convenience\u003c\/li\u003e\n\u003cli\u003eCapability to save data from the last 300 coatings carried out\u003c\/li\u003e\n\u003cli\u003ePower requirements: 220V-240V, 50\/60Hz, 10A\u003c\/li\u003e\n\u003cli\u003e80 Watt DC switching power supply\u003c\/li\u003e\n\u003cli\u003eData transfer capability via USB port to PC\u003c\/li\u003e\n\u003cli\u003eShipping Weight: 42 kilograms\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"42b94e1\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories:\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eCarbon rod evaporation head\u003c\/li\u003e\n\u003cli\u003eHigh current power supply designed for carbon rod\u003c\/li\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003ePlanetary sample rotation capability\u003c\/li\u003e\n\u003cli\u003eSpare glass vacuum chamber\u003c\/li\u003e\n\u003cli\u003eSputtering targets\u003c\/li\u003e\n\u003cli\u003eCarbon fiber for coating\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279271395567,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/desk-sputter-carbon-coater-dscr1.webp?v=1792995683"},{"product_id":"bell-jar-thermal-evaporation-sputtering-system","title":"Bell-Jar Thermal Evaporation \u0026 Sputtering System","description":"\u003ch2\u003eBell-Jar Thermal Evaporation and Sputtering System: ToronEva™ BJT\u003c\/h2\u003e\n\u003ch3\u003eSystem Overview\u003c\/h3\u003e\n\u003cp\u003eToronEva™ BJT is a fully automated bell-jar system built for research-grade PVD thin film deposition, combining thermal evaporation and sputtering in a single chamber. One 2-inch DC sputter gun and two thermal evaporation sources share the chamber, so users can run deposition steps in sequence or at the same time without breaking vacuum. DC and RF sputtering options, three-channel MFC gas control, and a 1-hour cycle time support both standard and reactive deposition processes. The system reaches a base pressure of 10⁻⁷ Torr, and a working pressure of 10⁻⁶ Torr is achieved in under 30 minutes.\u003c\/p\u003e\n\u003ch3\u003eSputtering and Gas Control\u003c\/h3\u003e\n\u003cp\u003eSputtering power can be selected as 600 VDC at 3 A DC or 300 W at 13.56 MHz RF, which accommodates both conductive and insulating target materials. A three-channel MFC system regulates Ar, N₂, and O₂ inputs with 0.1 sccm sensitivity and real-time digital mixing, enabling both inert and reactive gas sputtering. Throttle, vent, and isolation valves give operators precise manual control of pressure across the 1 to 100 mTorr sputter working range. Automatic venting and N₂ back-fill streamline chamber cycling between depositions.\u003c\/p\u003e\n\u003ch3\u003eThermal Evaporation and Substrate Handling\u003c\/h3\u003e\n\u003cp\u003eThe thermal evaporation side is powered by a 2000 W supply (8 V to 300 A) and features a proprietary box-source design that keeps evaporants from cross-contacting and prevents chamber contamination. Sample holders accommodate 2\", 3\", and 4\" wafers, 1×3\" lamellae, and small samples secured with spring clips, covering a broad range of substrate geometries. The source-to-substrate distance is adjustable, allowing users to tune deposition rate and uniformity. An optional stainless steel (SS) bell jar with hoist extends the system to larger substrates or batch loads.\u003c\/p\u003e\n\u003ch2\u003eBell-Jar Thermal Evaporation and Sputtering System: ToronEva™ BJT Applications\u003c\/h2\u003e\n\u003ch3\u003eCombined PVD for Research Workflows\u003c\/h3\u003e\n\u003cp\u003eThe ToronEva™ BJT meets the rising demand for multi-method PVD capability in research laboratories where several deposition techniques must fit into a single workflow. Its hybrid thermal evaporation and sputtering configuration saves equipment floor space and removes the cross-contamination risk that comes from moving substrates between separate systems.\u003c\/p\u003e\n\u003ch3\u003eTypical Applications\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Research Laboratories:\u003c\/strong\u003e Deposit metallic, oxide, and compound thin films for materials science and device physics studies that call for both evaporated and sputter-deposited layers within a single vacuum cycle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor Device Prototyping:\u003c\/strong\u003e Fabricate metal contacts, gate oxides, and dielectric layers on silicon wafers by combining sequential evaporation with reactive sputter deposition, all without breaking vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOrganic Electronics and OLED Research:\u003c\/strong\u003e Thermally evaporate organic emitter layers and pair them with sputter-deposited transparent conductive oxide contacts for OLED and organic photovoltaic device development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Coating Research:\u003c\/strong\u003e Produce metallic mirrors, anti-reflective stacks, and optical filters by RF sputtering oxide layers and thermally evaporating metal overlayers.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMEMS and NEMS Fabrication:\u003c\/strong\u003e Deposit metallization and functional films by combining sputter-deposited adhesion layers with thermally evaporated overlayers for microdevice prototype development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSolar Cell and Photovoltaic Research:\u003c\/strong\u003e Deposit contact, absorber, and buffer layers through both evaporation and reactive sputtering to prototype thin-film photovoltaic cell structures.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterials Science and Surface Engineering:\u003c\/strong\u003e Study thin film composition and properties across co-deposited or sequentially deposited material systems in a controlled reactive gas environment.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003e\n\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronevatm-bell-jar-1385438475_1.webp?v=1792996047\" alt=\"Bell-Jar Thermal Evaporation \u0026amp; Sputtering System\"\u003eBell-Jar Thermal Evaporation and Sputtering System: ToronEva™ BJT Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronEva™ BJT brings thermal evaporation and DC\/RF magnetron sputtering together on a single bell-jar platform. Two deposition methods share one vacuum system, which adds flexibility without adding equipment.\u003c\/p\u003e\n\u003ch3\u003eVacuum and Chamber Design\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automated Vacuum Management with 1-Hour Cycle Time:\u003c\/strong\u003e Panel-controlled operation completes a full vent-to-deposition cycle in about one hour, keeping downtime between runs to a minimum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePyrex Glass or SS304 Bell Jar:\u003c\/strong\u003e Operators can choose the chamber material that suits their process chemistry. Standard 1-inch ports on the base plate allow flexible feedthrough integration.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Internal Protection Jacket:\u003c\/strong\u003e This liner shields the chamber interior from direct evaporant exposure, which limits contamination buildup and extends service intervals.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁷ Torr Base Pressure with Rapid Pump-Down:\u003c\/strong\u003e The system reaches a 10⁻⁶ Torr working pressure in under 30 minutes, supporting fast cycle times for both evaporation and sputtering runs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTurbomolecular and Mechanical Pump Stack:\u003c\/strong\u003e The paired pumps, together with an SS316 flex hose and dust filter, deliver clean, low-contamination vacuum down to UHV levels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e An integrated control and measurement system with automatic vent and N₂ back-fill removes the need for manual valve sequencing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eIntegrated Closed-Cycle Water Cooler:\u003c\/strong\u003e Automatic thermal management switches cooling on and off to protect system components during continuous operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePower-Failure Auto Shut-Off with Vacuum Hold:\u003c\/strong\u003e If power is lost, the system shuts down safely and holds chamber vacuum, which protects samples and prevents exposure to atmosphere.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Touch Vent Control:\u003c\/strong\u003e A single button starts the automatic vacuum sequence for chamber access, replacing step-by-step manual valve procedures.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eThermal Evaporation Capabilities\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e2000 W Thermal Evaporation Power Supply:\u003c\/strong\u003e An output of 8 V to 300 A, across a wide current range, drives resistive evaporation of metals, organics, and alloys.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eProprietary Box-Source Evaporation Design:\u003c\/strong\u003e Two thermal sources sit inside a box enclosure that prevents cross-source and chamber contamination, preserving material purity across consecutive depositions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eServo-Controlled Dual-Source Shutter:\u003c\/strong\u003e One shared, servo-actuated shutter controls deposition start and stop timing for both thermal sources at once.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSputtering Capabilities\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e2-Inch DC Sputter Gun:\u003c\/strong\u003e Mounted on the base plate, the gun provides direct line-of-sight deposition onto substrates loaded above the source.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC or RF Sputtering Power Supply:\u003c\/strong\u003e A 600 VDC, 3 A switching supply handles conductive targets, while the 300 W, 13.56 MHz RF option extends capability to dielectrics and insulators.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThree-Channel MFC Gas Control:\u003c\/strong\u003e Real-time digital management of Ar, N₂, and O₂ flows at 0.1 sccm sensitivity produces stable gas compositions for inert and reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePrecision Sputter Pressure Control (1 to 100 mTorr):\u003c\/strong\u003e Throttle, vent, and isolation valves permit fine manual adjustment of working pressure across the full sputter operating range.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eArgon and Reactive Gas Sputtering:\u003c\/strong\u003e Oxide and nitride thin films can be deposited directly with N₂ or O₂ reactive gas, so compound targets are not required.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCombined DC-RF Sputtering and Thermal Evaporation Options:\u003c\/strong\u003e Thermal evaporation and sputter sources can run within the same cycle, enabling heterogeneous multi-layer film stacks in a single vacuum cycle.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSubstrate Handling and Geometry\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eMulti-Format Sample Holder Selection:\u003c\/strong\u003e Holders accommodate 2\", 3\", and 4\" wafers, 1×3\" lamellae, and small samples secured with spring clips, covering a broad range of substrate geometries.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdjustable Source-Substrate Distance:\u003c\/strong\u003e Deposition geometry can be optimized for both evaporation and sputtering processes without modifying the chamber.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional SS Bell Jar with Hoist:\u003c\/strong\u003e This stainless steel bell-jar upgrade includes an integrated hoist mechanism that simplifies chamber access for systems handling larger substrate loads.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eFootprint, Installation, and Warranty\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact Mobile Platform with Intuitive Interface:\u003c\/strong\u003e The 75×120 cm footprint sits on lockable wheels, and a clear, operator-friendly control layout suits daily laboratory use.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard Doorway Clearance:\u003c\/strong\u003e The system fits through a standard 85 cm doorway, removing installation barriers in buildings with conventional corridor widths.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Full Warranty:\u003c\/strong\u003e Coverage for design, materials, and workmanship gives buyers confidence in long-term system reliability.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eBell-Jar Thermal Evaporation and Sputtering System: ToronEva™ BJT Theory and Method\u003c\/h2\u003e\n\u003ch3\u003eTwo Complementary PVD Mechanisms\u003c\/h3\u003e\n\u003cp\u003eThe ToronEva™ BJT runs two complementary PVD mechanisms, thermal evaporation and magnetron sputtering, inside a shared bell-jar chamber. Each method suits different film requirements, and having both in one vacuum system lets researchers match the deposition technique to the material.\u003c\/p\u003e\n\u003ch3\u003eThermal Evaporation\u003c\/h3\u003e\n\u003cp\u003eIn thermal evaporation, the 2000 W power supply heats a resistive boat, coil, or basket until the source material vaporizes. The resulting atoms travel in a line-of-sight path through the high vacuum and condense on the substrate positioned above. This approach is preferred for high-purity metallic and organic films, particularly where substrate heating and ion bombardment need to be kept to a minimum.\u003c\/p\u003e\n\u003ch3\u003eDC and RF Magnetron Sputtering\u003c\/h3\u003e\n\u003cp\u003eSputtering bombards a solid target with energetic ions drawn from a low-pressure argon plasma. In the DC magnetron configuration, a magnetic field holds the plasma close to the target surface, which raises sputter yield and deposition rate. Sputtered atoms reach the substrate with higher kinetic energy than thermally evaporated atoms, resulting in denser films with stronger adhesion and better step coverage. The 13.56 MHz RF supply extends the process to insulating targets, such as oxides and nitrides, that cannot sustain a DC plasma.\u003c\/p\u003e\n\u003ch3\u003eReactive Sputtering and Multi-Material Structures\u003c\/h3\u003e\n\u003cp\u003eReactive sputtering introduces N₂ or O₂ through MFC-controlled gas lines, forming nitride or oxide films directly at the substrate and removing the need for compound targets. The three-channel MFC system sets each gas flow independently at 0.1 sccm resolution, while throttle valve control holds working pressure steady across the 1 to 100 mTorr range. Pairing reactive sputter-deposited layers with thermally evaporated metal overlayers produces multi-material structures without breaking vacuum, which keeps interfaces clean. A servo-controlled shutter times deposition across both thermal sources at once.\u003c\/p\u003e\n\u003ch2\u003eBell-Jar Thermal Evaporation \u0026amp; Sputtering System - ToronEva™ BJT Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"806\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Evaporation Power Supply\u003c\/td\u003e\n\u003ctd\u003e2000 W (8 V – 300 A)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Power Supply\u003c\/td\u003e\n\u003ctd\u003e600 VDC, 3 A (DC) or 300 W, 13.56 MHz (RF)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum Level (Pump-Down Time)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁶ Torr in ≤30 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCycle Time\u003c\/td\u003e\n\u003ctd\u003e~1 hour (vent to deposition)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputter Working Pressure Range\u003c\/td\u003e\n\u003ctd\u003e1 to 100 mTorr (manual via throttle valve)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Hose\u003c\/td\u003e\n\u003ctd\u003eSS316 flex hose with dust filter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBell-Jar Material\u003c\/td\u003e\n\u003ctd\u003ePyrex glass or SS304 cylinder\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBell-Jar Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, on base plate\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInternal Protection Jacket\u003c\/td\u003e\n\u003ctd\u003eSS304 cylindrical\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputter Gun\u003c\/td\u003e\n\u003ctd\u003e1 × 2-inch DC sputter gun (base plate mounted)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Evaporation Sources\u003c\/td\u003e\n\u003ctd\u003e2 (proprietary box-source design)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Holder Options\u003c\/td\u003e\n\u003ctd\u003e2\", 3\", 4\" wafers; 1×3\" lamellae; small sample spring holder\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSource-to-Substrate Distance\u003c\/td\u003e\n\u003ctd\u003eAdjustable\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂; MFC-controlled, 3-channel, 0.1 sccm sensitivity\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Control\u003c\/td\u003e\n\u003ctd\u003eReal-time digital; independent channel mixing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eThrottle, vent, and isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Modes\u003c\/td\u003e\n\u003ctd\u003eDC Argon; reactive (N₂ or O₂)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShutter\u003c\/td\u003e\n\u003ctd\u003eServo-controlled, common to two thermal sources\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eClosed-cycle water cooler (automatic on\/off)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Management Functions\u003c\/td\u003e\n\u003ctd\u003eAutomatic vent; N₂ back-fill\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard 85 cm doorway\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOptional Configurations\u003c\/td\u003e\n\u003ctd\u003eDC-RF combined sputtering; SS bell jar with hoist\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279310815471,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/bell-jar-thermal-evaporation-spu.webp?v=1792996017"},{"product_id":"electron-beam-evaporation-system","title":"Electron Beam Evaporation System","description":"\u003ch2\u003eElectron Beam Evaporation System: ToronEva™ EB\u003c\/h2\u003e\n\u003ch3\u003eHigh-Vacuum E-Beam Deposition for Metals, Alloys, and Refractory Oxides\u003c\/h3\u003e\n\u003cp\u003eToronEva™ EB is a high-vacuum electron beam evaporation system built for thin film deposition of metals, alloys, and oxides with high melting points. Its e-beam gun runs at 10 kV with beam current up to 600 mA, depositing materials such as Al, Pt, Ni, TiO₂, and SiO₂ while recipe-based control adjusts the deposition rate. The SS304 chamber achieves a base pressure of 10⁻⁸ Torr, satisfying the purity standards of demanding PVD research applications. Additional 2500 W thermal sources enable co-evaporation and doping within the same vacuum cycle.\u003c\/p\u003e\n\u003ch3\u003eSubstrate Heating, Rotation, and Film Uniformity\u003c\/h3\u003e\n\u003cp\u003ePID-regulated substrate heating spans 50 to 700 °C with ±1 °C sensitivity. Paired with rotation from 2 to 30 rpm, it delivers film thickness uniformity better than 3% across 4-inch substrates. The system handles 3\", 4\", and 6\" wafers, as well as sample attachments from 1 to 15 cm. A dual-channel thickness controller with two QCMs tracks deposition rate in real time down to 0.1 Å\/s.\u003c\/p\u003e\n\u003ch3\u003eAutomated Computer Control\u003c\/h3\u003e\n\u003cp\u003eFully automatic operation runs through LabVIEW-based software and real-time LCD displays. This control platform coordinates vacuum sequencing, interlocks, and power delivery.\u003c\/p\u003e\n\u003ch3\u003eReactive Evaporation and Gas Management\u003c\/h3\u003e\n\u003cp\u003eA digital mass flow meter system regulates Ar, N₂, O₂, He, and CH₄ inputs with 0.2 sccm sensitivity, supporting reactive evaporation and process gas control. An integrated plasma cleaning unit (ICP, CCP, and DC-RF) conditions substrate surfaces before deposition and removes contamination at the interface.\u003c\/p\u003e\n\u003ch3\u003eChamber Design, Throughput, and Port Configuration\u003c\/h3\u003e\n\u003cp\u003eThe electro-polished, water-cooled chamber includes a UV-blocking observation window and supports a 1.5-hour experiment cycle, which allows four to six deposition runs per day. Configurable 1-inch, QF, CF, and ISO ports provide room for extra thermal sources and process feedthroughs as required.\u003c\/p\u003e\n\u003ch2\u003eToronEva™ EB Electron Beam Evaporation System Applications\u003c\/h2\u003e\n\u003ch3\u003eSingle-Platform Thin Film Deposition for Refractory Metals and Complex Oxides\u003c\/h3\u003e\n\u003cp\u003eThe ToronEva™ EB supports thin film research programs that call for high-purity deposition of refractory metals and complex oxide materials, which resistive evaporation alone cannot process. Substrate heating, reactive gas capability, and in-situ plasma cleaning combine in one platform, covering applications that would otherwise require several separate deposition tools.\u003c\/p\u003e\n\u003ch3\u003eSemiconductor and Microelectronics Research\u003c\/h3\u003e\n\u003cp\u003eResearchers use the system to deposit gate dielectrics, metal contacts, and passivation layers, including TiO₂, SiO₂, Pt, and Ni, on wafers up to 6 inches in size.\u003c\/p\u003e\n\u003ch3\u003eOptical Thin Film Research\u003c\/h3\u003e\n\u003cp\u003eThe system deposits high-refractive-index oxide layers and metallic mirrors for photonic devices, optical filters, and anti-reflective coatings.\u003c\/p\u003e\n\u003ch3\u003eAcademic and University PVD Laboratories\u003c\/h3\u003e\n\u003cp\u003eIt enables research-grade thin film fabrication for materials science, device physics, and condensed matter studies that require vacuum levels below 10⁻⁷ Torr.\u003c\/p\u003e\n\u003ch3\u003eMEMS and NEMS Device Fabrication\u003c\/h3\u003e\n\u003cp\u003eConformal metallization and functional oxide deposition support prototype development of sensors, actuators, and resonators.\u003c\/p\u003e\n\u003ch3\u003eOrganic Electronics and Photovoltaics\u003c\/h3\u003e\n\u003cp\u003eThe platform deposits transparent conductive oxide contacts and metallic electrodes onto organic device stacks, with precise control over deposition rate and substrate temperature.\u003c\/p\u003e\n\u003ch3\u003eHard Coating and Surface Engineering Research\u003c\/h3\u003e\n\u003cp\u003eE-beam deposition of wear-resistant oxide, nitride, and metallic films serves tribology and materials durability studies.\u003c\/p\u003e\n\u003ch3\u003eReactive Oxide and Nitride Film Research\u003c\/h3\u003e\n\u003cp\u003eControlled reactive deposition, using process gas introduction with metallic sources, produces TiO₂, SiO₂, Al₂O₃, TiN, and related compound films.\u003c\/p\u003e\n\u003ch2\u003eToronEva™ EB Electron Beam Evaporation System Key Features\u003c\/h2\u003e\n\u003ch3\u003eComplete High-Vacuum PVD Platform for Demanding Research\u003c\/h3\u003e\n\u003cp\u003eThe ToronEva™ EB brings together a 10 kV e-beam source, PID substrate heating, multi-channel gas control, in-situ plasma cleaning, and auxiliary thermal sources within one high-vacuum platform designed for demanding research PVD applications.\u003c\/p\u003e\n\u003ch3\u003e10 kV, 600 mA E-Beam Power Supply with Arc Protection\u003c\/h3\u003e\n\u003cp\u003eThis high-voltage supply focuses beam energy on the target, while active arc protection guards against discharge damage when depositing insulating or reactive materials.\u003c\/p\u003e\n\u003ch3\u003eElectro-Polished SS304 Vacuum Chamber\u003c\/h3\u003e\n\u003cp\u003eThe chamber is available in a prismatic or cylindrical form, with water-cooled, electro-polished surfaces and an SS304 liner. This construction limits particulate generation and makes post-deposition cleaning easier.\u003c\/p\u003e\n\u003ch3\u003e10⁻⁸ Torr Base Pressure\u003c\/h3\u003e\n\u003cp\u003eA turbomolecular and mechanical pump combination (dry pump optional) reaches a base pressure of 10⁻⁸ Torr. A fully loaded system attains a working pressure of 10⁻⁷ Torr in one hour.\u003c\/p\u003e\n\u003ch3\u003eWide-Range Vacuum Control with Pressure Fix (1000 to 10⁻⁹ Torr)\u003c\/h3\u003e\n\u003cp\u003eThe integrated vacuum control and measurement system lets the operator set a target pressure and hold it throughout deposition.\u003c\/p\u003e\n\u003ch3\u003e50 to 700 °C PID Substrate Heating\u003c\/h3\u003e\n\u003cp\u003eClosed-loop temperature control with ±1 °C sensitivity covers a broad substrate temperature range, promoting crystallinity and adhesion in oxide and functional films.\u003c\/p\u003e\n\u003ch3\u003e2 to 30 rpm Substrate Rotation with Homogeneity Control\u003c\/h3\u003e\n\u003cp\u003eContinuously adjustable rotation, set from the panel or a PC, delivers film thickness homogeneity better than 3% across 4-inch samples.\u003c\/p\u003e\n\u003ch3\u003eMulti-Format Sample Holder Selection\u003c\/h3\u003e\n\u003cp\u003eThe holder options accommodate 3\", 4\", and 6\" wafers, along with sample attachments from 1 to 15 cm, to suit a wide variety of substrate geometries.\u003c\/p\u003e\n\u003ch3\u003eRecipe-Controlled Deposition of Metals and Oxides\u003c\/h3\u003e\n\u003cp\u003ePre-set deposition recipes govern the e-beam power ramp and rate for Al, Pt, Ni, TiO₂, SiO₂, and other materials at high evaporation rates.\u003c\/p\u003e\n\u003ch3\u003e2500 W Sequential Thermal Sources for Co-Evaporation\u003c\/h3\u003e\n\u003cp\u003eAuxiliary 8 V to 300 A thermal sources add co-evaporation and doping capability within the same vacuum cycle. The source design prevents cross-contamination and allows easy source replacement.\u003c\/p\u003e\n\u003ch3\u003e0.1 Å\/s Dual-Channel Thickness Rate Controller with Two QCMs\u003c\/h3\u003e\n\u003cp\u003eTwo independent QCMs track deposition rate with 0.1 Å\/s precision. An optional ion gun can be added for further process control.\u003c\/p\u003e\n\u003ch3\u003eDigital Mass Flow Meter Gas Control (Ar, N₂, O₂, He, CH₄)\u003c\/h3\u003e\n\u003cp\u003eA panel- or PC-operated MFM system regulates multiple process gas inputs at 0.2 sccm sensitivity, supporting reactive deposition and controlled gas mixing.\u003c\/p\u003e\n\u003ch3\u003eICP, CCP, and DC-RF Plasma Cleaning Unit\u003c\/h3\u003e\n\u003cp\u003eIn-situ conditioning of the substrate surface before deposition removes native oxides and contaminants, improving film adhesion and interface quality.\u003c\/p\u003e\n\u003ch3\u003eConfigurable Port Selection (1-inch, QF, CF, ISO)\u003c\/h3\u003e\n\u003cp\u003eStandard and high-vacuum port options support custom feedthrough configurations and simple installation of additional thermal sources.\u003c\/p\u003e\n\u003ch3\u003eUV-Blocking Observation Window with Rotatable Shutter\u003c\/h3\u003e\n\u003cp\u003eA front-mounted, UV-filtering window allows process monitoring while protecting the operator. The shutter position integrates with the LabVIEW-based thickness control.\u003c\/p\u003e\n\u003ch3\u003eDual-Mode Control (Automatic Computer and Manual Panel)\u003c\/h3\u003e\n\u003cp\u003eFully automatic computer control with LabVIEW-based software and manual panel operation can run independently or together, with real-time LCD status displayed throughout the process.\u003c\/p\u003e\n\u003ch3\u003eInterlock-Protected Automatic Water Cooling System\u003c\/h3\u003e\n\u003cp\u003eClosed-loop cooling with automatic on\/off switching and interlock protection blocks e-beam power delivery unless coolant is flowing, safeguarding the gun and chamber components.\u003c\/p\u003e\n\u003ch3\u003eThrottle, Vent, and Isolation Valve Configuration\u003c\/h3\u003e\n\u003cp\u003eThe isolation valve keeps the chamber under vacuum between experiments, while the throttle valve provides precise working pressure control during deposition.\u003c\/p\u003e\n\u003ch3\u003e1.5-Hour Experiment Cycle with Multi-Run Throughput\u003c\/h3\u003e\n\u003cp\u003eBuilt for consistent daily use, the system makes four to six deposition experiments per day achievable in routine operation.\u003c\/p\u003e\n\u003ch3\u003eTwo-Year Full Warranty\u003c\/h3\u003e\n\u003cp\u003eCoverage for materials, design, and workmanship gives research facilities extended assurance on their investment.\u003c\/p\u003e\n\u003ch2\u003eToronEva™ EB Electron Beam Evaporation System: Theory and Method\u003c\/h2\u003e\n\u003ch3\u003eHow Electron Beam Evaporation Works\u003c\/h3\u003e\n\u003cp\u003eIn electron beam evaporation, a focused stream of high-energy electrons strikes source material seated in a water-cooled copper crucible. The target reaches its evaporation temperature while the crucible itself stays cool. A 10 kV electron gun steers the beam magnetically and concentrates energy on the target surface, with beam current reaching 600 mA. This method vaporizes refractory materials that resistive heating cannot handle, including high-melting-point metals and complex oxides. The vaporized atoms move in straight lines through the vacuum and condense on the substrates positioned above.\u003c\/p\u003e\n\u003ch3\u003eVacuum Requirements and Pressure Control\u003c\/h3\u003e\n\u003cp\u003eE-beam evaporation demands a deeper vacuum than resistive thermal evaporation, since the electron beam can ionize residual gas, which leads to scattering and beam instability at higher pressures. A turbomolecular and mechanical pump combination brings the SS304 chamber down to a 10⁻⁸ Torr base pressure, low enough to maintain a well-focused, stable beam. An isolation valve holds the chamber under vacuum between experiments, which removes pump-down time between consecutive runs. Throttle and vent valves permit precise pressure adjustment across the 1000 to 10⁻⁹ Torr range.\u003c\/p\u003e\n\u003ch3\u003eReactive Evaporation, Plasma Cleaning, and Substrate Heating\u003c\/h3\u003e\n\u003cp\u003eReactive evaporation feeds O₂ or N₂ through MFM-controlled gas lines, forming oxide or nitride films from metallic sources without the need for compound targets. Before deposition, the ICP, CCP, and DC-RF plasma cleaning stage strips native oxides from substrate surfaces, improving nucleation and adhesion. Substrate heating from 50 to 700 °C encourages film crystallinity during growth, which matters especially for oxide films, where the crystalline phase determines film properties.\u003c\/p\u003e\n\u003ch3\u003eReal-Time Rate Monitoring\u003c\/h3\u003e\n\u003cp\u003eA dual-channel thickness monitor with two QCMs follows the deposition rate down to 0.1 Å\/s and supplies continuous feedback to e-beam power control.\u003c\/p\u003e\n\u003ch2\u003eElectron Beam Evaporation System - ToronEva™ EB Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eE-Beam Power Supply\u003c\/td\u003e\n\u003ctd\u003e10 kV, 600 mA\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eArc Protection\u003c\/td\u003e\n\u003ctd\u003eIntegrated\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAuxiliary Thermal Sources Power Supply\u003c\/td\u003e\n\u003ctd\u003e2500 W (8 V – 300 A), sequential\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum Level (Pump-Down Time)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr in 1 hour (fully loaded system)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (dry pump optional)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic or cylindrical); electro-polished, water-cooled\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Liner\u003c\/td\u003e\n\u003ctd\u003eSS304\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eUV-blocking, front-mounted; rotatable shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePorts\u003c\/td\u003e\n\u003ctd\u003eStandard 1\", QF, CF, ISO (configurable)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; manual panel control; LabVIEW-based software\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDisplay\u003c\/td\u003e\n\u003ctd\u003eReal-time LCD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling (interlock protected, automatic on\/off)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Holder Options\u003c\/td\u003e\n\u003ctd\u003e3\", 4\", 6\" wafers; 1 to 15 cm sample attachments\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm (continuously adjustable; panel or PC)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFilm Homogeneity\u003c\/td\u003e\n\u003ctd\u003eBetter than 3% across 4-inch sample\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Heating Range\u003c\/td\u003e\n\u003ctd\u003e50 to 700 °C (PID controlled, ±1 °C)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s precision; 2 QCMs; ion gun optional\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂, He, CH₄ and others; digital MFM; 0.2 sccm sensitivity; panel or PC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning Modes\u003c\/td\u003e\n\u003ctd\u003eICP, CCP, DC-RF (adjustable pressure)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eThrottle, vent, and isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCycle Time\u003c\/td\u003e\n\u003ctd\u003e~1.5 hours (4 to 6 experiments per day)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e2 years (materials, design, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279323922671,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/electron-beam-evaporation-system.webp?v=1792996446"},{"product_id":"high-vacuum-desk-sputter-carbon-coater-dsct","title":"High Vacuum Desk Sputter \u0026 Carbon Coater - DSCT","description":"\u003ch2\u003eHigh Vacuum Desk Sputter \u0026amp; Carbon Coater – DSCT\u003c\/h2\u003e\n\u003cp\u003eThe DSCT High Vacuum Desk Sputter \u0026amp; Carbon Coater is a versatile benchtop system that brings sputter coating and carbon fiber coating together through interchangeable heads. It is a dependable choice for preparing samples for Scanning Electron Microscope (SEM) analysis.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eScanning Electron Microscopy (SEM):\u003c\/strong\u003e Gives non-conductive specimens a conductive coating for high-resolution imaging.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eField Emission SEM (FE-SEM):\u003c\/strong\u003e Produces ultra-fine, uniform coatings that advanced, high-resolution surface analysis requires.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEDS\/WDS Analysis:\u003c\/strong\u003e Applies contamination-free carbon coatings suited to accurate elemental and compositional studies.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTransmission Electron Microscopy (TEM):\u003c\/strong\u003e Forms thin, uniform carbon films for specimen support grids and sample preparation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectron Backscatter Diffraction (EBSD):\u003c\/strong\u003e Delivers stable, conductive coatings that improve diffraction pattern quality.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThin Film Research:\u003c\/strong\u003e Supports deposition of a wide range of materials, including noble metals and carbon, as well as demanding targets such as tungsten and chromium.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePorous and Fragile Samples:\u003c\/strong\u003e Achieves even coverage with optional planetary rotation stages that protect delicate structures.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and Research Laboratories:\u003c\/strong\u003e The dual-mode design suits teaching, training, and multi-application research.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003ch3\u003eHardware\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eHigh vacuum performance with a built-in 90 L\/s Leybold turbo pump\u003c\/li\u003e\n\u003cli\u003eTwo-stage rotary vane backing pump (diaphragm and scroll pump)\u003c\/li\u003e\n\u003cli\u003e80 W switching DC power supply for sputtering\u003c\/li\u003e\n\u003cli\u003eCarbon fiber evaporation head\u003c\/li\u003e\n\u003cli\u003e500 W high-current DC power supply for carbon fiber evaporation\u003c\/li\u003e\n\u003cli\u003eQuartz crystal thickness monitor with 1 nm precision and 1 Å resolution\u003c\/li\u003e\n\u003cli\u003eFull-range Leybold vacuum gauge\u003c\/li\u003e\n\u003cli\u003eAutomatic venting valve\u003c\/li\u003e\n\u003cli\u003eAdjustable sample rotation, height, and tilt\u003c\/li\u003e\n\u003cli\u003eOptional planetary sample holder\u003c\/li\u003e\n\u003cli\u003eElectronic shutter\u003c\/li\u003e\n\u003cli\u003eEasy-to-change specimen stages, with a rotation stage as standard\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty\u003c\/li\u003e\n\u003cli\u003eCE conformity\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eAutomation\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eSemi-full automatic control for sputtering\u003c\/li\u003e\n\u003cli\u003eSemi-full automatic control for carbon coating\u003c\/li\u003e\n\u003cli\u003eIntuitive touch screen for managing the coating process and entering data quickly\u003c\/li\u003e\n\u003cli\u003eUser-friendly software that can be updated over a network\u003c\/li\u003e\n\u003cli\u003eRepeatable, programmable coating process in automatic mode\u003c\/li\u003e\n\u003cli\u003ePulsed or flash carbon fiber coating modes\u003c\/li\u003e\n\u003cli\u003eManual or automatic timed and thickness-based deposition\u003c\/li\u003e\n\u003cli\u003eCarbon fiber coating in flash or pulse modes\u003c\/li\u003e\n\u003cli\u003eRecording and graphing of coating parameters\u003c\/li\u003e\n\u003cli\u003eStorage of coating recipes for repeatable depositions\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eCarbon Evaporation with the DSCT\u003c\/h3\u003e\n\u003cp\u003eThis compact coating system, model DSCT, creates uniform, fine-grained thin films on a variety of surfaces through carbon coating. It uses carbon fiber, or alternatively a carbon rod. An electric current passes through the carbon fiber in either pulsed or flash mode, causing controlled evaporation of carbon that then deposits onto the sample. This approach reduces the debris typically generated by traditional carbon deposition processes.\u003c\/p\u003e\n\u003ch3\u003ePulsed Carbon Fiber Evaporation\u003c\/h3\u003e\n\u003cp\u003eThe small-chamber desk vacuum sputter and carbon coater is built to perform pulsed carbon fiber evaporation. Short pulses give tighter control over the deposition process and significantly cut the debris commonly associated with conventional carbon deposition techniques.\u003c\/p\u003e\n\u003ch3\u003eSample Holder Stages\u003c\/h3\u003e\n\u003cp\u003eThe DSCT offers flexible sample stage configurations to match user requirements. The standard stage rotates and features adjustable height and angle for ease of use and versatility. For uniform coating of porous specimens, an optional rotary planetary sample stage is available and recommended.\u003c\/p\u003e\n\u003ch3\u003eColor Touch Screen Control\u003c\/h3\u003e\n\u003cp\u003eThe DSCT, also known as the Desk SEM Coater, features a user-friendly 7-inch color touch screen. The interface provides fully automatic control and simplified data entry, making operation exceptionally easy. Users can monitor key parameters such as vacuum, current, and deposition as digital readouts or graphical curves directly on the screen. The unit also stores data from the last 300 coatings in a history log, which can be transferred to a PC through the built-in USB port.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/image-157.webp?v=1792996749\" alt=\"High Vacuum Desk Sputter \u0026amp; Carbon Coater - DSCT\"\u003e\u003c\/p\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp\u003eThis high-vacuum coater excels at producing uniform, fine-grained films, making it ideal for specimens that call for high-resolution, high-quality characterization, including FE-SEM, EDS\/WDS, TEM, and EBSD work. With a 2-inch magnetron cathode, an 80 W switching DC power supply, and a high-current power supply for carbon evaporation, the DSCT serves a broad range of research and thin film applications.\u003c\/p\u003e\n\u003cp\u003eThe DSCT can also be configured with an optional water-cooled cathode, which makes it better suited to prolonged sputtering deposition. In addition, a higher-power supply can be fitted to enable sputtering of materials such as chromium, tungsten, and other oxidizing metal targets.\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"9bab9dc\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eUltimate Vacuum: Less than 5 x 10^-6 Torr\u003c\/li\u003e\n\u003cli\u003eIt controls the sputtering rate to achieve a finer grain structure, typically around 2nm gold grain size.\u003c\/li\u003e\n\u003cli\u003eIt automatically regulates the sputtering power independently of pressure.\u003c\/li\u003e\n\u003cli\u003ePrecision Mass Flow meter (MFC) is used for fine control of vacuum pressure.\u003c\/li\u003e\n\u003cli\u003eUtilities: 220\/110V, 50\/60HZ, 10\/15A\u003c\/li\u003e\n\u003cli\u003eShipping Weight: 42kg\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"7d6b153\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eCarbon rod evaporation head\u003c\/li\u003e\n\u003cli\u003eHigh-current power supply for carbon rod\u003c\/li\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003ePlanetary sample rotation system\u003c\/li\u003e\n\u003cli\u003eSpare glass chamber\u003c\/li\u003e\n\u003cli\u003eSputtering targets\u003c\/li\u003e\n\u003cli\u003eCarbon fiber\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279331033327,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/high-vacuum-desk-sputter-carbon.webp?v=1792996780"},{"product_id":"glovebox-integrated-pvd-system","title":"Glovebox-Integrated PVD System","description":"\u003ch2\u003eToronPVD™ GV: Glovebox-Integrated PVD System for Thin Film Deposition\u003c\/h2\u003e\n\u003cp\u003eToronPVD™ GV is a physical vapor deposition platform designed to connect directly to an inert-atmosphere glovebox through sliding-door access. It supports both organic and inorganic thin film deposition. Thermal evaporation, organic effusion cells, e-beam, and sputtering are all available on a single platform. The prismatic SS304 chamber measures 30 × 40 × 50 cm and features electro-polished interior surfaces. With Inficon wide-range vacuum measurement, a fully loaded system reaches a base pressure of 10⁻⁸ Torr. An experiment cycle takes 1.5 hours at 10⁻⁷ Torr, which makes several runs per day practical.\u003c\/p\u003e\n\u003ch3\u003eMulti-Source Deposition and Process Control\u003c\/h3\u003e\n\u003cp\u003eFour thermal inorganic evaporation sources and two to six organic effusion cells allow multiple materials to be deposited within one vacuum cycle. The PID-controlled organic effusion cells operate from 25 to 600 °C with ±1 °C stability, delivering the thermal precision required for organic semiconductor and OLED emitter deposition. A dual-channel film thickness controller with 0.1 Å\/s precision tracks deposition rate and cumulative thickness across two sources. For film uniformity, the system offers a substrate heater with a 100 to 600 °C range and sample rotation adjustable from 2 to 30 rpm.\u003c\/p\u003e\n\u003ch3\u003eFeedthroughs, Monitoring, and Utilities\u003c\/h3\u003e\n\u003cp\u003eVacuum chamber feedthroughs follow KF25, CF40, and 1-inch port standards, and they are sealed with viton o-rings rated to withstand 200 °C. This design supports high-temperature feedthrough configurations when substrate heaters and effusion cells run at the same time. A 100 mm UV-blocking observation window with a rotatable protective shutter allows direct visual process monitoring. Automatic vent, throttle, and isolation valves work together with an automatic closed-loop water cooling system to regulate chamber temperature and pressure through every deposition cycle. A single-phase 220VAC, 16A power supply keeps facility integration straightforward.\u003c\/p\u003e\n\u003ch2\u003eToronPVD™ GV Applications: Glovebox-Integrated PVD for Air-Sensitive Thin Film Research\u003c\/h2\u003e\n\u003cp\u003eThe ToronPVD™ GV supports organic electronics research and advanced device fabrication programs in which deposition must take place with strict atmospheric exclusion to protect moisture-sensitive and oxygen-sensitive materials. Its glovebox-adapted design, multi-source configuration, and PID-controlled effusion cells make it well suited to multilayer organic device fabrication and heterogeneous PVD research.\u003c\/p\u003e\n\u003ch3\u003eKey Application Areas\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eOLED and Organic Light-Emitting Device Research:\u003c\/strong\u003e Organic emitter, transport, and metal electrode layers are deposited in sequence with no air exposure between steps, which preserves interface quality in multilayer device stacks.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOrganic Photovoltaic Cell Fabrication:\u003c\/strong\u003e Donor, acceptor, and electrode layers are vacuum deposited for organic solar cell prototypes that require strict atmospheric exclusion during processing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOrganic Semiconductor Research:\u003c\/strong\u003e Thin films of moisture-sensitive small molecules can be deposited for OFET, diode, and memory device studies, where exposure to ambient air alters material properties.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePerovskite Solar Cell Development:\u003c\/strong\u003e Perovskite and charge transport layers are vacuum deposited in an inert atmosphere, reducing defects caused by ambient humidity and oxygen.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBattery Electrode and Solid Electrolyte Research:\u003c\/strong\u003e Air-sensitive cathode, anode, and solid electrolyte thin films can be deposited for next-generation lithium-ion and solid-state battery device research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTwo-Dimensional Material Device Fabrication:\u003c\/strong\u003e Metallization and contact deposition on graphene, MoS₂, and other 2D materials are performed under vacuum, with no air exposure between preparation and deposition steps.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHeterogeneous Multilayer PVD Research:\u003c\/strong\u003e Inorganic thermal evaporation and organic effusion sources are combined for multi-material deposition in a single vacuum cycle, enabling complex mixed organic-inorganic layer stacks.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronpvdtm-gv-1276529858.webp?v=1792997260\" alt=\"Glovebox-Integrated PVD System\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronpvdtm-gv-1-447124728.webp?v=1792997249\" alt=\"Glovebox-Integrated PVD System\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eToronPVD™ GV Key Features: Glovebox-Integrated PVD System for High-Vacuum Thin Film Research\u003c\/h2\u003e\n\u003cp\u003eThe ToronPVD™ GV brings together glovebox-compatible sliding-door access, multi-source PVD capability, Knudsen effusion cells, and automated computer control in one high-vacuum platform. It is built for moisture-sensitive and organic thin film research.\u003c\/p\u003e\n\u003ch3\u003eChamber and Glovebox Integration\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003ePrismatic SS304 Chamber with Glovebox Sliding Doors:\u003c\/strong\u003e The 30 × 40 × 50 cm chamber connects directly to inert-atmosphere gloveboxes. Sliding-door access keeps the glovebox atmosphere intact during substrate and sample transfer.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectro-Polished Interior and Exterior Surfaces:\u003c\/strong\u003e Feather-touch clean, electro-polished chamber surfaces lower outgassing and particulate generation, supporting high-purity deposition of sensitive organic and inorganic materials.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMulti-Process Deposition Platform:\u003c\/strong\u003e Thermal evaporation, e-beam deposition, sputtering, and vacuum furnace operations can all run in the same chamber body by changing the source and tooling configuration.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eViewing and Feedthrough Options\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eFront Viewing Window with Rotatable Protection Shutter:\u003c\/strong\u003e A front-mounted viewing window allows direct process monitoring. The rotatable shutter enables precise deposition timing and protects the chamber between runs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e100 mm UV-Blocking Observation Window:\u003c\/strong\u003e This large-format front window uses UV-blocking glass, so operators can watch the process continuously without UV exposure during active deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eKF25, CF40, and 1-Inch Feedthrough Ports with 200 °C Viton O-Rings:\u003c\/strong\u003e Configurable feedthrough standards and high-temperature o-ring seals accommodate simultaneous high-power and signal connections under demanding deposition conditions.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eVacuum Performance\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eInficon Wide-Range Vacuum Measurement (1000 to 10⁻⁸ Torr):\u003c\/strong\u003e The Inficon system covers the full span from atmospheric pressure to base vacuum, delivering dependable pressure data throughout pump-down and deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁸ Torr Base Pressure, Turbomolecular and Mechanical Pump Stack:\u003c\/strong\u003e This pump combination reaches 10⁻⁸ Torr base pressure for a fully loaded system, meeting the vacuum requirements for high-purity organic and inorganic thin film deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Vent, Throttle, and Isolation Valves:\u003c\/strong\u003e Automated valves handle every chamber pressure transition, including vent sequencing, deposition pressure control, and glovebox isolation.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eDeposition Sources and Process Control\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e4 Thermal Inorganic and 2 to 6 Organic Evaporation Sources:\u003c\/strong\u003e Simultaneous access to several inorganic thermal sources and organic effusion cells in one chamber supports complex multilayer and co-deposited device stacks.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePID-Controlled Effusion Cells (25 to 600 °C, ±1 °C):\u003c\/strong\u003e These high-precision organic evaporation cells hold ±1 °C accuracy across the full operating range, giving organic materials and OLED emitters the flux stability they require.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Closed-Loop Water Cooling System:\u003c\/strong\u003e Automated cooling protects chamber and source components during extended deposition runs and high-temperature substrate heating cycles.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer Control with Touch Screen Panel:\u003c\/strong\u003e Vacuum management, source power, substrate heating, and data logging are all handled through a touch screen interface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Rotation with 100 to 600 °C Substrate Heater:\u003c\/strong\u003e Adjustable substrate rotation and an integrated heater provide film uniformity control and substrate temperature management over a wide range.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Precision Thickness Measurement:\u003c\/strong\u003e Two-channel rate and thickness monitoring at 0.1 Å\/s precision allows real-time tracking of deposition from two independent sources at once.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eThroughput, Power, and Warranty\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5-Hour Experiment Cycle at 10⁻⁷ Torr:\u003c\/strong\u003e Rapid pump-down and a streamlined cycle design allow multiple experiments per day, supporting iterative device fabrication and research programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSingle-Phase 220VAC, 16A Power Supply:\u003c\/strong\u003e Standard single-phase power simplifies laboratory installation and limits facility infrastructure requirements.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFull Warranty for Materials, Design, and Workmanship:\u003c\/strong\u003e Comprehensive coverage of system components, design quality, and manufacturing gives laboratories confidence in a long-term investment.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTheory and Method: How Glovebox-Integrated PVD Protects Air-Sensitive Thin Films\u003c\/h2\u003e\n\u003ch3\u003eWhy Glovebox Integration Matters\u003c\/h3\u003e\n\u003cp\u003eOrganic electronics face a persistent challenge: the materials that form the most promising thin films are also the most sensitive to moisture and oxygen. In conventional setups, substrates must pass through ambient air between the glovebox and the deposition tool. That transfer exposes organic interfaces to trace humidity, which degrades device performance. A glovebox-adapted chamber removes this step by connecting directly to the inert-atmosphere enclosure through sealed sliding doors. Substrates and finished devices stay in a controlled environment during preparation, deposition, and post-deposition handling.\u003c\/p\u003e\n\u003ch3\u003eOrganic Evaporation with Knudsen Effusion Cells\u003c\/h3\u003e\n\u003cp\u003eOrganic thin film evaporation relies on Knudsen effusion cells instead of the resistive evaporation boats used for metals. An effusion cell heats organic material in a crucible at a controlled temperature and produces a stable molecular flux through a small orifice. PID temperature control at ±1 °C across a 25 to 600 °C range preserves the evaporation rate stability that organic materials demand, because small temperature variations cause disproportionate changes in flux. Dual-channel thickness monitoring at 0.1 Å\/s precision follows deposition rate and cumulative film thickness in real time.\u003c\/p\u003e\n\u003ch3\u003eMulti-Process Flexibility and Automated Control\u003c\/h3\u003e\n\u003cp\u003eThe platform handles thermal evaporation, e-beam, sputtering, and vacuum furnace processing within the same chamber body, and source and tooling changes let it adapt to different device stack requirements. Four inorganic thermal sources and two to six organic effusion cells can run within one vacuum cycle, allowing co-deposition or sequenced growth of mixed organic-inorganic structures. Substrate rotation at 2 to 30 rpm spreads the vapor flux for homogeneous film growth. Fully automatic computer control with touch screen management covers source power, substrate temperature, rotation, and vacuum sequencing.\u003c\/p\u003e\n\u003ch2\u003eGlovebox-Integrated PVD System - ToronPVD™ GV Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Dimensions\u003c\/td\u003e\n\u003ctd\u003e30 × 40 × 50 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Surface Finish\u003c\/td\u003e\n\u003ctd\u003eElectro-polished, interior and exterior\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGlovebox Access\u003c\/td\u003e\n\u003ctd\u003eSliding doors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr (fully loaded system)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum (Cycle Time)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr; ~1.5 hours per experiment\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Measurement Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁸ Torr (Inficon system)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eAutomatic vent, throttle, and isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInorganic Thermal Evaporation Sources\u003c\/td\u003e\n\u003ctd\u003e4\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrganic Evaporation Sources\u003c\/td\u003e\n\u003ctd\u003e2 to 6 effusion cells (Knudsen type)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEffusion Cell Temperature Range\u003c\/td\u003e\n\u003ctd\u003e25 to 600 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEffusion Cell Temperature Control\u003c\/td\u003e\n\u003ctd\u003ePID, ±1 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heater Temperature Range\u003c\/td\u003e\n\u003ctd\u003e100 to 600 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s precision\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eKF25, CF40, 1-inch\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough O-Ring Material\u003c\/td\u003e\n\u003ctd\u003e200 °C resistant viton\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003e100 mm front, UV-blocking glass\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShutter\u003c\/td\u003e\n\u003ctd\u003eFront rotatable protection shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; touch screen panel\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVoltage\u003c\/td\u003e\n\u003ctd\u003eSingle phase, 220VAC, 16A (110V is also available)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSupported Processes\u003c\/td\u003e\n\u003ctd\u003eThermal evaporation, e-beam, sputtering, vacuum furnace\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003eFull (materials, design, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279337455855,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/glovebox-integrated-pvd-system20.webp?v=1792997212"},{"product_id":"high-vacuum-sputter-coater-and-carbon-thermal-evaporator-dsct-t","title":"High Vacuum Sputter Coater and Carbon\/Thermal Evaporator – DSCT-T","description":"\u003ch2\u003eHigh Vacuum Sputter Coater and Carbon\/Thermal Evaporator – DSCT-T\u003c\/h2\u003e\n\u003cp\u003eThe DSCT-T is a versatile high vacuum instrument built for Scanning Electron Microscope (SEM) sample preparation. Three interchangeable heads let a single unit work as a sputter coater, a carbon coater, and a thermal evaporator. The system deposits a broad range of materials, including gold (Au), platinum\/palladium (Pt\/Pd) alloy, silver (Ag), chromium (Cr), tungsten (W), iridium (Ir), and others.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eScanning Electron Microscopy (SEM):\u003c\/strong\u003e Applies high-quality conductive coatings so non-conductive samples can be imaged in detail.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eField Emission SEM (FE-SEM):\u003c\/strong\u003e Produces the ultra-fine, uniform films that advanced surface analysis requires.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEDS\/WDS Analysis:\u003c\/strong\u003e Delivers contamination-free coatings well suited to precise elemental and compositional studies.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTransmission Electron Microscopy (TEM):\u003c\/strong\u003e Creates thin carbon films for specimen support grids and also supports aperture cleaning.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectron Backscatter Diffraction (EBSD):\u003c\/strong\u003e Forms stable conductive coatings that sharpen diffraction pattern clarity.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThermal Evaporation Applications:\u003c\/strong\u003e Supports deposition of low-evaporation-temperature metals such as Au, Ag, and Al, which are useful in thin-film sensors, optical components, micro\/nanoelectronics, and solar cell research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThin Film Research:\u003c\/strong\u003e Enables deposition of noble metals, carbon, tungsten, chromium, and other challenging materials with controlled thickness and fine grain size.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePorous and Fragile Samples:\u003c\/strong\u003e Provides uniform coverage, and optional planetary rotation stages help protect delicate structures.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and Research Laboratories:\u003c\/strong\u003e A dual-mode system suited to teaching, training, and advanced multi-application research.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eHigh vacuum turbomolecular pump rated at 90 liters per second (manufactured by Leybold)\u003c\/li\u003e\n\u003cli\u003eBacking pump options: two-stage rotary vane pump or diaphragm pump\u003c\/li\u003e\n\u003cli\u003eFull range vacuum gauge (manufactured by Leybold)\u003c\/li\u003e\n\u003cli\u003eCarbon fiber evaporation head\u003c\/li\u003e\n\u003cli\u003eCarbon rod evaporation head\u003c\/li\u003e\n\u003cli\u003eThermal evaporation head\u003c\/li\u003e\n\u003cli\u003ePulsed or flash carbon fiber coating modes\u003c\/li\u003e\n\u003cli\u003eQuartz crystal thickness monitor with 1 nanometer precision and 1 angstrom resolution\u003c\/li\u003e\n\u003cli\u003eIntuitive touchscreen interface for managing the coating process and entering data with ease\u003c\/li\u003e\n\u003cli\u003eUser-friendly software that can be updated over a network connection\u003c\/li\u003e\n\u003cli\u003ePrecise coating rate control for finer grain structures during sputtering\u003c\/li\u003e\n\u003cli\u003eManual or automatic timed and thickness-based sputtering\u003c\/li\u003e\n\u003cli\u003eGLAD (Glancing Angle Deposition) sputtering capability\u003c\/li\u003e\n\u003cli\u003ePlasma cleaning functionality\u003c\/li\u003e\n\u003cli\u003eRecording and visualization of coating parameter graphs\u003c\/li\u003e\n\u003cli\u003eBuilt-in electronic shutter\u003c\/li\u003e\n\u003cli\u003eEasy-to-change specimen stages with standard rotation or planetary rotation options\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty\u003c\/li\u003e\n\u003cli\u003eWorldwide public and product liability insurance coverage for property damage or personal injury resulting from the use of Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eCarbon Evaporation with the DSCT-T\u003c\/h2\u003e\n\u003cp\u003eThe compact DSCT-T (DSCT with Thermal Evaporator) coating system can apply carbon to form uniform thin films on a variety of surfaces, using carbon fiber or, optionally, a carbon rod. An electric current passes through the carbon fiber in either pulsed or flash mode, and the evaporated carbon deposits onto the sample. This approach significantly reduces the debris commonly associated with traditional carbon deposition methods.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DCT-Carbon-Rod-Evapo.webp?v=1792997701\" alt=\"High Vacuum Sputter Coater and Carbon\/Thermal Evaporator – DSCT-T\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DCT-Carbon-Fiber-Eva_1.webp?v=1792997700\" alt=\"High Vacuum Sputter Coater and Carbon\/Thermal Evaporator – DSCT-T\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eThermal Evaporation\u003c\/h2\u003e\n\u003cp\u003eThe DSCT-T sputter coater and carbon\/thermal evaporator includes a thermal head designed to evaporate metals with low evaporation temperatures, such as gold, aluminum, and silver. The head serves two purposes: depositing these metals and cleaning TEM (Transmission Electron Microscopy) apertures.\u003c\/p\u003e\n\u003cp\u003eThe thermal evaporation process supports many applications, including metal film fabrication, thin-film sensor production, optical component manufacturing, nano and microelectronics, and solar cell work.\u003c\/p\u003e\n\u003ch2\u003eSample Stages\u003c\/h2\u003e\n\u003cp\u003eThe DSCT-T offers several sample stage configurations to match specific user requirements. Each stage rotates and adjusts in height for convenient, adaptable operation. A sample planetary rotation system is available and strongly recommended for achieving uniform coatings on porous specimens.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcrslider3.webp?v=1792997700\" alt=\"High Vacuum Sputter Coater and Carbon\/Thermal Evaporator – DSCT-T\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcs3.webp?v=1792997700\" alt=\"High Vacuum Sputter Coater and Carbon\/Thermal Evaporator – DSCT-T\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcs2.webp?v=1792997696\" alt=\"High Vacuum Sputter Coater and Carbon\/Thermal Evaporator – DSCT-T\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcrslider1-1.webp?v=1792997695\" alt=\"High Vacuum Sputter Coater and Carbon\/Thermal Evaporator – DSCT-T\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp\u003eThe thermal head of this high vacuum SEM coater can also clean TEM and SEM apertures. Paired with a turbomolecular pump, the coater produces high-quality, uniform films with fine grain sizes. These qualities make it a fit for specimens that call for high-resolution, high-quality characterization, including FE-SEM, EDS\/WDS, TEM, and EBSD.\u003c\/p\u003e\n\u003cp\u003eThe DSCT-T sputter coater and carbon\/thermal evaporator comes with a 2\" magnetron cathode, a high voltage switching DC power supply for sputtering, and a high current power supply for carbon and thermal evaporation. It is a valuable tool for research and thin film applications in micro and nanoelectronics, as well as sample preparation.\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"0ceccae\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eUltimate Vacuum: Less than 7 x10-7 torr\u003c\/li\u003e\n\u003cli\u003ePrecise control of sputtering rate to achieve finer grain structure\u003c\/li\u003e\n\u003cli\u003eAutomatic power control for sputtering independent of pressure\u003c\/li\u003e\n\u003cli\u003eReal-time plotting of coating parameters\u003c\/li\u003e\n\u003cli\u003eCapability to record and generate coating parameter graphs\u003c\/li\u003e\n\u003cli\u003eConvenient transfer of curves and deposition process data via the USB port to a PC\u003c\/li\u003e\n\u003cli\u003eEquipped with an electronic shutter\u003c\/li\u003e\n\u003cli\u003eVacuum chamber with dimensions of 170 mm OD x 140 mm\u003c\/li\u003e\n\u003cli\u003eSuitable utilities: 220V-240V, 50\/60HZ, 16A\u003c\/li\u003e\n\u003cli\u003eShipping Weight: 42 kg\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"dccf61a\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cp\u003eThe Desk Sputter Coater – DSCT-T offers a range of options and accessories to enhance its capabilities:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eCarbon evaporation heads for both fiber and rod carbon\u003c\/li\u003e\n\u003cli\u003eThermal evaporation head\u003c\/li\u003e\n\u003cli\u003eHigh current power supply\u003c\/li\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003ePlanetary sample rotation system\u003c\/li\u003e\n\u003cli\u003eSpare glass chamber\u003c\/li\u003e\n\u003cli\u003eSputtering targets\u003c\/li\u003e\n\u003cli\u003eChoice of Carbon Fiber or Carbon Rod\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003cli\u003eThermal evaporation sources (boat\/basket)\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279366979823,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/high-vacuum-sputter-coater-and-c.webp?v=1792997866"},{"product_id":"hipims-system","title":"HiPIMS System","description":"\u003ch2\u003eHiPIMS System: ToronHiPIMS™ 1000\u003c\/h2\u003e\n\u003ch3\u003eHigh-Power Impulse Magnetron Sputtering (HiPIMS) System\u003c\/h3\u003e\n\u003cp\u003eThe ToronHiPIMS™ 1000 is a fully automated high-power impulse magnetron sputtering platform built for research and production thin film deposition where high plasma ionization is essential. Adjustable-width, high-voltage pulses of 300 to 1000 VDC create an ionization density of 70 to 90%. The result is an ionized metal vapor flux that improves film density, adhesion, and conformality. The SS304 chamber, available in prismatic or cylindrical form from 30 to 60 cm, reaches a base pressure of 10⁻⁷ Torr and supports one to four HiPIMS sources. A touch screen and real-time LCD displays manage the automated deposition cycle from start to finish.\u003c\/p\u003e\n\u003ch3\u003ePulsed-DC Cleaning, Synchronization, and Gas Control\u003c\/h3\u003e\n\u003cp\u003eAn optional synchronized Pulsed-DC plasma cleans the substrate surface in situ before deposition. It removes native oxides and contaminants without breaking vacuum. Target-sample synchronization, combined with voltage, current, and timing monitoring, provides precise control over the pulse delivery sequence and helps optimize film structure in HiPIMS processes. Gas inputs regulated by mass flow meters and fitted with isolation valves accommodate Ar, N₂, and other process gases, enabling reactive HiPIMS deposition of nitrides, oxides, and carbides. An isolation valve lets the chamber hold vacuum between runs, which trims cycle-time overhead.\u003c\/p\u003e\n\u003ch3\u003eSubstrate Heating, Rotation, and Thickness Monitoring\u003c\/h3\u003e\n\u003cp\u003eSubstrate temperature is PID controlled from 50 to 600 °C, while rotation from 2 to 30 rpm promotes uniform film deposition across the substrate surface. A dual-channel controller supporting 1 to 4 QCMs tracks film thickness and deposition rate in real time at 0.1 Å\/s, with averaged output across the sensors. Internal lighting is included, along with 120 °C baking capability for chamber conditioning and moisture removal before deposition. With a 75×120 cm footprint and lockable wheels, the system passes through standard 85 cm doorways.\u003c\/p\u003e\n\u003ch2\u003eHiPIMS System: ToronHiPIMS™ 1000 Applications\u003c\/h2\u003e\n\u003ch3\u003eWhere the HiPIMS System Delivers Results\u003c\/h3\u003e\n\u003cp\u003eThe ToronHiPIMS™ 1000 serves thin film deposition work in which conventional magnetron sputtering cannot reach the density, adhesion, and conformality that advanced coatings and devices demand. A high ionization fraction, reactive gas capability, and target-sample synchronization make the system suitable for a wide range of materials and substrate geometries.\u003c\/p\u003e\n\u003ch3\u003eKey Application Areas\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Wear-Resistant Film Deposition:\u003c\/strong\u003e HiPIMS deposition of TiN, CrN, TiAlN, DLC, and related hard coatings onto cutting tools, molds, and mechanical components, where high film density and strong adhesion are required.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Research:\u003c\/strong\u003e Reactive HiPIMS deposition of TiO₂, SiO₂, and other optical oxide coatings, with excellent stoichiometry control and low optical scatter.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor and Microelectronics Research:\u003c\/strong\u003e Deposition of barrier layers, contact metals, and functional oxide films on wafer substrates that call for void-free, dense films at controlled substrate temperatures.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnergy and Solar Cell Research:\u003c\/strong\u003e Reactive HiPIMS deposition of transparent conductive oxides, nitride absorbers, and functional contact layers for thin-film photovoltaic and energy storage research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBiomedical Implant Coating:\u003c\/strong\u003e HiPIMS deposition of biocompatible TiN, DLC, and related coatings onto implant surfaces, where strong adhesion and low defect density at the film-substrate interface matter.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDiffusion Barrier and Encapsulation Layer Deposition:\u003c\/strong\u003e Deposition of dense, conformal nitride and oxide barrier layers for microelectronic packaging and OLED device encapsulation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eReactive Nitride and Carbide Film Research:\u003c\/strong\u003e Controlled reactive HiPIMS deposition of transition metal nitrides, carbides, and carbonitrides for materials science and surface engineering research programs.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronhipimstm-1-966267591.webp?v=1793001380\" alt=\"HiPIMS System\"\u003e\u003c\/p\u003e\n\u003ch2\u003eHiPIMS System: ToronHiPIMS™ 1000 Key Features\u003c\/h2\u003e\n\u003ch3\u003eIntegrated High-Vacuum Thin Film Platform\u003c\/h3\u003e\n\u003cp\u003eThe ToronHiPIMS™ 1000 combines high-voltage pulsed magnetron sputtering, PID substrate heating, MFM gas control, synchronized Pulsed-DC surface cleaning, and automated layer-by-layer deposition in a single high-vacuum system.\u003c\/p\u003e\n\u003ch3\u003ePlasma and Sputtering Source Features\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e70 to 90% Ionization Density with 300 to 1000 VDC Adjustable Pulses:\u003c\/strong\u003e Very high plasma ionization sets HiPIMS apart from conventional sputtering. It allows controlled ion energy at the substrate surface, which improves film density, adhesion, and conformality.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 4 Configurable HiPIMS Sputtering Sources:\u003c\/strong\u003e Single-target or multi-target setups support single-material, co-sputtered, or sequenced multi-layer deposition within one vacuum cycle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTarget-Sample Synchronization with Voltage-Current-Timing Display:\u003c\/strong\u003e Pulse timing between the target and substrate bias is synchronized, and voltage, current, and timing parameters appear in real time to support process optimization and reproducibility.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSynchronized Pulsed-DC Plasma Surface Cleaning:\u003c\/strong\u003e In-situ substrate preparation with synchronized plasma removes native oxides and contaminants without breaking vacuum before deposition begins.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eControl and Automation\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer Control with Touch Screen:\u003c\/strong\u003e A touch screen panel manages all system operations automatically, with real-time LCD status display throughout the deposition process.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automated Layer-by-Layer Deposition:\u003c\/strong\u003e Automated control handles each layer independently, supporting multi-layer process sequences without manual intervention.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eChamber and Vacuum Performance\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (30 to 60 cm, Prismatic or Cylindrical):\u003c\/strong\u003e A clean, electro-polished stainless steel chamber is offered in multiple sizes to suit different substrate and load configurations.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable port options allow flexible integration of feedthroughs, gauges, and process access.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInternal Lighting and 120 °C Baking Capability:\u003c\/strong\u003e Internal lighting enables visual chamber inspection, and the baking option removes moisture and conditions the chamber before high-purity runs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁷ Torr Base Pressure with Fast Pump-Down:\u003c\/strong\u003e The system reaches 10⁻⁶ Torr in 30 minutes. A turbomolecular and mechanical pump combination is standard, with a cryo-pump and dry pump available as options.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control covers the full pressure range for both process gas introduction and base vacuum monitoring.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Hold Between Runs:\u003c\/strong\u003e An isolation valve keeps the chamber under vacuum when idle, shortening pump-down time between successive experiments.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSubstrate, Gas, and Thickness Control\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 600 °C PID Substrate Heating:\u003c\/strong\u003e PID-controlled substrate temperature across a wide range supports deposition at elevated temperatures for improved film crystallinity and adhesion.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Adjustable Sample Rotation:\u003c\/strong\u003e Continuously adjustable rotation promotes an even film thickness distribution across the substrate during deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMFM Controlled Gas Inputs with Isolation Valves:\u003c\/strong\u003e Mass flow meter controlled delivery of Ar, N₂, and other process gases supports both inert and reactive HiPIMS processes, with Ar or N₂ chamber backfill.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Monitoring with 1 to 4 QCMs:\u003c\/strong\u003e Precise deposition rate and cumulative thickness measurement is provided, with averaged-value output across multiple QCM sensors.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eCooling, Footprint, and Warranty\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Closed-Loop Water Cooling:\u003c\/strong\u003e Active water cooling manages heat from the power supplies, targets, and chamber walls throughout HiPIMS operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e75×120 cm Mobile Platform:\u003c\/strong\u003e The 75×120 cm footprint and lockable wheels allow the system to pass through standard 85 cm doorways, offering flexible placement in laboratory and production environments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Full Warranty:\u003c\/strong\u003e Coverage includes design, materials, and workmanship.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHiPIMS System: ToronHiPIMS™ 1000 Theory and Method\u003c\/h2\u003e\n\u003ch3\u003eHow High-Power Impulse Magnetron Sputtering Works\u003c\/h3\u003e\n\u003cp\u003eHiPIMS delivers extremely high power densities to a magnetron target in short, high-voltage pulses, reaching instantaneous power levels far beyond those of conventional DC or RF sputtering. At peak pulse power, plasma density near the target climbs sharply, and a large fraction of the sputtered metal atoms is ionized before reaching the substrate. These ionized metal species move under the influence of plasma and applied bias fields, which allows control over deposition angle and improves film density on complex substrate geometries. Pulse width, voltage, and repetition rate can each be adjusted independently to suit the material and process.\u003c\/p\u003e\n\u003ch3\u003eIonization Control and Target-Sample Synchronization\u003c\/h3\u003e\n\u003cp\u003eThe 300 to 1000 VDC pulse range, together with adjustable pulse width, sets the ionization fraction for a given target. Ionization densities of 70 to 90% clearly separate HiPIMS from conventional sputtering, where most of the sputtered flux arrives at the substrate as neutral atoms with a broad angular distribution. Target-sample synchronization coordinates the arrival of ionized flux with the applied substrate bias, so ion energy at the growth surface can be controlled independently of the plasma condition. An optional synchronized Pulsed-DC mode applies the same pulse-gating approach to in-situ surface cleaning before deposition.\u003c\/p\u003e\n\u003ch3\u003eReactive Deposition and Vacuum Conditioning\u003c\/h3\u003e\n\u003cp\u003eReactive HiPIMS introduces N₂, O₂, or other reactive gases through MFM-controlled inputs, forming nitride, oxide, or carbide films from pure metal targets. The high ionization fraction lessens the hysteresis effect that limits rate stability in conventional reactive sputtering, which widens the stable process window. An isolation valve preserves chamber vacuum between depositions, and a 120 °C baking option conditions the chamber walls to support a low base pressure. A turbomolecular and mechanical pump combination, with cryo-pump and dry pump options, reaches a base pressure of 10⁻⁷ Torr.\u003c\/p\u003e\n\u003ch2\u003eHiPIMS System - ToronHiPIMS™ 1000 Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eHiPIMS Pulse Voltage\u003c\/td\u003e\n\u003ctd\u003e300 to 1000 VDC\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eHiPIMS Pulse Width\u003c\/td\u003e\n\u003ctd\u003eAdjustable\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Ionization Density\u003c\/td\u003e\n\u003ctd\u003e70 to 90%\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNumber of HiPIMS Sources\u003c\/td\u003e\n\u003ctd\u003e1 to 4 (configurable)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTarget-Sample Synchronization\u003c\/td\u003e\n\u003ctd\u003eYes; voltage-current-timing display\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Surface Cleaning\u003c\/td\u003e\n\u003ctd\u003eSynchronized Pulsed-DC plasma\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, and others; MFM controlled; isolation valves; Ar or N₂ backfill\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic or cylindrical)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Sizes\u003c\/td\u003e\n\u003ctd\u003e30\/40\/50\/60 cm box size\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Surface Finish\u003c\/td\u003e\n\u003ctd\u003eElectro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInternal Lighting\u003c\/td\u003e\n\u003ctd\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBaking Capability\u003c\/td\u003e\n\u003ctd\u003eUp to 120 °C (internal)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum Level (Pump-Down Time)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁶ Torr in 30 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (cryo-pump and dry pump as options)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Heating Range\u003c\/td\u003e\n\u003ctd\u003e50 to 600 °C (PID controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s precision; 1 to 4 QCMs; averaged value\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; touch screen panel; real-time LCD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard 85 cm doorway\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279385264367,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/hipims-system363448829.webp?v=1793001395"},{"product_id":"high-vacuum-thermal-evaporator-dte","title":"High Vacuum Thermal Evaporator- DTE","description":"\u003ch2\u003eHigh Vacuum Thermal Evaporator – DTE\u003c\/h2\u003e\n\u003cp\u003eThe High Vacuum Thermal Evaporator – DTE, also known as the Desktop Thermal Evaporator, is a compact, budget-friendly system built to deposit thin material layers onto substrates. Its main uses are in research settings and in sample preparation for electron microscopy investigations.\u003c\/p\u003e\n\u003ch3\u003eCompact Evaporation System for Laboratory Experiments\u003c\/h3\u003e\n\u003cp\u003eThe DTE is configured as a material evaporator, which makes it a good fit for experiments that involve sample evaporation. Its small chamber runs under high-vacuum conditions, allowing fast deposition of noble metals as well as oxidizing metals.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eMetal thin-film deposition\u003c\/li\u003e\n\u003cli\u003eNano- and microelectronics fabrication\u003c\/li\u003e\n\u003cli\u003eSolar cell development and manufacturing\u003c\/li\u003e\n\u003cli\u003eThin-film sensor production\u003c\/li\u003e\n\u003cli\u003eFine-grain structural coatings for SEM and FE-SEM sample preparation\u003c\/li\u003e\n\u003cli\u003eFlash-mode carbon fiber evaporation for SEM sample preparation\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003ch3\u003eThermal Evaporation\u003c\/h3\u003e\n\u003cp\u003eThe DTE pairs a high-current power supply with a low-voltage (resistive) thermal evaporation platform, giving it the flexibility to handle a broad range of thermal evaporation tasks. The system offers precise control over how a wide variety of materials are evaporated onto the substrate. It supports several source types, including boats, baskets, and coils, all of which can be mounted on a single thermal source holder.\u003c\/p\u003e\n\u003cp\u003eA 1.2 kW high-current DC power supply allows the DTE to lay down a thin layer of evaporant material on many different surfaces. This makes the system a strong choice for diverse applications, including SEM sample preparation.\u003c\/p\u003e\n\u003ch3\u003eHardware\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eSemi-automatic control of the material evaporation process\u003c\/li\u003e\n\u003cli\u003eDedicated DC high-current power supply (maximum 12 V, 100 A)\u003c\/li\u003e\n\u003cli\u003e170 mm diameter vacuum chamber constructed from Borosilicate-SST\u003c\/li\u003e\n\u003cli\u003eBuilt-in Leybold turbo pump (90 liters per second) for reaching high vacuum\u003c\/li\u003e\n\u003cli\u003eTwo-stage rotary pump, with an optional diaphragm or scroll pump available\u003c\/li\u003e\n\u003cli\u003eQuartz crystal monitoring for accurate real-time thickness measurement (1 nanometer precision)\u003c\/li\u003e\n\u003cli\u003eElectronic shutter for added process control\u003c\/li\u003e\n\u003cli\u003eTwo high-current electric feed-throughs for simple insertion of thermal sources\u003c\/li\u003e\n\u003cli\u003eMovable thermal source holder that supports both upward and downward deposition setups\u003c\/li\u003e\n\u003cli\u003eAutomatic venting valve\u003c\/li\u003e\n\u003cli\u003eFull-range vacuum gauge\u003c\/li\u003e\n\u003cli\u003eS-Clip sample holder mounted on the chamber lead\u003c\/li\u003e\n\u003cli\u003eOptional 2-inch rotating sample holder for the base plate\u003c\/li\u003e\n\u003cli\u003eAdjustable sample rotation, height, and tilt (when using the optional 2-inch sample holder)\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eAutomation\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eIntuitive touchscreen interface for managing the vacuum process and operating the device\u003c\/li\u003e\n\u003cli\u003eUser-friendly software that can be updated over the network\u003c\/li\u003e\n\u003cli\u003eElectronic shutter for precise control\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eClean Vacuum\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eVacuum chamber with a 170 mm outer diameter (OD) and a 140 mm height (H)\u003c\/li\u003e\n\u003cli\u003eInternally mounted 90 L\/s turbo molecular pump, optionally backed by a 6 m³\/h two-stage rotary vane pump\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTouch Screen Control\u003c\/h3\u003e\n\u003cp\u003eThe DTE features a 7-inch color touch-screen panel with easy-to-use software for managing deposition process data. Vacuum and coating sequence information appears on the screen as digital readouts or curves. The system also stores records of the last 300 coatings, which can be reviewed on the history page.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Main-page-after-vacuuming-300x17.webp?v=1793001730\" alt=\"High Vacuum Thermal Evaporator- DTE\"\u003e\u003c\/p\u003e\n\u003ch3\u003eSample Holder\u003c\/h3\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcrslider3_1.webp?v=1793001794\" alt=\"High Vacuum Thermal Evaporator- DTE\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcrslider1-1_1.webp?v=1793001793\" alt=\"High Vacuum Thermal Evaporator- DTE\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcs3_1.webp?v=1793001792\" alt=\"High Vacuum Thermal Evaporator- DTE\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcs2_1.webp?v=1793001790\" alt=\"High Vacuum Thermal Evaporator- DTE\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003eThe DTE deposition system provides flexible metal evaporation through two distinct configurations:\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e1. Upward Deposition\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eThe material to be evaporated is loaded into a boat source.\u003c\/li\u003e\n\u003cli\u003eThe sample is held securely on the S-Clips on the chamber lead, allowing easy access during deposition.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003e2. Downward Deposition\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eA small amount of the desired material is loaded into a basket.\u003c\/li\u003e\n\u003cli\u003eA rotating sample holder can optionally be used on the baseplate for this configuration.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eDTE Operation Requirements\u003c\/h3\u003e\n\u003cp\u003eThe DTE deposition system is built around a small chamber, which delivers a compact footprint, lightweight design, fast pump-down, and budget-friendly operation. Keep the following advisory notes in mind when using the system:\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e1. Ideal for Short-Term Thin Film Coatings\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eThe DTE is well suited to short-term thin film coatings.\u003c\/li\u003e\n\u003cli\u003eFor extended, long-term, or thick-layer depositions, caution is advised, as these conditions may affect the chamber.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003e2. Suitable for Low Vaporization Temperature Materials\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eThe system performs best when depositing source materials with low vaporization temperatures.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cstrong\u003e3. Maximum Sample Diameter Limitation\u003c\/strong\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eThe maximum sample diameter supported by the rotating substrate holder is 2 inches.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eIf these coating conditions do not match your requirements, consider our DTT model, which offers a larger 300 mm diameter chamber and three thermal sources.\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"bf31056\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eUltimate Vacuum: Less than 4×10-6 Torr\u003c\/li\u003e\n\u003cli\u003eShort-duration deposition process\u003c\/li\u003e\n\u003cli\u003eRecords and plots parameters displayed on the touchscreen\u003c\/li\u003e\n\u003cli\u003eTransfers curves and deposition process data via a USB port to PC\u003c\/li\u003e\n\u003cli\u003e0-12 V, 0-100 A DC high-current power supply\u003c\/li\u003e\n\u003cli\u003eUtilities: 220V-110V, 50\/60Hz, 6\/8A\u003c\/li\u003e\n\u003cli\u003eInstrument Dimensions: 450 Width × 450 Depth × 500 Height mm (without Rack)\u003c\/li\u003e\n\u003cli\u003eNet Weight: 30 kg (without backing pump)\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"278ab6e\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cp\u003eCertainly, here are the options and accessories for the DTE Deposition System:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003eSpare glass chamber\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003cli\u003eBoats and baskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279627157743,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/high-vacuum-thermal-evaporator-d.webp?v=1793001715"},{"product_id":"load-lock-magnetron-sputtering-system","title":"Load-Lock Magnetron Sputtering System","description":"\u003ch2\u003eLoad-Lock Magnetron Sputtering System – ToronSputter™ SD\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ SD is a sputter-down load-lock magnetron sputtering system built for high-throughput PVD in both research and production settings, particularly where the main chamber vacuum must stay intact between sample exchanges. A dedicated pump brings the load-lock down to 10⁻⁶ Torr in 10 minutes, so samples can be swapped continuously without venting the main chamber, which maintains a 10⁻⁸ Torr base pressure. A magnetic-arm transfer mechanism handles loading and unloading of 2\", 3\", 4\", and 6\" substrates. This fast cycle time makes it possible to run 20 to 30 experiments per day.\u003c\/p\u003e\n\u003ch3\u003eSputter-Down Guns and Process Capabilities\u003c\/h3\u003e\n\u003cp\u003eSputter-down guns are offered in RF and DC configurations with diameters from 1 to 6 inches, featuring flex-head rotation and compression seals. The system deposits conductive materials such as Au, Al, Ti, and Ni, as well as insulating materials such as MgO, TiO₂, SiO₂, and TiN, at high deposition rates under recipe control. Digital MFC gas inlets with 0.1 sccm sensitivity deliver Ar, N₂, O₂, He, and CH₄, supporting both inert and reactive sputtering. PID-controlled substrate heating covers 50 to 600 °C with ±1 °C stability, enabling deposition onto heated substrates.\u003c\/p\u003e\n\u003ch3\u003eThermal Evaporation, Monitoring, and Control\u003c\/h3\u003e\n\u003cp\u003eThermal evaporation is available through sequential thermal sources rated from 8V to 500A and 5000W. Their design prevents cross-contamination and allows materials and sources to be replaced easily. A dual-channel thickness controller with two QCMs monitors deposition rate with 0.1 Å\/s precision. The system also provides sample rotation from 2 to 30 rpm and DC\/RF plasma cleaning. Pressure control holds the working pressure at target values using downstream and upstream flow control. Operation is available from either a computer or a control panel, both with real-time LCD displays, and LabVIEW manages shutter and thickness sequences.\u003c\/p\u003e\n\u003ch2\u003eLoad-Lock Magnetron Sputtering System – ToronSputter™ SD Applications\u003c\/h2\u003e\n\u003ch3\u003eWhere the ToronSputter™ SD Performs\u003c\/h3\u003e\n\u003cp\u003eThe ToronSputter™ SD supports high-throughput PVD research and production environments where main chamber vacuum integrity, substrate cleanliness, and experiment cycle time are all top priorities. Its load-lock architecture and sputter-down configuration suit multi-layer coating programs as well as research work that calls for frequent substrate changes.\u003c\/p\u003e\n\u003ch3\u003eKey Application Areas\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Throughput PVD Research Facilities:\u003c\/strong\u003e Run multiple substrate depositions each day without venting the main chamber, supporting iterative thin film research with fast sample turnover.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor and Microelectronics Fabrication:\u003c\/strong\u003e Perform sputter-down deposition of metal contacts, barrier layers, and dielectric films on 2\" to 6\" wafers under a clean, continuously maintained vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Tool Surface Engineering:\u003c\/strong\u003e Apply reactive sputtering of TiN, CrN, TiAlN, and DLC coatings to cutting tools and molds at high deposition rates with recipe-controlled processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Production:\u003c\/strong\u003e Deposit TiO₂, SiO₂, and other optical coatings, using downstream and upstream pressure control to achieve stoichiometric reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectronics and RF Component Coating:\u003c\/strong\u003e Use DC and RF sputter deposition of Au, Al, Ti, and other conductors for electronics, RF packaging, and precision connector metallization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Research Programs:\u003c\/strong\u003e Benefit from a flexible multi-source platform for materials science, device physics, and surface engineering research, with rapid load-lock sample exchange.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMedical Device and Implant Coating:\u003c\/strong\u003e Sputter TiN, DLC, and biocompatible metallic films under clean vacuum with recipe-controlled process sequences.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-1-973038565_1.webp?v=1793002455\" alt=\"Load-Lock Magnetron Sputtering System\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-2-701422218.webp?v=1793002438\" alt=\"Load-Lock Magnetron Sputtering System\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eLoad-Lock Magnetron Sputtering System – ToronSputter™ SD Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ SD combines a load-lock sample exchange system, sputter-down gun configuration, MFC gas control, and PID substrate heating on a high-vacuum platform built for high-throughput research and production sputtering.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-3-1735877884.webp?v=1793002437\" alt=\"Load-Lock Magnetron Sputtering System\"\u003e\u003c\/p\u003e\n\u003ch3\u003eVacuum and Sample Handling\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eDedicated Load-Lock Pump, 10⁻⁶ Torr in 10 Minutes:\u003c\/strong\u003e A separate pumping system evacuates the load-lock independently, so samples can be introduced without disturbing the main chamber vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁸ Torr Main Chamber Base Pressure:\u003c\/strong\u003e A turbomolecular and mechanical pump combination, with a dry pump option, reaches the base pressure needed for high-purity magnetron sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMagnetic Arm Sample Transfer, 2\" to 6\" Substrates:\u003c\/strong\u003e The magnetic arm loads and unloads substrates from 2\" to 6\" in diameter, providing flexible substrate compatibility.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e20 to 30 Experiments Per Day Throughput:\u003c\/strong\u003e The load-lock architecture allows rapid sample exchange and shortens the time between depositions, supporting high-volume research and production programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control spans the full pressure range, covering both process gas and deep base vacuum monitoring.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, Isolation, and Gate Valve Configuration:\u003c\/strong\u003e A comprehensive valve set manages every pressure transition, and the isolation valve keeps the main chamber under vacuum when idle.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eSputtering Sources and Deposition\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 6-Inch RF and DC Sputter Guns with Flex-Head Rotation:\u003c\/strong\u003e A wide range of gun diameters, along with self-axis rotation and compression seals, provides flexible target configuration and reliable vacuum sealing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eConductor and Insulator Deposition at High Rates:\u003c\/strong\u003e Recipe-controlled, high-rate sputtering deposits conductors (Au, Al, Ti, Ni) and insulators (MgO, TiO₂, SiO₂, TiN).\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDigital MFC Gas Inputs (Ar, N₂, O₂, He, CH₄) at 0.1 sccm Sensitivity:\u003c\/strong\u003e Mixed gas delivery with digital flow control supports both inert and reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDownstream and Upstream Pressure Control:\u003c\/strong\u003e Working pressure can be fixed at desired values through downstream or upstream mass flow control, enabling precise reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 600 °C PID Substrate Heating with ±1 °C Sensitivity:\u003c\/strong\u003e Closed-loop temperature control supports deposition on heated substrates across a wide range, benefiting film crystallinity and adhesion.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Sample Rotation with DC\/RF Plasma Cleaning:\u003c\/strong\u003e Adjustable substrate rotation with PC speed control is paired with DC\/RF plasma cleaning to remove native oxides before deposition.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eThermal Evaporation and Thickness Monitoring\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e8V to 500A, 5000W Thermal Sources for Co-Evaporation:\u003c\/strong\u003e High-power sequential and co-evaporation thermal sources feature a design that prevents cross-contamination and allows easy material replacement.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Monitoring with Two QCMs:\u003c\/strong\u003e Two independent channels measure deposition rate and cumulative thickness simultaneously with high precision.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLoad-Lock Adaptable to E-Beam and Thermal Source Systems:\u003c\/strong\u003e The load-lock architecture can be configured for platforms that combine magnetron sputtering with e-beam and thermal evaporation sources.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eChamber Design and Configuration\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (Prismatic or Cylindrical) with Electro-Polished Surfaces:\u003c\/strong\u003e The feather-touch, electro-polished interior includes an SS304 liner, and water-cooled chamber surfaces are available when needed.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-Inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable port selection allows upgrades with additional thermal and sputtering sources without modifying the chamber.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eUV-Blocking Observation Window with LabVIEW Shutter Control:\u003c\/strong\u003e A rotatable door shutter handles process timing, and LabVIEW manages the sample shutter and thickness control integration.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eAutomation, Safety, and Support\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer and Panel Control with LCD Displays:\u003c\/strong\u003e All deposition operations run automatically under computer control, with panel override and real-time LCD status.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInterlock-Protected Automatic Water Cooling:\u003c\/strong\u003e Closed-loop water cooling switches on and off automatically, and an interlock blocks sputtering or evaporation unless coolant is flowing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTwo-Year Warranty for Materials, Design, and Workmanship:\u003c\/strong\u003e Comprehensive two-year coverage applies to system components, design, and manufacturing quality.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eLoad-Lock Magnetron Sputtering System – ToronSputter™ SD Theory and Method\u003c\/h2\u003e\n\u003ch3\u003eLoad-Lock Principle\u003c\/h3\u003e\n\u003cp\u003eA load-lock is a small, separately pumped antechamber that lets substrates move in and out without exposing the main process chamber to atmospheric pressure. In conventional systems, the entire main chamber is vented to atmosphere for every sample change, and a full pump-down cycle must finish before each deposition run. A load-lock uses gate valves to isolate the two vacuum spaces, so the main chamber stays at base pressure while samples are loaded and removed. As a result, the time between consecutive depositions drops from hours to minutes, which makes 20 to 30 experiments per day possible.\u003c\/p\u003e\n\u003ch3\u003eSputter-Down Magnetron Sputtering\u003c\/h3\u003e\n\u003cp\u003eIn a sputter-down magnetron configuration, the targets sit above the substrate and sputtered atoms travel downward, which limits particulate contamination from falling debris. Sputter-up configurations work the other way: gravity pulls target flakes and loose particles straight onto the growing film surface. The magnetron's magnetic field confines the plasma close to the target face, improving sputtering efficiency and supporting high deposition rates at low working pressures. DC power handles conductive targets, while RF power at 13.56 MHz extends the process to insulating materials.\u003c\/p\u003e\n\u003ch3\u003eVacuum, Cooling, and Evaporation Support\u003c\/h3\u003e\n\u003cp\u003eThe main chamber reaches a 10⁻⁸ Torr base pressure using a turbomolecular and mechanical pump combination, and a separate pump brings the load-lock down to 10⁻⁶ Torr in 10 minutes. Throttle, vent, isolation, and gate valves govern every pressure transition, and the isolation valve keeps the main chamber under continuous vacuum. A water-cooling system with an automatic on-off interlock prevents the sputtering guns or thermal sources from operating without active coolant flow. Thermal sources rated from 8V to 500A and 5000W enable co-evaporation and sequential multi-material deposition within the same run.\u003c\/p\u003e\n\u003ch2\u003eLoad-Lock Magnetron Sputtering System - ToronSputter™ SD Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eMain Chamber Base Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLoad-Lock Vacuum Level\u003c\/td\u003e\n\u003ctd\u003e10⁻⁶ Torr in 10 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (dry pump optional); dedicated load-lock pump\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eThrottle, vent, isolation, and gate valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic or cylindrical); electro-polished; SS304 liner\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Surface Cooling\u003c\/td\u003e\n\u003ctd\u003eWater-cooled surfaces (when needed)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eUV-blocking; rotatable door shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Configuration\u003c\/td\u003e\n\u003ctd\u003eSputter-down\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Guns\u003c\/td\u003e\n\u003ctd\u003e1 to 6 inches; RF and DC; flex-head; self-axis rotation; compression seal\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Transfer\u003c\/td\u003e\n\u003ctd\u003eMagnetic transfer arm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Sizes\u003c\/td\u003e\n\u003ctd\u003e2\", 3\", 4\", 6\"\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heating\u003c\/td\u003e\n\u003ctd\u003e50 to 600 °C (PID controlled, ±1 °C)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm (PC controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning\u003c\/td\u003e\n\u003ctd\u003eDC\/RF plasma\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂, He, CH₄ and others; digital MFC; 0.1 sccm sensitivity\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePressure Control Method\u003c\/td\u003e\n\u003ctd\u003eDownstream and upstream flow control\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s precision; 2 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Sources\u003c\/td\u003e\n\u003ctd\u003e8V to 500A, 5000W (sequential and co-evaporation)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling (interlock protected)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; panel control; real-time LCD; LabVIEW\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Throughput\u003c\/td\u003e\n\u003ctd\u003e20 to 30 experiments per day\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e2 years (materials, design, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279703507183,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/load-lock-magnetron-sputtering-s.webp?v=1793002375"},{"product_id":"desk-thermal-evaporator-dtt","title":"Desk Thermal Evaporator-DTT","description":"\u003ch2\u003eDesk Thermal Evaporator-DTT\u003c\/h2\u003e\n\u003cp\u003eThe Desk Thermal Evaporator-DTT is a compact benchtop system built for vacuum deposition of thin films. Its triple-source configuration lets users choose among evaporation sources such as boats, baskets, or coils. This versatility makes the system a strong fit for depositing multilayer films or alloys. Thanks to its efficient design, the DTT reaches the target vacuum pressure quickly, so a coating run takes only minutes. The system is well suited to laboratory research.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eMetal and dielectric films\u003c\/li\u003e\n\u003cli\u003eThin-film sensor fabrication\u003c\/li\u003e\n\u003cli\u003eOptical components\u003c\/li\u003e\n\u003cli\u003eNano- and microelectronics\u003c\/li\u003e\n\u003cli\u003eSolar cells\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eMultilayer thermal coatings\u003c\/li\u003e\n\u003cli\u003eLarge-format chamber\u003c\/li\u003e\n\u003cli\u003eHigh-vacuum turbo pump with pumping speed options from 90 l\/s to 350 l\/s\u003c\/li\u003e\n\u003cli\u003eUltimate pressure levels from 7 x 10^-6 to 7 x 10^-7 Torr\u003c\/li\u003e\n\u003cli\u003eTwo-stage rotary vane backing pump rated at 6 m^3\/h\u003c\/li\u003e\n\u003cli\u003eFull-range vacuum gauge included\u003c\/li\u003e\n\u003cli\u003eChoice of boat, basket, or coil evaporation sources for multilayer thin-film deposition\u003c\/li\u003e\n\u003cli\u003eOptional co-evaporation capability for forming alloy films\u003c\/li\u003e\n\u003cli\u003eQuartz crystal monitoring system for real-time thickness measurement with 1 nm precision\u003c\/li\u003e\n\u003cli\u003eManual or automatic deposition, either timed or thickness-based\u003c\/li\u003e\n\u003cli\u003eIntuitive touch screen for simple process control and fast data entry\u003c\/li\u003e\n\u003cli\u003eUser-friendly software that can be updated over a network connection\u003c\/li\u003e\n\u003cli\u003eElectronic shutter for precise control\u003c\/li\u003e\n\u003cli\u003eOptional rotary sample holder\u003c\/li\u003e\n\u003cli\u003eOptional 2-inch substrate heater that reaches temperatures up to 500°C\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty included\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eThermal Evaporation Sources (Boat\/Basket\/Coil)\u003c\/h2\u003e\n\u003cp\u003eThe DTT desktop vacuum thermal coater can be fitted with three independent high-temperature thermal evaporation sources. The source holder is designed so that source materials never cross-contaminate one another. The length of the source holders is also adjustable from 5 to 9 cm.\u003c\/p\u003e\n\u003ch2\u003eTouch Screen Control\u003c\/h2\u003e\n\u003cp\u003eThe DTT features a 7'' color touch screen with fully automatic control and data entry, simple enough for first-time operators. Vacuum, current, and deposition information appears on screen as digital readouts or curves. Data from the last 300 coatings can also be stored on the history page.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/image-201.webp?v=1793007889\" alt=\"Desk Thermal Evaporator-DTT\"\u003e\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"744f84b\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eMulti boats, baskets, and coils installation\u003c\/li\u003e\n\u003cli\u003eRecords and plots coating parameters graphs\u003c\/li\u003e\n\u003cli\u003eTransfers the curves and deposition process data by USB port to PC\u003c\/li\u003e\n\u003cli\u003eAutomatic control of power of coating independent of pressure\u003c\/li\u003e\n\u003cli\u003eWater cooled high current electrical feed through\u003c\/li\u003e\n\u003cli\u003e0-100 high current, protected against short circuit, DC power supply\u003c\/li\u003e\n\u003cli\u003eUtilities: 220\/110V, 50\/60HZ- 16\/25A\u003c\/li\u003e\n\u003cli\u003eDimensions: 60 cm H × 65 cm W × 50 cm D\u003c\/li\u003e\n\u003cli\u003eShipping weight: ~ 60 kg\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"b0dd0df\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eHigh current power supply for co-evaporation\u003c\/li\u003e\n\u003cli\u003eQuartz crystal sensors\u003c\/li\u003e\n\u003cli\u003eSpare glass chamber\u003c\/li\u003e\n\u003cli\u003eEvaporation sources (boat \/ basket \/ coil)\u003c\/li\u003e\n\u003cli\u003e2 inches, 500 °C substrate heater\u003c\/li\u003e\n\u003cli\u003eSample rotation\u003c\/li\u003e\n\u003cli\u003eMFC (Mass Flow Controller)\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51279751676143,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/desk-thermal-evaporator-dtt33310.webp?v=1793007872"},{"product_id":"load-lock-sputter-up-deposition-system","title":"Load-Lock Sputter-Up Deposition System","description":"\u003ch2\u003eLoad-Lock Sputter-Up Deposition System – ToronSputter™ SU\u003c\/h2\u003e\n\u003ch3\u003eLoad-Lock Magnetron Sputtering System – Sputter-Up\u003c\/h3\u003e\n\u003cp\u003eThe Load-Lock Sputter-Up Deposition System integrates upward-facing magnetron sputtering sources and organic effusion cells within a single load-lock chamber, allowing inorganic and organic thin films to be deposited together. In the sputter-up layout, targets sit beneath a downward-facing substrate, which supports confocal deposition geometry and the integration of multiple sources. A dedicated load-lock pump reaches 10⁻⁶ Torr in 10 minutes, while the main chamber holds a base pressure of 10⁻⁸ Torr. Samples are exchanged through the load-lock with a magnetic arm, making 20 to 30 experiments per day possible.\u003c\/p\u003e\n\u003ch3\u003eOrganic Evaporation, Inorganic Sputtering, and Thermal Sources\u003c\/h3\u003e\n\u003cp\u003eOrganic evaporation relies on PID-controlled effusion cells operating from 50 to 800 °C with ±1 °C stability, suited to depositing organic semiconductor and OLED materials. For inorganic films, 1 to 6-inch RF and DC sputtering guns deposit conductors and insulators such as Au, Al, TiN, and SiO₂ at high rates under recipe control. Digital MFC gas inlets with 0.1 sccm sensitivity support both inert and reactive sputtering. High-power thermal sources rated at 8V to 500A, 5000W add sequential evaporation and co-evaporation within the same run.\u003c\/p\u003e\n\u003ch3\u003eSubstrate Heating, Thickness Monitoring, and Process Control\u003c\/h3\u003e\n\u003cp\u003ePID-controlled substrate heating from 50 to 600 °C at ±1 °C, together with 2 to 30 rpm rotation and DC\/RF plasma cleaning, enables deposition onto heated substrates. A dual-channel thickness controller with two QCMs monitors deposition rate and cumulative thickness at 0.1 Å\/s resolution. Vacuum control covers 10⁻¹ to 10⁻⁹ Torr and includes downstream and upstream pressure-fixing capability. An automatic on-off water cooling interlock and a UV-blocking observation window with LabVIEW shutter control handle process safety and deposition timing.\u003c\/p\u003e\n\u003ch2\u003eLoad-Lock Sputter-Up Deposition System – ToronSputter™ SU Applications\u003c\/h2\u003e\n\u003ch3\u003eCombined Sputtering and Organic Evaporation for Thin Film Research\u003c\/h3\u003e\n\u003cp\u003eThe Load-Lock Sputter-Up Deposition System supports organic and inorganic thin film research that calls for sputter deposition and organic evaporation on one continuous-vacuum platform. Its confocal sputter-up geometry, organic effusion cells, and load-lock design make it well suited to multilayer organic-inorganic device fabrication and high-throughput PVD research programs.\u003c\/p\u003e\n\u003ch3\u003eKey Application Areas\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eOLED and Organic Light-Emitting Device Fabrication:\u003c\/strong\u003e Organic emitter and transport layers are deposited by effusion cell, and metal electrode layers by sputtering, all in situ with no air exposure between steps.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOrganic Photovoltaic Cell Research:\u003c\/strong\u003e Sputter-up deposition of transparent contact layers and reactive-sputtered oxide films, together with effusion-deposited organic active layers, supports OPV device prototyping.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePerovskite Solar Cell Development:\u003c\/strong\u003e Organic hole-transport layers and metallic contacts are deposited in a single vacuum environment, which reduces defects caused by exposure to atmospheric moisture and oxygen.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOrganic Semiconductor and OFET Research:\u003c\/strong\u003e Effusion cells provide precise deposition of small-molecule organic semiconductors, while confocal sputter-up metallization forms the device contacts.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Research:\u003c\/strong\u003e Reactive sputter-up deposition of TiO₂, SiO₂, and other optical coatings, paired with downstream pressure control, delivers stoichiometric accuracy.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Surface Engineering:\u003c\/strong\u003e Reactive RF sputtering of TiN, CrN, DLC, and related films from below-mounted, upward-facing targets coats tooling and mechanical components.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Throughput Multi-Material PVD Research:\u003c\/strong\u003e Load-lock sample exchange enables 20 to 30 experiments per day, supporting iterative multilayer organic-inorganic deposition programs.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-1-973038565_2.webp?v=1793008449\" alt=\"Load-Lock Sputter-Up Deposition System\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-2-701422218_1.webp?v=1793008449\" alt=\"Load-Lock Sputter-Up Deposition System\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eLoad-Lock Sputter-Up Deposition System – ToronSputter™ SU Key Features\u003c\/h2\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/toronlltm-sd-3-1735877884_1.webp?v=1793008448\" alt=\"Load-Lock Sputter-Up Deposition System\"\u003e\u003c\/p\u003e\n\u003ch3\u003eHigh-Vacuum Platform for Combined Organic-Inorganic Thin Film Research\u003c\/h3\u003e\n\u003cp\u003eThe Load-Lock Sputter-Up Deposition System brings together confocal sputter-up magnetron guns, Knudsen effusion cells for organic materials, MFM gas control, and load-lock sample exchange in one high-vacuum platform built for combined organic-inorganic thin film research.\u003c\/p\u003e\n\u003ch3\u003eDeposition Sources and Chamber Geometry\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 800 °C Effusion Cells for Organic Evaporation (±1 °C PID):\u003c\/strong\u003e Knudsen effusion cells deliver precise deposition of organic semiconductors, OLED emitters, and hole-transport materials in the same chamber as the sputtering sources, a combination that sets this system apart from sputter-down configurations.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 6-Inch RF and DC Sputter-Up Guns with Flex-Head Rotation:\u003c\/strong\u003e Upward-facing guns feature self-axis rotation and compression seals, creating a confocal multi-source deposition geometry aimed at downward-facing substrates.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eConfocal Sputter-Up Geometry:\u003c\/strong\u003e Multiple gun axes converge at a shared point at the center of the substrate. This improves co-deposition uniformity and allows multi-material deposition without repositioning the substrate.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e8V to 500A, 5000W Thermal Sources for Co-Evaporation:\u003c\/strong\u003e High-power thermal sources support sequential and co-evaporation, with a design that prevents cross-contamination and makes material replacement easy.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLoad-Lock Adaptable to E-Beam and Thermal Source Systems:\u003c\/strong\u003e The load-lock architecture can be configured for platforms that combine magnetron sputtering with e-beam and thermal evaporation sources.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eVacuum Performance and Sample Handling\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁸ Torr Main Chamber Base Pressure:\u003c\/strong\u003e A turbomolecular and mechanical pump combination, with a dry pump option, sustains the base pressure needed for high-purity organic and inorganic film deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDedicated Load-Lock Pump, 10⁻⁶ Torr in 10 Minutes:\u003c\/strong\u003e A separate pumping system evacuates the load-lock without disturbing the vacuum in the main chamber, and it can be adapted to e-beam and thermal source platforms.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMagnetic Arm Sample Transfer, 2\" to 6\" Substrates:\u003c\/strong\u003e A magnetic arm loads and unloads substrates from 2\" to 6\" in diameter, with easy sample exchange options.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e20 to 30 Experiments Per Day:\u003c\/strong\u003e The load-lock design allows rapid sample cycling, which supports high-throughput multilayer research and iterative device fabrication programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, Isolation, and Gate Valve Configuration:\u003c\/strong\u003e A comprehensive valve set manages every pressure transition, and the isolation valve keeps the main chamber under continuous vacuum while idle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (10⁻¹ to 10⁻⁹ Torr) with Pressure Fixing:\u003c\/strong\u003e Vacuum measurement and downstream or upstream pressure-fixing capability provide precise reactive sputtering process windows.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eProcess Control and Monitoring\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 600 °C PID Substrate Heating with ±1 °C Sensitivity:\u003c\/strong\u003e Closed-loop substrate temperature control helps manage film crystallinity, adhesion, and interface quality across a wide temperature range.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Sample Rotation with DC\/RF Plasma Cleaning:\u003c\/strong\u003e PC-controlled substrate rotation promotes deposition uniformity, while DC\/RF plasma cleaning removes surface oxides before deposition begins.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDigital MFC Gas Inputs (Ar, N₂, O₂, He, CH₄) at 0.1 sccm Sensitivity:\u003c\/strong\u003e MFC-controlled mixed gas delivery supports both inert and reactive sputtering processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Monitoring with Two QCMs:\u003c\/strong\u003e Rate and thickness are measured simultaneously across the organic and inorganic deposition channels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eUV-Blocking Observation Window with LabVIEW Shutter Control:\u003c\/strong\u003e A rotatable door shutter and a LabVIEW-integrated sample shutter provide precise deposition timing and tie into thickness control.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer and Panel Control with LCD Displays:\u003c\/strong\u003e Computer control runs all deposition operations automatically, with panel override and real-time process monitoring on LCD displays.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInterlock-Protected Automatic Water Cooling:\u003c\/strong\u003e Closed-loop water cooling switches on and off automatically, and an interlock blocks source operation unless coolant is flowing.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eChamber Construction and Configuration\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (Prismatic or Cylindrical) with Electro-Polished Surfaces:\u003c\/strong\u003e The feather-touch, electro-polished interior includes an SS304 liner, and water-cooled chamber surfaces are available when needed.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-Inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable port selection allows upgrades with additional thermal and sputtering sources.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eWarranty\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eTwo-Year Warranty for Materials, Design, and Workmanship:\u003c\/strong\u003e Comprehensive two-year coverage applies to system components, design, and manufacturing quality.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eLoad-Lock Sputter-Up Deposition System – ToronSputter™ SU Theory and Method\u003c\/h2\u003e\n\u003ch3\u003eSputter-Up Geometry and Confocal Deposition\u003c\/h3\u003e\n\u003cp\u003eIn sputter-up magnetron sputtering, the targets sit below a downward-facing substrate, so its deposition surface receives sputtered flux traveling upward. This substrate-down, source-up layout supports confocal arrangements in which several gun axes meet at the center of the substrate, which improves composition uniformity during co-deposition. Because the downward-facing substrate sits directly above the organic effusion cells, organic and inorganic layers can be deposited sequentially or simultaneously within one vacuum cycle. Load-lock access lets samples move in and out through the antechamber while the main chamber stays under vacuum.\u003c\/p\u003e\n\u003ch3\u003eOrganic Evaporation and Thickness Monitoring\u003c\/h3\u003e\n\u003cp\u003eOrganic materials are evaporated from Knudsen effusion cells, rather than from the high-current boats used for inorganic metals. PID control at ±1 °C across 50 to 800 °C keeps the molecular flux stable, which matters because organic materials react disproportionately to small temperature changes. QCM thickness monitoring at 0.1 Å\/s follows organic and inorganic film growth in real time across two channels. In the sputter-up configuration, organic and metallic sources share the same side of the chamber, so both can be deposited onto the same substrate face without repositioning.\u003c\/p\u003e\n\u003ch3\u003eVacuum Architecture and Pressure Control\u003c\/h3\u003e\n\u003cp\u003eThe main chamber maintains a 10⁻⁸ Torr base pressure using a turbomolecular and mechanical pump combination, and a separate load-lock pump reaches 10⁻⁶ Torr in 10 minutes. Throttle, vent, isolation, and gate valves govern every vacuum transition, and the main chamber remains continuously under vacuum whenever the system is idle. Vacuum measurement and control cover 10⁻¹ to 10⁻⁹ Torr, with downstream or upstream pressure-fixing capability. High-power thermal sources rated at 8V to 500A, 5000W complement sputtering by adding co-evaporation and sequential deposition capability.\u003c\/p\u003e\n\u003ch2\u003eLoad-Lock Sputter-Up Deposition System - ToronSputter™ SU Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eDeposition Configuration\u003c\/td\u003e\n\u003ctd\u003eSputter-up (substrate-down, sources-up)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOrganic Evaporation\u003c\/td\u003e\n\u003ctd\u003eKnudsen effusion cells; 50 to 800 °C; PID controlled; ±1 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMain Chamber Base Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eLoad-Lock Vacuum Level\u003c\/td\u003e\n\u003ctd\u003e10⁻⁶ Torr in 10 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e10⁻¹ to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (dry pump optional); dedicated load-lock pump\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eThrottle, vent, isolation, and gate valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic or cylindrical); electro-polished; SS304 liner\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Surface Cooling\u003c\/td\u003e\n\u003ctd\u003eWater-cooled surfaces (when needed)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eUV-blocking; rotatable door shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Guns\u003c\/td\u003e\n\u003ctd\u003e1 to 6 inches (upward-facing); RF and DC; flex-head; self-axis rotation; compression seal\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Sources\u003c\/td\u003e\n\u003ctd\u003e8V to 500A, 5000W (sequential and co-evaporation)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Transfer\u003c\/td\u003e\n\u003ctd\u003eMagnetic transfer arm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Sizes\u003c\/td\u003e\n\u003ctd\u003e2\", 3\", 4\", 6\"\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heating\u003c\/td\u003e\n\u003ctd\u003e50 to 600 °C (PID controlled, ±1 °C)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm (PC controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning\u003c\/td\u003e\n\u003ctd\u003eDC\/RF plasma\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂, He, CH₄ and others; digital MFC; 0.1 sccm sensitivity\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePressure Control Method\u003c\/td\u003e\n\u003ctd\u003eDownstream and upstream flow control\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s precision; 2 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling (interlock protected)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; panel control; real-time LCD; LabVIEW\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Throughput\u003c\/td\u003e\n\u003ctd\u003e20 to 30 experiments per day\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e2 years (materials, design, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280165699823,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/load-lock-sputter-deposition-sys.webp?v=1793008399"},{"product_id":"high-vacuum-triple-magnetron-target-desk-sputter-coater-dst3-a-s","title":"High Vacuum, Triple Magnetron Target Desk Sputter Coater-DST3-A\/S","description":"\u003cdiv data-id=\"d090d42\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch2\u003eHigh Vacuum, Triple Magnetron Target Desk Sputter Coater – DST3-A\/S\u003c\/h2\u003e\n\u003cp\u003eThe DST3-A\/S is a versatile, multi-target high vacuum sputter coater with turbo molecular pumping, designed to deposit a broad range of materials. Its roomy 300 mm diameter chamber houses three 2\" water-cooled cathodes, which support long deposition runs.\u003c\/p\u003e\n\u003cp\u003eBoth RF and DC power supplies are available, so this triple magnetron target desk sputter coater can sputter semiconductors, dielectrics, and metal targets, including oxidizing and noble metals. An auto-adjustable matching box keeps reflected power to a minimum and helps refine the RF sputtering process.\u003c\/p\u003e\n\u003cp\u003eAn optional 300 V DC bias can be applied to the substrate to strengthen film adhesion and improve film structure.\u003c\/p\u003e\n\u003cp\u003eThe DST3 comes in two models, each defined by its cathode configuration.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eMetal, semiconductor, and dielectric films\u003c\/li\u003e\n\u003cli\u003eNano and microelectronic applications\u003c\/li\u003e\n\u003cli\u003eSolar cell development\u003c\/li\u003e\n\u003cli\u003eCo-sputtering processes\u003c\/li\u003e\n\u003cli\u003eGLAD sputtering technique\u003c\/li\u003e\n\u003cli\u003eCoating of optical components\u003c\/li\u003e\n\u003cli\u003eThin film sensor fabrication\u003c\/li\u003e\n\u003cli\u003eProduction of magnetic thin film devices\u003c\/li\u003e\n\u003cli\u003eFine-grain structural deposition for SEM and FE-SEM sample preparation\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003ch3\u003eHardware\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eHigh vacuum performance from a built-in turbo pump\u003c\/li\u003e\n\u003cli\u003eDC power supply, with an optional RF power supply, for coating metals, semiconductors, and dielectrics\u003c\/li\u003e\n\u003cli\u003eThree 2-inch water-cooled, angled magnetron cathodes for alloy film production (DST3-A) and multilayer deposition\u003c\/li\u003e\n\u003cli\u003eLarge 8-inch sample holder stage on the DST3-S model\u003c\/li\u003e\n\u003cli\u003eCathode mask designed to deliver uniform deposition across large substrates (DST3-S)\u003c\/li\u003e\n\u003cli\u003eTwo quartz crystal monitoring systems, one fixed and one movable, for real-time thickness measurement with 1 nm precision\u003c\/li\u003e\n\u003cli\u003eGas injection managed by two Mass Flow Controllers (MFCs)\u003c\/li\u003e\n\u003cli\u003eElectronic gas valves\u003c\/li\u003e\n\u003cli\u003eTwo-stage rotary vane backing pump (diaphragm and scroll pump)\u003c\/li\u003e\n\u003cli\u003eFull range vacuum gauge\u003c\/li\u003e\n\u003cli\u003eCathode selection motor\u003c\/li\u003e\n\u003cli\u003eAdjustable sample rotation, height, and tilt (for 3-inch sample holders)\u003c\/li\u003e\n\u003cli\u003eThree manual shutters, with optional electronic shutters\u003c\/li\u003e\n\u003cli\u003eOptional programmable substrate heater\u003c\/li\u003e\n\u003cli\u003eUnlimited deposition time without breaking vacuum\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eAutomation\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eIntuitive touch screen for simple control of the coating process and fast data entry\u003c\/li\u003e\n\u003cli\u003eUser-friendly software that can be updated over a network connection\u003c\/li\u003e\n\u003cli\u003eOptional semi-fully automatic coating process\u003c\/li\u003e\n\u003cli\u003eRepeatable, programmable sputtering in automatic mode\u003c\/li\u003e\n\u003cli\u003eOptional adjustable DC, RF, and high current deposition parameters through the touch screen panel\u003c\/li\u003e\n\u003cli\u003eManual or automatic deposition by time or thickness\u003c\/li\u003e\n\u003cli\u003eStorage of coating recipes for repeatable depositions\u003c\/li\u003e\n\u003cli\u003eTarget selection for multilayer thin films\u003c\/li\u003e\n\u003cli\u003eElectronic shutters for precise control\u003c\/li\u003e\n\u003cli\u003eAutomated cathode selection\u003c\/li\u003e\n\u003cli\u003eSubstrate heater programming and control through the software\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eOptional Facilities\u003c\/h3\u003e\n\u003cp\u003eThe DST3 vacuum coater has a cylindrical Pyrex vacuum chamber measuring 300 mm in outer diameter and 200 mm in height. An internally mounted 90 L\/s turbo molecular pump, backed by a 6 m³\/h two-stage rotary vane pump, ensures efficient vacuum operation.\u003c\/p\u003e\n\u003ch3\u003eClean Vacuum\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eRF sputtering for depositing both conductive and non-conductive targets\u003c\/li\u003e\n\u003cli\u003ePlasma cleaner for enhanced cleaning capability\u003c\/li\u003e\n\u003cli\u003e300 V DC substrate bias voltage\u003c\/li\u003e\n\u003cli\u003e500 °C substrate heater for precise temperature control during coating\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eTouch Screen Control\u003c\/h3\u003e\n\u003cp\u003eThe DST3 includes a 7\" color touch-screen panel with user-friendly software for smooth control and adjustment of deposition process data. Vacuum and coating sequence information appears as digital readouts or curves on the screen, making monitoring straightforward. The system also keeps records of the last 300 coatings on a history page for easy reference.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/image-215.webp?v=1793008909\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater-DST3-A\/S\"\u003e\u003c\/p\u003e\n\u003ch3\u003eSample Holder Stages\u003c\/h3\u003e\n\u003cp\u003eTwo standard sample holder sizes are available: 3 inches, offered on both the DST3-A and DST3-S models, and 8 inches, exclusive to the DST3-S. Custom sizes can also be requested to match specific requirements. The smaller sample holders include multiple clamps that secure small samples during rotation, providing a simple and effective solution.\u003c\/p\u003e\n\u003ch3\u003ePlasma Cleaner\u003c\/h3\u003e\n\u003cp\u003eThe DST3 can be fitted with an optional plasma cleaner. Plasma treatment, or cleaning, removes organic substances from a substrate's surface or modifies it using ionized gas, known as plasma. This process can change the surface properties of the substrate, increasing either its hydrophilicity or hydrophobicity so that later depositions go on effectively. Applying plasma before thin film deposition also clears surface contaminants, such as carbon-based residues and oxides, and improves adhesion between the substrate and the layers that follow.\u003c\/p\u003e\n\u003ctable width=\"100%\" style=\"height: 19.6px;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/image-210_1.webp?v=1793009147\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater-DST3-A\/S\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3\u003eDST3-A (Angled Cathodes)\u003c\/h3\u003e\n\u003cp\u003eThe DST3-A has three angled cathodes that share a common focal point. This layout permits simultaneous sputtering from two or three (optional) targets, enabling alloy formation or multilayer deposition. The maximum substrate size for this model is 3 inches.\u003c\/p\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\" style=\"height: 19.6px;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/image-211_1.webp?v=1793009145\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater-DST3-A\/S\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3\u003eDST3-S (Straight Cathodes)\u003c\/h3\u003e\n\u003cp\u003eThe DST3-S is fitted with three straight 2-inch water-cooled cathodes. It is designed for sputtering a single large specimen up to 20 cm in diameter, or several smaller specimens.\u003c\/p\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eUltimate Vacuum: Less than 8x10-6 Torr\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"15bb855\" data-element_type=\"widget\" data-widget_type=\"eael-data-table.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv data-table_id=\"15bb855\" id=\"eael-data-table-wrapper-15bb855\" data-custom_responsive=\"false\"\u003e\n\u003ctable class=\"table\" id=\"eael-data-table-15bb855\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003ePumping Speed (l\/s)\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e90\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e350\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003eUltimate Pressure (Torr)\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e8×10\u003csup\u003e-6\u003c\/sup\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e3×10\u003csup\u003e-6\u003c\/sup\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"0d32230\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eEach cathode can independently control the sputtering rate to produce fine-grain structures.\u003c\/li\u003e\n\u003cli\u003eThe maximum thickness for each target, including the backing plate, is 6 mm.\u003c\/li\u003e\n\u003cli\u003eThe deposition power is automatically controlled regardless of the pressure.\u003c\/li\u003e\n\u003cli\u003eThe cathode temperatures are automatically regulated to prolong the life of the magnets.\u003c\/li\u003e\n\u003cli\u003eData is quickly recorded using fully automatic touch screen control.\u003c\/li\u003e\n\u003cli\u003eTwo precision Mass Flow meters (MFC) allow precise control of vacuum pressure and the flow of argon or other reactive sputtering gases.\u003c\/li\u003e\n\u003cli\u003eAn electronic throttle valve is included for the 350 l\/s turbo pump.\u003c\/li\u003e\n\u003cli\u003eCoating parameters are recorded and plotted.\u003c\/li\u003e\n\u003cli\u003eCurves and data from the deposition process can be transferred via a USB port to a PC.\u003c\/li\u003e\n\u003cli\u003eAn optional 300V DC bias voltage can be added.\u003c\/li\u003e\n\u003cli\u003eThere's an option for a plasma cleaner.\u003c\/li\u003e\n\u003cli\u003eThe system includes a 0-1200 V, 0-500 mA DC power supply.\u003c\/li\u003e\n\u003cli\u003eAn optional 300 W RF power supply with an automatic matching box is available.\u003c\/li\u003e\n\u003cli\u003eUtilities: 220\/110V, 50\/60HZ, with a current rating of 16\/25A.\u003c\/li\u003e\n\u003cli\u003eInstrument Dimensions: 600 Width × 800 Depth × 770 Height mm (excluding the rack).\u003c\/li\u003e\n\u003cli\u003eNet Weight: 160 kg, including the pump, rack, and instrument case.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"8229a92\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003eSpare glass chamber\u003c\/li\u003e\n\u003cli\u003eSputtering targets\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003cli\u003e300V DC bias voltage\u003c\/li\u003e\n\u003cli\u003ePlasma cleaner\u003c\/li\u003e\n\u003cli\u003e500°C substrate heater\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280187457775,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/high-vacuum-triple-magnetron-tar.webp?v=1793009295"},{"product_id":"magnetron-sputtering-system-toronsputter-mag","title":"Magnetron Sputtering System - ToronSputter™ Mag","description":"\u003ch2\u003eMagnetron Sputtering System: ToronSputter™ Mag\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ Mag is a fully automated magnetron sputtering platform built for thin film deposition in both research and production settings, driven by DC and RF power. A DC supply rated at 0 to 1000 V and 2000 W handles conductive targets, while an RF supply operating at 13.56 MHz and 300 to 1200 W covers insulating materials and reactive processes. The system accepts one to four sources in 1 to 4-inch target diameters, allowing both single-target and multi-target deposition. Its SS304 chamber, available from 30 to 60 cm, reaches a base pressure of 10⁻⁸ Torr and pumps down to 2×10⁻⁶ Torr in 20 minutes.\u003c\/p\u003e\n\u003ch3\u003eGas Control, Pressure Regulation, and Substrate Preparation\u003c\/h3\u003e\n\u003cp\u003eThree-channel MFM gas control handles Ar, N₂, O₂, He, CH₄, and H₂, supporting both inert and reactive sputtering across a 1 to 100 mTorr range. Throttle, vent, and isolation valves allow precise pressure setting. During reactive processes, a capacitance manometer adds a further plasma pressure measurement. Substrates are prepared through PID-controlled heating from 50 to 700 °C, rotation at 2 to 30 rpm, and RF plasma cleaning via substrate biasing. Wide-range vacuum control (1000 to 10⁻⁹ Torr) and a 120 °C bake-out help maintain base pressure and chamber condition.\u003c\/p\u003e\n\u003ch3\u003eThickness Monitoring and Automated Process Control\u003c\/h3\u003e\n\u003cp\u003eA dual-channel thickness controller supports 1 to 4 QCMs with 0.1 Å\/s resolution. Managed through LabVIEW automation, it runs each layer sequence fully automatically from start to finish.\u003c\/p\u003e\n\u003ch3\u003eChamber Design, Cooling, and Footprint\u003c\/h3\u003e\n\u003cp\u003eThe SS304 chamber comes in 30, 40, 50, and 60 cm configurations with electro-polished surfaces and standard 1-inch, QF, CF, and ISO ports. Automatic start-stop closed-loop water cooling and an observation window with a rotatable shutter support monitored deposition. The unit measures 75×120 cm and sits on lockable wheels, so it passes through standard doorways. Internal lighting and 120 °C baking capability are also included.\u003c\/p\u003e\n\u003ch2\u003eMagnetron Sputtering System: ToronSputter™ Mag Applications\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ Mag supports PVD research and production facilities that need DC and RF magnetron sputtering for a broad range of conductive and insulating materials. Multi-target flexibility and precise reactive sputtering control make it suitable for many deposition tasks.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor and Microelectronics Research:\u003c\/strong\u003e Deposits metal contacts, barrier layers, and dielectric films on wafer substrates through DC and RF magnetron sputtering, with controlled rates and compositions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Deposition:\u003c\/strong\u003e Applies reactive RF sputtering to TiO₂, SiO₂, and other optical oxide coatings, using capacitance manometer pressure control to achieve stoichiometric accuracy.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Wear-Resistant Surface Engineering:\u003c\/strong\u003e Uses reactive DC and RF sputtering to produce TiN, CrN, TiAlN, and DLC films on cutting tools, molds, and mechanical components.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnergy Device Research:\u003c\/strong\u003e Sputters transparent conductive oxides, barrier layers, and metallic contacts for research on thin-film solar cells, fuel cells, and energy storage devices.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterials Science and Alloy Film Research:\u003c\/strong\u003e Runs multi-target and co-sputtering of alloys, compound films, and mixed oxides for compositional studies and structure-property research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectronics and RF Component Coating:\u003c\/strong\u003e Applies DC sputtering of Au, Al, Ti, and other conductive metals for electronics packaging, RF connectors, and precision component metallization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University PVD Laboratories:\u003c\/strong\u003e Offers a flexible multi-source platform for teaching and materials research across a wide range of thin film deposition materials and techniques.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a1_1.webp?v=1793009559\" alt=\"Magnetron Sputtering System - ToronSputter™ Mag\"\u003e\u003c\/p\u003e\n\u003ch2\u003eMagnetron Sputtering System: ToronSputter™ Mag Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ Mag combines DC and RF magnetron sputtering with three-channel MFM gas control, LabVIEW layer automation, and capacitance manometer plasma pressure monitoring. Together, these capabilities form a multi-target, high-vacuum sputtering platform.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 4 DC\/RF Magnetron Sputter Sources (1\" to 4\" Targets):\u003c\/strong\u003e A layout configurable from one to four sources supports single-material, co-sputtered, and sequenced multi-layer thin film deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC Power Supply (0 to 1000 V, 2000 W):\u003c\/strong\u003e This high-power supply drives conductive target sputtering, with deposition rate set through voltage control.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRF Power Supply (13.56 MHz, 300 to 1200 W):\u003c\/strong\u003e The RF range suits insulating target sputtering as well as reactive oxide and nitride processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e3-Channel MFM Gas Control (Ar, N₂, O₂, He, CH₄, H₂):\u003c\/strong\u003e Three independent gas channels offer real-time electronic control and display for inert and reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdditional Capacitance Manometer for Plasma Pressure:\u003c\/strong\u003e A dedicated capacitance manometer delivers precise plasma pressure measurement during reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, and Isolation Valves, 1 to 100 mTorr Precision:\u003c\/strong\u003e These valves allow accurate working pressure adjustment, supporting reactive process gas control and plasma stability.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁸ Torr Base Pressure, 2×10⁻⁶ Torr in 20 Minutes:\u003c\/strong\u003e A turbomolecular pump paired with a mechanical pump provides fast pump-down to working vacuum. Cryo and dry pumps are available as options.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control spans atmospheric pressure to deep vacuum, covering both process gas and base pressure monitoring.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLabVIEW-Based Layer-by-Layer Deposition Control:\u003c\/strong\u003e PC-based LabVIEW automation manages each deposition layer independently, supporting complex multi-layer process sequences.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Measurement with 1 to 4 QCMs:\u003c\/strong\u003e Scalable multi-sensor monitoring tracks thickness and rate across up to four QCM channels at the same time.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 700 °C PID Substrate Heating:\u003c\/strong\u003e PID-controlled substrate temperature management enables deposition at elevated temperatures, benefiting film crystallinity and adhesion.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Sample Rotation:\u003c\/strong\u003e Adjustable substrate rotation promotes uniform film thickness across the substrate surface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSample Plasma Cleaning Unit (RF via Substrate Biasing):\u003c\/strong\u003e In-situ RF plasma cleaning removes native surface oxides before deposition without breaking vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Start-Stop Closed-Loop Water Cooling:\u003c\/strong\u003e Thermal management switches cooling on and off based on system state, protecting the sources and chamber throughout operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Hold with Isolation Valve:\u003c\/strong\u003e The main chamber remains under vacuum when idle, shortening pump-down time between successive experiments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (30 to 60 cm, Prismatic or Cylindrical):\u003c\/strong\u003e Clean, electro-polished inner surfaces come in several box size options with an SS304 liner.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable port selection offers flexible integration of feedthroughs, gauges, and process gas lines.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInternal Lighting and 120 °C Baking Capability:\u003c\/strong\u003e Internal lighting enables chamber inspection, while baking supports conditioning and residual moisture removal.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFront Viewing Window with Rotatable Shutter:\u003c\/strong\u003e The window gives direct visual access for process monitoring, and the rotatable shutter allows precise deposition timing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer Control with Touch Screen Panel:\u003c\/strong\u003e A touch screen and real-time LCD displays manage all system operations automatically throughout the process.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5-Hour Experiment Cycle Time:\u003c\/strong\u003e Fast pump-down and a short process cycle support consistent multi-run throughput for research and production programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e75×120 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e The compact footprint passes through standard doorways and can be repositioned within the facility.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Annual coverage applies to system components, design, and manufacturing quality.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eMagnetron Sputtering System: ToronSputter™ Mag Theory and Method\u003c\/h2\u003e\n\u003cp\u003eIn magnetron sputtering, a process gas is ionized and the resulting ions strike a cathode target, knocking atoms loose so they condense on the substrate as a thin film. A magnetic field holds the plasma close to the target face, which raises ion density and sputtering yield even at low working pressures. DC power, applied at 0 to 1000 V, handles conductive targets. RF power at 13.56 MHz dissipates the charge that accumulates on insulators, extending the range of usable materials to oxides, nitrides, and dielectric films produced from ceramic targets.\u003c\/p\u003e\n\u003ch3\u003eMulti-Target and Reactive Sputtering\u003c\/h3\u003e\n\u003cp\u003eConfigurations with one to four sources allow sequential deposition within a single pump-down cycle, which reduces contamination between material layers. Co-sputtering from sources powered at the same time produces composition-graded and alloy films without separate deposition steps. In reactive sputtering, N₂ or O₂ enters through MFM-controlled inputs while a metallic target is sputtered, forming nitride or oxide films without the need for compound targets. Throttle valve and capacitance manometer control keep plasma pressure stable across the 1 to 100 mTorr reactive process window.\u003c\/p\u003e\n\u003ch3\u003eAutomation, Substrate Preparation, and Growth Control\u003c\/h3\u003e\n\u003cp\u003eLabVIEW automation manages the complete layer sequence, controlling shutter timing, power levels, and gas flow at each step with no operator intervention between layers. RF plasma cleaning via substrate biasing removes native oxides before deposition, improving adhesion at the film-substrate interface. PID substrate heating at 50 to 700 °C promotes film crystallinity and surface diffusion during growth. Between runs, the isolation valve keeps the main chamber under vacuum, eliminating pump-down overhead for successive depositions.\u003c\/p\u003e\n\u003ch2\u003eMagnetron Sputtering System - ToronSputter™ Mag Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eDC Power Supply\u003c\/td\u003e\n\u003ctd\u003e0 to 1000 V DC, 2000 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRF Power Supply\u003c\/td\u003e\n\u003ctd\u003e13.56 MHz, 300 to 1200 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eNumber of Sputtering Sources\u003c\/td\u003e\n\u003ctd\u003e1 to 4 (DC\/RF)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTarget Diameters\u003c\/td\u003e\n\u003ctd\u003e1\", 2\", 3\", 4\"\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum (Pump-Down Time)\u003c\/td\u003e\n\u003ctd\u003e2×10⁻⁶ Torr in 20 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (cryo and dry pump as options)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputter Working Pressure Range\u003c\/td\u003e\n\u003ctd\u003e1 to 100 mTorr (throttle valve controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Pressure Measurement\u003c\/td\u003e\n\u003ctd\u003eAdditional capacitance manometer\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304 (prismatic or cylindrical); electro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Sizes\u003c\/td\u003e\n\u003ctd\u003e30\/40\/50\/60 cm box size\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eFront viewing window; rotatable shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInternal Lighting\u003c\/td\u003e\n\u003ctd\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBaking Capability\u003c\/td\u003e\n\u003ctd\u003eUp to 120 °C (internal)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂, He, CH₄, H₂; 3-channel MFM; real-time electronic display\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eThrottle, vent, and isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heating\u003c\/td\u003e\n\u003ctd\u003e50 to 700 °C (PID controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning\u003c\/td\u003e\n\u003ctd\u003eRF plasma via substrate biasing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s precision; 1 to 4 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eFully automatic computer control; touch screen panel; real-time LCD; LabVIEW\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic start-stop closed-loop water cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Cycle Time\u003c\/td\u003e\n\u003ctd\u003e1.5 hours\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard doorways\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280235266287,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/magnetron-sputtering-system-toro.webp?v=1793009526"},{"product_id":"high-vacuum-triple-magnetron-target-desk-sputter-coater-with-thermal-evaporator-dst3-ta-s","title":"High Vacuum, Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator-DST3-TA\/S","description":"\u003ch2\u003eHigh Vacuum Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator: DST3-TA\/S\u003c\/h2\u003e\n\u003cp\u003eThe DST3-TA\/S is a high vacuum, turbo-pumped triple target sputter coater. This versatile multi-mode vacuum coating system brings thermal evaporation and sputter deposition together in a single compact desktop unit.\u003c\/p\u003e\n\u003cp\u003eThe system suits a broad range of coating materials. Operators can switch easily between evaporation and sputtering modes, though the two processes cannot run at the same time.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a2_9a4630e9-f0e4-4294-9a93-3a1ded00a8fa.webp?v=1793009927\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator-DST3-TA\/S\"\u003e\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eMetal, semiconductor, and dielectric films\u003c\/li\u003e\n\u003cli\u003eNano- and microelectronics\u003c\/li\u003e\n\u003cli\u003eSolar cell applications\u003c\/li\u003e\n\u003cli\u003eCo-sputtering processes\u003c\/li\u003e\n\u003cli\u003eGLAD sputtering\u003c\/li\u003e\n\u003cli\u003eOptical component coating\u003c\/li\u003e\n\u003cli\u003eThin film sensors\u003c\/li\u003e\n\u003cli\u003eMagnetic thin film devices\u003c\/li\u003e\n\u003cli\u003eComputer memory applications\u003c\/li\u003e\n\u003cli\u003eFine-grain structural deposition for SEM and FE-SEM sample preparation\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eSputtering and thermal evaporation in one compact system\u003c\/li\u003e\n\u003cli\u003eHigh vacuum performance\u003c\/li\u003e\n\u003cli\u003eDC and RF power supplies for coating metals, semiconductors, and dielectrics\u003c\/li\u003e\n\u003cli\u003eThree 2\" water-cooled, angled magnetron cathodes for alloy films (DST3-TA) and multilayer deposition\u003c\/li\u003e\n\u003cli\u003eOne thermal evaporation source installation\u003c\/li\u003e\n\u003cli\u003eTwo quartz crystal monitors, one fixed and one movable, for real-time thickness measurement at 1 nm precision\u003c\/li\u003e\n\u003cli\u003eTwo mass flow controllers (MFCs)\u003c\/li\u003e\n\u003cli\u003eManual or automatic deposition, controlled by time or by thickness\u003c\/li\u003e\n\u003cli\u003eGLAD sputtering capability\u003c\/li\u003e\n\u003cli\u003ePlasma cleaning\u003c\/li\u003e\n\u003cli\u003eIntuitive touch screen for managing the coating process and entering data quickly\u003c\/li\u003e\n\u003cli\u003eUser-friendly software that can be updated over a network\u003c\/li\u003e\n\u003cli\u003eThree manual shutters\u003c\/li\u003e\n\u003cli\u003eWorldwide coverage of Vac Coat products by public and product liability insurance, in the event of property damage or personal injury caused by Vac Coat systems\u003c\/li\u003e\n\u003cli\u003eTiltable rotary sample holder with adjustable height and cathode selection\u003c\/li\u003e\n\u003cli\u003e500 °C substrate heater (optional)\u003c\/li\u003e\n\u003cli\u003e300 V DC substrate bias voltage (optional)\u003c\/li\u003e\n\u003cli\u003eUnlimited deposition time without breaking vacuum\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eThermal Evaporation with the Triple Target Turbo Pumped Sputter Coater\u003c\/h3\u003e\n\u003cp\u003eThe DST3-T includes a robust high-current power supply and a low-voltage resistive thermal evaporation platform, making it suitable for a wide variety of thermal evaporation work. The system deposits many different materials onto a substrate with precise control. Boats, baskets, and coils can all be mounted on a single holder, which adds flexibility.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DST3-T-Inside-Old-Sq.webp?v=1793009930\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator-DST3-TA\/S\"\u003e\u003c\/p\u003e\n\u003ch3\u003eTouch Screen Control\u003c\/h3\u003e\n\u003cp\u003eThe triple target turbomolecular pumped sputter coater features a user-friendly 7-inch color touch screen. It provides semi-automatic control and simple data entry, so even first-time users can operate it with ease. Vacuum and deposition data appear in digital form or as graphical curves on the display. Details from the last 300 coatings are stored on the history page for convenient review.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DST3-T-Touch-Screan.webp?v=1793009929\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator-DST3-TA\/S\"\u003e\u003c\/p\u003e\n\u003ch3\u003eSputter Coater Sample Holder\u003c\/h3\u003e\n\u003cp\u003eThe sample holder is designed to hold standard microscope slides and can be customized for specific requirements. Multiple clamps secure small samples firmly during rotation, giving users a simple way to handle their specimens.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DST3-Inside-Square-G.webp?v=1793009929\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator-DST3-TA\/S\"\u003e\u003c\/p\u003e\n\u003ch3\u003ePlasma Cleaner\u003c\/h3\u003e\n\u003cp\u003eA plasma cleaner is an optional addition to the DST3-T triple target sputter coater. Vacuum plasma cleaning uses ionized gas, known as plasma, to strip organic contaminants from the surface of a substrate. This pre-cleaning step is essential before film deposition, since it removes carbon-based and oxide residues from the surface. The result is stronger adhesion between the substrate and the layers deposited on it.\u003c\/p\u003e\n\u003ch3\u003eClean Vacuum Performance\u003c\/h3\u003e\n\u003cp\u003eThe vacuum chamber of the DST3-T sputter coater is a cylindrical Pyrex chamber measuring 300 mm in outer diameter and 200 mm in height. An internally mounted 90 l\/s turbomolecular pump creates the high vacuum, backed by either a 1.4 m³\/h diaphragm pump or a 4 m³\/h two-stage rotary vane pump.\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DST3-Plasma-Cleaning.webp?v=1793009928\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator-DST3-TA\/S\"\u003e\u003c\/p\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp\u003eThe DST3-T magnetron desk sputter coater has a large 300 mm diameter chamber and three 2\" diameter water-cooled cathodes. This design supports extended deposition times when a process calls for them. Both RF and DC power supplies are installed, so the system can sputter a variety of materials, including semiconductors, dielectrics, and both oxidizing and noble metals.\u003c\/p\u003e\n\u003cp\u003eAn optional 300 V DC bias voltage can be applied to the substrate to improve thin film adhesion and overall film quality. The system also includes an auto-adjustable matching box, which minimizes reflected power during RF sputtering.\u003c\/p\u003e\n\u003cp\u003eThe DST3-T comes in two models, depending on the cathode configuration:\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DST3-Angled-Square-G.webp?v=1793010080\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator-DST3-TA\/S\"\u003e\u003c\/td\u003e\n\u003ctd\u003e \n\u003ch3\u003eDST3-TA (Angled Cathodes)\u003c\/h3\u003e\n\u003cp\u003eThe DST3-TA has three angled cathodes that share a common focal point. It can sputter from two or three targets (three is optional), either simultaneously or independently. This flexibility makes it possible to deposit alloys or multilayer coatings, depending on the application. This model accommodates substrates up to 3 inches in diameter.\u003c\/p\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/Vac-product-DST3-Straight-Square.webp?v=1793010079\" alt=\"High Vacuum, Triple Magnetron Target Desk Sputter Coater with Thermal Evaporator-DST3-TA\/S\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3\u003eDST3-TS (Straight Cathodes)\u003c\/h3\u003e\n\u003cp\u003eThe DST3-TS has three straight 2-inch water-cooled cathodes. It is suited to sputtering a single large specimen up to 20 cm in diameter, or several smaller specimens at once.\u003c\/p\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"4a75fff\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eHigh Vacuum Turbomolecular Pump\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"c7b1d9a\" data-element_type=\"widget\" data-widget_type=\"eael-data-table.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv data-table_id=\"c7b1d9a\" id=\"eael-data-table-wrapper-c7b1d9a\" data-custom_responsive=\"false\"\u003e\n\u003ctable class=\"table\" id=\"eael-data-table-c7b1d9a\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003ePumping Speed\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e90 l\/s\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e350 l\/s\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003eUltimate Pressure\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e7×10\u0026lt;sup\u0026gt;-6\u0026lt;\/sup\u0026gt; Torr\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e7×10\u003csup\u003e-7\u003c\/sup\u003e Torr\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"3d40582\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eHigh Vacuum Turbomolecular Pump\u003c\/li\u003e\n\u003cli\u003eTwo-stage rotary vane pump 4 m3\/h\u003c\/li\u003e\n\u003cli\u003eIndependent sputtering control rate for each cathode to produce fine grain structures\u003c\/li\u003e\n\u003cli\u003eAutomatic control of deposition power independent of pressure\u003c\/li\u003e\n\u003cli\u003eAutomatic control of the cathode’s temperatures to protect the life time of the magnets\u003c\/li\u003e\n\u003cli\u003eWater-cooled high current electric feedthrough\u003c\/li\u003e\n\u003cli\u003eTwo precision Mass Flow Controller (MFC) for fine control of Ar flow and so reactive sputtering gas\u003c\/li\u003e\n\u003cli\u003eRecords and plots of coating parameters graphs\u003c\/li\u003e\n\u003cli\u003eTransfers curves and deposition process data by a USB port to PC\u003c\/li\u003e\n\u003cli\u003e300V DC bias voltage (optional)\u003c\/li\u003e\n\u003cli\u003eEquipped to plasma cleaner (optional)\u003c\/li\u003e\n\u003cli\u003eEquipped to 500˚C substrate heater (optional)\u003c\/li\u003e\n\u003cli\u003eDC power supply 0-1200V, 0-500 mA\u003c\/li\u003e\n\u003cli\u003e0-24 V, 0-100 A high current power supply\u003c\/li\u003e\n\u003cli\u003e300 W RF power supply with automatic matching box\u003c\/li\u003e\n\u003cli\u003eUtilities: 220V-240V, 50\/60HZ, 16A\u003c\/li\u003e\n\u003cli\u003eBox Dimensions: 50 cm H x 60 cm W x 47 cm D\u003c\/li\u003e\n\u003cli\u003eShipping Weight: 160 kg (Pump, Rack, and Box)\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"2aa785a\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003cdiv\u003e\n\u003cp\u003eThe Triple Target Turbomolecular Pumped Sputter Coater – DST3-T has the following options and accessories:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal sensors\u003c\/li\u003e\n\u003cli\u003eSpare vacuum glass chamber\u003c\/li\u003e\n\u003cli\u003eSputtering Targets\u003c\/li\u003e\n\u003cli\u003eThermal source materials\u003c\/li\u003e\n\u003cli\u003e300V DC bias voltage\u003c\/li\u003e\n\u003cli\u003ePlasma cleaner\u003c\/li\u003e\n\u003cli\u003e500˚C substrate heater\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280247554287,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/high-vacuum-triple-magnetron-tar_1.webp?v=1793010204"},{"product_id":"rf-dc-magnetron-sputtering-system","title":"RF\/DC Magnetron Sputtering System","description":"\u003ch2\u003eRF\/DC Magnetron Sputtering System: ToronSputter™ RFDC\u003c\/h2\u003e\n\u003ch3\u003eMulti-Target Deposition and Power Supplies\u003c\/h3\u003e\n\u003cp\u003eThe ToronSputter™ RFDC is a magnetron sputtering system built for multi-target thin film deposition. It accommodates targets up to 6 inches in diameter and supports configurations of 1 to 4 sources. The RF power supply (13.6 MHz, 300 to 1200 W) is suited to insulating and reactive targets, while the DC power supply (600 V, 1.7 A) serves metallic film deposition.\u003c\/p\u003e\n\u003ch3\u003eChamber, Vacuum Performance, and Automation\u003c\/h3\u003e\n\u003cp\u003eThe SS304 chamber, available in sizes from 30 to 60 cm, reaches a base pressure of 10⁻⁷ Torr. A working vacuum of 10⁻⁶ Torr is achieved within 30 minutes. Fully automated LabVIEW control and a 1.5-hour process cycle deliver consistent daily throughput. Wide-range vacuum control (1000 to 10⁻⁹ Torr) and chamber baking at 120 °C help maintain base pressure and a clean process environment.\u003c\/p\u003e\n\u003ch3\u003eGas Control and Pressure Regulation\u003c\/h3\u003e\n\u003cp\u003eThree-channel MFM gas control with real-time display handles Ar, N₂, O₂, He, CH₄, and H₂, supporting both inert and reactive sputtering across a 1 to 100 mTorr range. Throttle, vent, and isolation valves allow precise pressure setting. During reactive processes, a capacitance manometer adds a further plasma pressure measurement.\u003c\/p\u003e\n\u003ch3\u003eSubstrate Preparation\u003c\/h3\u003e\n\u003cp\u003eSubstrates are prepared before deposition using PID-controlled heating from 50 to 600 °C and rotation from 3 to 30 rpm. RF plasma cleaning through substrate biasing completes the preparation step.\u003c\/p\u003e\n\u003ch3\u003eThickness Control and Multi-Layer Sequences\u003c\/h3\u003e\n\u003cp\u003eA dual-channel thickness controller supports 1 to 4 QCMs with 0.1 Å\/s resolution. Managed through LabVIEW automation, it runs multi-layer deposition sequences fully automatically.\u003c\/p\u003e\n\u003ch3\u003eLarge-Substrate Capability and Production Coating\u003c\/h3\u003e\n\u003cp\u003eThe extended target range, up to 6 inches, allows deposition on larger substrates and increases throughput for production coating programs.\u003c\/p\u003e\n\u003ch3\u003eFootprint, Ports, and Process Support\u003c\/h3\u003e\n\u003cp\u003eThe system occupies a 75×120 cm footprint and sits on lockable wheels, so it passes through standard doorways. Standard 1-inch, QF, CF, and ISO ports provide flexible feedthrough and source configurations. Automatic start-stop closed-loop water cooling and internal baking up to 120 °C complete the process support system.\u003c\/p\u003e\n\u003ch2\u003eRF\/DC Magnetron Sputtering System: ToronSputter™ RFDC Applications\u003c\/h2\u003e\n\u003ch3\u003eWhere the ToronSputter™ RFDC Fits\u003c\/h3\u003e\n\u003cp\u003eThe ToronSputter™ RFDC is designed for research and production PVD facilities that need large-target magnetron sputtering with both RF and DC source options, reactive gas capability, and automated multi-layer deposition. Its 6-inch target option makes the system a strong match for larger substrate programs and higher-throughput coating work.\u003c\/p\u003e\n\u003ch3\u003eKey Application Areas\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor and Microelectronics Fabrication:\u003c\/strong\u003e DC sputtering lays down metallic contacts, seed layers, and barrier films, while RF sputtering forms oxide and nitride dielectric layers. Multi-source runs can be performed on 6-inch wafer substrates.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Coating Production:\u003c\/strong\u003e Reactive RF sputtering produces TiO₂, SiO₂, and multi-layer optical stacks. Capacitance manometer pressure control supports stoichiometric accuracy across extended coating runs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Tool Surface Engineering:\u003c\/strong\u003e Reactive sputtering of TiN, CrN, and TiAlN coats tooling and mechanical components, and the 6-inch target capacity supports higher deposition rates.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTransparent Conductive Oxide Deposition:\u003c\/strong\u003e RF sputtering of ITO, AZO, and other TCO films serves solar cell, display panel, and flexible electronics applications that call for uniform large-area coverage.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterials Science and Alloy Film Research:\u003c\/strong\u003e Multi-target and co-sputtered alloy, compound, and mixed oxide films enable composition-structure-property studies and new materials development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEnergy Device and Photovoltaic Research:\u003c\/strong\u003e The system sputters metallic back contacts, oxide buffer layers, and TCO front contacts for thin-film solar cell and energy device research programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Multi-Source Research:\u003c\/strong\u003e A flexible RF\/DC platform supports multi-layer thin film studies across conducting, semiconducting, and insulating materials, all within a single automated system.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a3_a0c1e6af-ce55-49e7-9d47-1c41e04f51d7.webp?v=1793010536\" alt=\"RF\/DC Magnetron Sputtering System\"\u003e\u003c\/p\u003e\n\u003ch2\u003eRF\/DC Magnetron Sputtering System: ToronSputter™ RFDC Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronSputter™ RFDC combines RF and DC magnetron sputtering in a multi-target, high-vacuum platform. It supports 6-inch targets and features three-channel MFM gas control, LabVIEW-driven layer automation, and capacitance manometer monitoring of plasma pressure.\u003c\/p\u003e\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1 to 4 DC\/RF Sources with 6-Inch Target Capability:\u003c\/strong\u003e The source layout is configurable and accepts 1\", 2\", 3\", 4\", and 6\" target diameters. It suits single-target, co-sputtered, and sequenced multi-layer deposition programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRF Power Supply (13.6 MHz, 300 to 1200 W):\u003c\/strong\u003e This supply covers the RF power range needed for sputtering insulating targets and for reactive oxide and nitride deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC Power Supply (600 V, 1.7 A):\u003c\/strong\u003e The DC supply sputters conductive metallic targets with a controlled deposition rate.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e3-Channel MFM Gas Control (Ar, N₂, O₂, He, CH₄, H₂):\u003c\/strong\u003e Electronic control and real-time display for three independent gas channels support both inert and reactive sputtering processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdditional Capacitance Manometer for Plasma Pressure:\u003c\/strong\u003e A dedicated gauge, independent of the main vacuum gauge, measures plasma pressure precisely during reactive sputtering.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, and Isolation Valves with 1 to 100 mTorr Precision:\u003c\/strong\u003e These valves allow precise working pressure adjustment for reactive process control and stable plasma conditions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁷ Torr Base Pressure, 10⁻⁶ Torr in 30 Minutes:\u003c\/strong\u003e A turbomolecular and mechanical pump combination delivers this performance. Cryo and dry pumps are available as options.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e Integrated vacuum measurement and control span atmospheric pressure to deep vacuum for every process mode.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLabVIEW-Based Layer-by-Layer Deposition Control:\u003c\/strong\u003e PC-controlled automation manages each deposition layer independently, so complex multi-layer sequences run without operator intervention.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Measurement with 1 to 4 QCMs:\u003c\/strong\u003e Scalable multi-sensor thickness and rate monitoring supports up to four simultaneous QCM channels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e50 to 600 °C PID Substrate Heating:\u003c\/strong\u003e PID-controlled substrate temperature across a wide process range supports film crystallinity and adhesion.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e3 to 30 rpm Sample Rotation:\u003c\/strong\u003e Adjustable substrate rotation promotes uniform film thickness across the substrate surface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSample Plasma Cleaning Unit (RF via Substrate Biasing):\u003c\/strong\u003e In-situ RF plasma cleaning removes native surface oxides before deposition without breaking vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Start-Stop Closed-Loop Water Cooling:\u003c\/strong\u003e Thermal management switches cooling on and off according to system state, protecting the sources and chamber throughout operation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eVacuum Hold with Isolation Valve:\u003c\/strong\u003e The main chamber remains under vacuum when idle, which shortens pump-down time between successive experiments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304 Chamber (30 to 60 cm, Prismatic or Cylindrical):\u003c\/strong\u003e Clean, electro-polished inner surfaces are available in multiple box sizes, with an SS304 liner.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eStandard 1-inch, QF, CF, and ISO Feedthrough Ports:\u003c\/strong\u003e Configurable port selection offers flexible integration of feedthroughs, gauges, and process gas.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInternal Lighting and 120 °C Baking Capability:\u003c\/strong\u003e Internal lighting enables chamber inspection, and baking supports conditioning and moisture removal.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFront Viewing Window with Rotatable Shutter:\u003c\/strong\u003e A direct line of sight allows process monitoring, while the rotatable shutter enables precise deposition timing.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFully Automatic Computer Control with Touch Screen Panel:\u003c\/strong\u003e A touch screen and real-time LCD displays handle all system operations automatically.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5-Hour Experiment Cycle Time:\u003c\/strong\u003e Fast pump-down and a short process cycle support multiple runs per day.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e75×120 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e The compact footprint passes through standard doorways and can be repositioned within the facility.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTwo-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Coverage for system components, design, and manufacturing quality extends to two years, double the standard one-year term.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003ch3\u003ePrinciples of Magnetron Sputtering\u003c\/h3\u003e\n\u003cp\u003eIn magnetron sputtering, a process gas is ionized and the resulting ions strike a cathode target. The impact ejects atoms, which then condense on the substrate and build up a thin film. A magnetic field holds the plasma close to the target face, raising ion density and sputtering yield even at low working pressures. A 600 V DC supply sputters conductive targets, whereas 13.6 MHz RF power dissipates the charge that accumulates on insulating and oxide targets. The 6-inch target format adds source material capacity and widens the usable deposition area for larger substrates.\u003c\/p\u003e\n\u003ch3\u003eMulti-Target, Co-Sputtering, and Reactive Deposition\u003c\/h3\u003e\n\u003cp\u003eA configuration of one to four sources permits sequential deposition within a single pump-down cycle, which limits contamination between material layers. Co-sputtering from sources powered at the same time produces composition-graded and alloy films without separate deposition steps. For reactive sputtering, N₂ or O₂ enters through MFM-controlled inputs while a metallic target is sputtered, forming nitride or oxide films without the need for compound targets. Throttle valve and capacitance manometer control keep plasma pressure stable across the 1 to 100 mTorr reactive process window.\u003c\/p\u003e\n\u003ch3\u003eAutomation and Substrate Preparation\u003c\/h3\u003e\n\u003cp\u003eLabVIEW automation manages the entire layer sequence, including shutter timing, power levels, and gas flow at each step, with no operator intervention between layers. RF plasma cleaning through substrate biasing removes native oxides before deposition and improves adhesion at the film-substrate interface. PID substrate heating from 50 to 600 °C encourages film crystallinity and surface diffusion during growth. Between runs, the isolation valve keeps the main chamber under vacuum, removing pump-down overhead for successive depositions.\u003c\/p\u003e\n\u003ch2\u003eRF\/DC Magnetron Sputtering System - ToronSputter™ RFDC Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\" style=\"height: 627.2px;\"\u003e\n\u003cthead\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003cth style=\"height: 19.6px;\"\u003eParameter\u003c\/th\u003e\n\u003cth style=\"height: 19.6px;\"\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eRF Power Supply\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e13.6 MHz, 300 to 1200 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eDC Power Supply\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e600 V DC, 1.7 A\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eNumber of Sputtering Sources\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1 to 4 (DC\/RF)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eTarget Diameters\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1\", 2\", 3\", 4\", 6\"\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eBase Pressure\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.2px;\"\u003e\n\u003ctd style=\"height: 39.2px;\"\u003eWorking Vacuum (Pump-Down Time)\u003c\/td\u003e\n\u003ctd style=\"height: 39.2px;\"\u003e10⁻⁶ Torr in 30 minutes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003ePump Configuration\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eTurbomolecular + Mechanical (cryo and dry pump as options)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eSputter Working Pressure Range\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1 to 100 mTorr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003ePlasma Pressure Measurement\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eAdditional capacitance manometer\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eChamber Material\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eSS304 (prismatic or cylindrical); electro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eChamber Sizes\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e30\/40\/50\/60 cm box size\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eObservation Window\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eFront viewing window; rotatable shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eInternal Lighting\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eBaking Capability\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eUp to 120 °C (internal)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eGas Inputs\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eAr, N₂, O₂, He, CH₄, H₂; 3-channel MFM; real-time electronic display\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eValve Configuration\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eThrottle, vent, and isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eSubstrate Heating\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e50 to 600 °C (PID controlled)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e3 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003ePlasma Cleaning\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eRF plasma via substrate biasing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eDual-channel; 0.1 Å\/s precision; 1 to 4 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 39.2px;\"\u003e\n\u003ctd style=\"height: 39.2px;\"\u003eControl System\u003c\/td\u003e\n\u003ctd style=\"height: 39.2px;\"\u003eFully automatic computer control; touch screen panel; real-time LCD; LabVIEW\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eCooling System\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eAutomatic start-stop closed-loop water cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eExperiment Cycle Time\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e1.5 hours\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eFootprint\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003ePasses through standard doorways\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eMobility\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"height: 19.6px;\"\u003e\n\u003ctd style=\"height: 19.6px;\"\u003eWarranty\u003c\/td\u003e\n\u003ctd style=\"height: 19.6px;\"\u003e2 years (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280281600239,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/rfdc-magnetron-sputtering-system.webp?v=1793010510"},{"product_id":"high-vacuum-double-magnetron-target-sputter-coater-thermalevaporator-dst2-tg","title":"High-Vacuum, Double-Magnetron Target Sputter Coater\/ ThermalEvaporator-DST2-TG","description":"\u003ch2\u003eHigh-Vacuum Double-Magnetron Target Sputter Coater \/ Thermal Evaporator – DST2-TG\u003c\/h2\u003e\n\u003cp\u003eThe DST2-TG, also known as the Double Target Turbo Pumped Sputter Coater and Thermal Evaporator, is an advanced coating system that combines thermal evaporation and sputter coating in one compact desktop unit. Operators can control the system remotely over a Wi-Fi connection, using either the built-in touch screen or a PC.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cp\u003eThis Magnetron Desk Sputter Coater has a roomy 300 mm diameter chamber and two water-cooled 2\" cathodes, which makes it well suited to long deposition runs. It works as a single platform for sputtering, carbon fiber deposition, and metal evaporation.\u003c\/p\u003e\n\u003cp\u003eDesigned specifically for glove box installation, the unit can sputter semiconductors, dielectrics, and metal targets. Sputtering cathodes and thermal evaporation boats can be fitted either interchangeably or at the same time, giving access to a total of three deposition sources. Carbon deposition is also possible using carbon fiber, which widens the range of materials the system can handle.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dst2-tg.webp?v=1793011195\" alt=\"High-Vacuum, Double-Magnetron Target Sputter Coater\/ ThermalEvaporator-DST2-TG\"\u003e\u003c\/p\u003e\n\u003cp\u003eThis precision vacuum coating system can run in semi-automated or fully automated mode. A 7\" color touch-screen panel lets users control and adjust deposition process data, and the intuitive software keeps operation simple. The same control panel window can be opened on a PC over Wi-Fi.\u003c\/p\u003e\n\u003cp\u003eVacuum levels and coating sequence information can be monitored and shown as digital readouts or curves on the touch screen. The history page also stores and displays the last 300 coatings.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dst2tg2.webp?v=1793011170\" alt=\"High-Vacuum, Double-Magnetron Target Sputter Coater\/ ThermalEvaporator-DST2-TG\"\u003e\u003c\/p\u003e\n\u003ch2\u003eProduct: DST2-TG Touch Screen Vacuum Coater\u003c\/h2\u003e\n\u003cp\u003eThe sputter coater and thermal evaporator for glove box applications can be upgraded with the following optional facilities:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eAn RF power supply with an auto-adjustable matching box, which minimizes reflected power during RF sputtering.\u003c\/li\u003e\n\u003cli\u003eA plasma cleaner, which removes organic matter from the substrate surface before thin film deposition.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dst2tg3.webp?v=1793011158\" alt=\"High-Vacuum, Double-Magnetron Target Sputter Coater\/ ThermalEvaporator-DST2-TG\"\u003e\u003c\/p\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eCombined sputter coater and thermal evaporator designed for glove box mounting\u003c\/li\u003e\n\u003cli\u003eBuilt-in turbomolecular pump for efficient vacuum performance\u003c\/li\u003e\n\u003cli\u003eSpacious chamber, 30 cm in diameter with a height range of 20–25 cm\u003c\/li\u003e\n\u003cli\u003eQuick, simple target installation with no target holder needed\u003c\/li\u003e\n\u003cli\u003eImproved heat conduction through targets fitted with backing plates\u003c\/li\u003e\n\u003cli\u003eRotating sample holder for uniform coating\u003c\/li\u003e\n\u003cli\u003eKF40 feedthroughs on the glove box for power supplies (DC, RF, and high current), the vacuum pump hose, water cooling, argon and reactive gas connections, and electrical connections\u003c\/li\u003e\n\u003cli\u003ePrecise gas injection control through Mass Flow Controllers (MFCs)\u003c\/li\u003e\n\u003cli\u003eTwo high-precision quartz crystal thickness sensors for accurate film thickness monitoring\u003c\/li\u003e\n\u003cli\u003eVac Coat products carry comprehensive worldwide public and product liability insurance, protecting against property damage or personal injury resulting from the use of Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eAutomation Features\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemi\/Fully Automatic Coating Process (Optional):\u003c\/strong\u003e Users can choose automated or semi-automated coating, matching the level of automation to their needs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEfficient Data Entry and Storage:\u003c\/strong\u003e Deposition process parameters can be entered quickly to streamline workflow, and process data is stored securely for easy retrieval and reference.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRemote Process Control:\u003c\/strong\u003e The deposition process can be controlled and monitored remotely from a PC over Wi-Fi, for added convenience and flexibility.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCoating Recipe Storage:\u003c\/strong\u003e Coating recipes can be saved so specific deposition processes can be repeated with consistent, reproducible results.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eElectronic Shutters:\u003c\/strong\u003e Electronic shutters give precise control over the coating process and manage substrate exposure during deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomated Cathode Selection:\u003c\/strong\u003e Cathodes are selected automatically, which streamlines operation and sets optimal deposition conditions for each material.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eOptional Facilities\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eRF Sputtering for Non-Conducting Targets (Optional):\u003c\/strong\u003e RF sputtering capability enables deposition from non-conducting targets, extending the range of coatable materials.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePlasma Cleaner (Optional):\u003c\/strong\u003e A plasma cleaner removes organic matter from the substrate surface before thin film deposition, providing a clean substrate for superior coating quality.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp\u003eThe system operates in a high vacuum environment and can deposit a wide variety of materials, making it a dependable choice for diverse coating applications. The double magnetron target desk sputter coater switches smoothly between evaporation and sputtering deposition, so complex multilayer coatings can be produced.\u003c\/p\u003e\n\u003cp\u003eThe DST2-TG is an all-in-one solution that brings efficiency and precision to coating work in a glove box setting.\u003c\/p\u003e\n\u003cp\u003eGlove box systems provide a protected environment for delicate materials, preventing exposure to air, moisture, and unwanted interactions. The DST2-TG high-vacuum coating system, integrated with a glove box, allows substrates to be handled safely and cleanly before or after deposition, all within an inert gas atmosphere. This configuration gives a tightly controlled chamber environment for accurate deposition of ultra-pure thin layers under high vacuum conditions.\u003c\/p\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280311910639,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/high-vacuum-double-magnetron-tar.webp?v=1793011121"},{"product_id":"pecvd-tube-furnace","title":"PECVD Tube Furnace","description":"\u003ch2\u003ePECVD Tube Furnace - ToronTF™ PECVD\u003c\/h2\u003e\n\u003ch3\u003ePlasma-Enhanced Chemical Vapor Deposition (PECVD) Tube Furnace System\u003c\/h3\u003e\n\u003cp\u003eThe ToronTF™ PECVD integrates a 1100 °C quartz tube furnace with a 300 W, 13.56 MHz inductively coupled plasma (ICP) source in a single PECVD tube furnace system. Inside the quartz sample zone, the ICP plasma energizes the precursor gases, so deposition can take place at lower temperatures than conventional thermal CVD while also improving film quality. Quartz tubes are offered in 50, 80, and 100 mm diameters, each 1000 mm long, to suit a range of sample sizes. PID temperature control holds ±1 °C, keeping deposition conditions stable throughout the full 1100 °C operating range.\u003c\/p\u003e\n\u003ch3\u003eGas Delivery, Vacuum Control, and Thermal Programming\u003c\/h3\u003e\n\u003cp\u003eA three-channel mass flow controller (MFC) system regulates Ar, N₂, O₂, H₂, CH₄, and NH₃ gases, supplied either pure or as mixtures, and extra channels can be added as an option. Throttle, vent, and isolation valves work under automated PLC vacuum control to hold the working pressure between 1 and 100 mTorr. Programmable heating profiles with user-adjustable steps let operators define the thermal ramp and soak sequence for every run. Operation is flexible, with both a PC touch screen and panel controls available, while a closed-cycle water cooling loop protects system components during deposition.\u003c\/p\u003e\n\u003ch3\u003eSample Handling, Contamination Control, and Installation\u003c\/h3\u003e\n\u003cp\u003eA quartz sample holder keeps the plasma confined to the deposition zone, which prevents contact with the chamber walls and lowers the risk of contamination. An easy-access sample load door makes loading and unloading simple between deposition runs. The system's 75×120 cm footprint sits on lockable wheels and fits through standard doorways, and its 220V, 16A power requirement keeps facility installation straightforward. The 50, 80, and 100 mm quartz tube diameter options accommodate varying sample sizes and process gas volumes.\u003c\/p\u003e\n\u003ch2\u003ePECVD Tube Furnace - ToronTF™ PECVD Applications\u003c\/h2\u003e\n\u003ch3\u003eApplications of the ToronTF™ PECVD Tube Furnace\u003c\/h3\u003e\n\u003cp\u003eThe ToronTF™ PECVD supports research and academic laboratories that need plasma-enhanced chemical vapor deposition for a wide variety of film materials. By pairing plasma activation with tube furnace heating, it makes possible processes that thermal CVD or plasma alone cannot achieve. Its compact tube design and flexible gas configuration fit materials science, semiconductor, and energy research programs.\u003c\/p\u003e\n\u003ch3\u003eTypical Research Uses\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eDiamond and DLC Film Deposition:\u003c\/strong\u003e Plasma-activated decomposition of hydrocarbon gases for diamond-like carbon and nanocrystalline diamond film research, carried out at substrate temperatures lower than those thermal CVD requires.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSilicon Nitride Thin Film Research:\u003c\/strong\u003e Plasma decomposition of NH₃ and N₂ precursors to form Si₃N₄ passivation layers, gate dielectrics, and encapsulation films for semiconductor and photovoltaic device research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSilicon Oxide Film Deposition:\u003c\/strong\u003e O₂ plasma-enhanced oxidation and co-deposition processes for SiO₂ gate dielectric, insulator, and passivation film research at controlled deposition temperatures.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCarbon Nanotube and Graphene Growth:\u003c\/strong\u003e Plasma-activated hydrocarbon decomposition on catalyst substrates for CNT growth and graphene synthesis within controlled temperature and gas environments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAmorphous Silicon and Thin-Film Solar Cell Research:\u003c\/strong\u003e PECVD deposition of amorphous silicon and silicon nitride films for layer research and prototyping in thin-film photovoltaic devices.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSurface Nitridation and Plasma Treatment:\u003c\/strong\u003e Plasma nitridation of metal and semiconductor surfaces with N₂ or NH₃ plasma to modify surface properties without depositing a full film.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic Materials Science Research:\u003c\/strong\u003e A flexible plasma CVD platform for exploratory thin film deposition across oxide, nitride, carbide, and carbon-based material systems.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003ePECVD Tube Furnace - ToronTF™ PECVD Key Features\u003c\/h2\u003e\n\u003ch3\u003eKey Features of the ToronTF™ PECVD Tube Furnace\u003c\/h3\u003e\n\u003cp\u003eThe ToronTF™ PECVD brings together a high-temperature tube furnace, an inductively coupled plasma source, a three-channel MFC gas system, and PLC vacuum automation. The result is a compact, mobile plasma CVD platform designed for research and academic laboratories.\u003c\/p\u003e\n\u003ch3\u003eFurnace and Temperature Performance\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e1100 °C Maximum Furnace Temperature:\u003c\/strong\u003e Runs continuously up to 1100 °C, supporting high-temperature PECVD processes such as oxide, nitride, carbon, and refractory material deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e±1 °C PID Furnace Temperature Control:\u003c\/strong\u003e Precise closed-loop regulation keeps deposition conditions stable and allows thermal recipes to be reproduced accurately.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eUser-Defined Programmable Heating Profiles:\u003c\/strong\u003e Multi-step heating sequences with adjustable ramp rates and soak times suit different film materials and post-deposition annealing treatments.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePlasma Source and Sample Zone\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e300 W, 13.56 MHz Inductively Coupled Plasma Source:\u003c\/strong\u003e The external coil ICP design produces high-density plasma without introducing electrode materials into the deposition zone.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eQuartz Sample Holder with Plasma Confinement to Sample Zone:\u003c\/strong\u003e The plasma is geometrically confined to the sample region, concentrating reactive species at the substrate surface while shielding the rest of the chamber.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eQuartz Tube (1000 mm Length, 50\/80\/100 mm Diameter):\u003c\/strong\u003e Interchangeable quartz tube diameters fit different sample sizes and process gas volumes, and custom diameters are available on request.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eGas Control and Vacuum Management\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e3-Channel MFC Gas Control (Ar, N₂, O₂, H₂, CH₄, NH₃):\u003c\/strong\u003e A mass flow controller system handles six precursor gas types and shows individual and mixed flows on a real-time digital display.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eExpandable Gas Line Configuration:\u003c\/strong\u003e Additional gas channels can be added beyond the standard three-channel setup, supporting a broader range of precursor chemistries.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eReal-Time Digital Gas Flow Display:\u003c\/strong\u003e Individual and mixed gas flow rates appear continuously on screen for process monitoring and documentation.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomated PLC Vacuum Control Unit:\u003c\/strong\u003e One-button start, stop, and vent operation automates vacuum sequencing during experiment setup and shutdown.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, and Isolation Valves with 1 to 100 mTorr Precision:\u003c\/strong\u003e Accurate working pressure control maintains stable plasma conditions throughout PECVD processes.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eOperation, Cooling, and Installation\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003ePC Touch Screen Control Option:\u003c\/strong\u003e A computer interface adds remote operation, recipe management, and real-time process monitoring alongside panel control.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEasy-Access Sample Load Door:\u003c\/strong\u003e Samples can be loaded and unloaded without extensive chamber disassembly, making sample exchange between runs efficient.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eClosed-Cycle Water Cooling System:\u003c\/strong\u003e Active water cooling protects the plasma source and system components for the duration of deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e220V, 16A Single-Phase Power Requirement:\u003c\/strong\u003e A standard single-phase electrical connection keeps laboratory installation simple.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e75×120 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e The compact footprint passes through standard doorways, making installation and repositioning within the laboratory easy.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eWarranty\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Annual coverage applies to system components, design quality, and manufacturing.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003ch3\u003ePrinciples of Plasma-Enhanced CVD\u003c\/h3\u003e\n\u003cp\u003ePlasma-enhanced CVD uses a low-pressure plasma to activate precursor gases, so films can be deposited at lower substrate temperatures than thermal CVD allows. The plasma breaks reactive gases down into free radicals and ions, which build up a thin film when they reach the substrate surface. Because plasma energy takes the place of thermal activation, the usable deposition temperature range widens and a greater variety of film compositions becomes accessible. A quartz sample holder confines the plasma to the substrate region, concentrating reactive species where they are needed and limiting plasma exposure elsewhere in the system.\u003c\/p\u003e\n\u003ch3\u003eInductively Coupled Plasma and Thermal Activation\u003c\/h3\u003e\n\u003cp\u003eThe inductively coupled plasma (ICP) source delivers 300 W of RF power at 13.56 MHz through a coil mounted outside the quartz tube. This arrangement creates high-density plasma without allowing electrode materials into the deposition zone. The plasma is dense enough to dissociate O₂, N₂, H₂, CH₄, and NH₃, supporting oxide, nitride, and carbon-based film deposition. Furnace temperatures up to 1100 °C work together with plasma activation to reach film compositions that call for both thermal and plasma energy. User-defined heating profiles with adjustable steps set the thermal ramp and soak for each run.\u003c\/p\u003e\n\u003ch3\u003eGas Control, Vacuum, and Cooling\u003c\/h3\u003e\n\u003cp\u003eA three-channel MFC gas system regulates Ar, N₂, O₂, H₂, CH₄, and NH₃, supplied pure or mixed, with additional channels available as an option. Throttle, vent, and isolation valves hold process pressure between 1 and 100 mTorr under automated PLC vacuum control. PC touch screen operation gives remote oversight of the gas, vacuum, and heating sequence. Throughout deposition, a closed-cycle water cooling system protects both the plasma source and the chamber.\u003c\/p\u003e\n\u003ch2\u003ePECVD Tube Furnace - ToronTF™ PECVD Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"583\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eFurnace Temperature\u003c\/td\u003e\n\u003ctd\u003eUp to 1100 °C (continuous)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTemperature Control\u003c\/td\u003e\n\u003ctd\u003ePID, ±1 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eQuartz Tube Length\u003c\/td\u003e\n\u003ctd\u003e1000 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eQuartz Tube Inner Diameter\u003c\/td\u003e\n\u003ctd\u003e50, 80, or 100 mm (custom diameters available)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Source Type\u003c\/td\u003e\n\u003ctd\u003eInductively coupled plasma (ICP)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Source Power\u003c\/td\u003e\n\u003ctd\u003e300 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Source Frequency\u003c\/td\u003e\n\u003ctd\u003e13.56 MHz\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Control\u003c\/td\u003e\n\u003ctd\u003e3-channel MFC (Ar, N₂, O₂, H₂, CH₄, NH₃); expandable\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Display\u003c\/td\u003e\n\u003ctd\u003eReal-time digital; individual and mixed flow rates\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Pressure Range\u003c\/td\u003e\n\u003ctd\u003e1 to 100 mTorr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eValve Configuration\u003c\/td\u003e\n\u003ctd\u003eThrottle, vent, and isolation valves\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control\u003c\/td\u003e\n\u003ctd\u003eAutomated PLC unit with start, stop, and vent functions\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eHeating Profile Control\u003c\/td\u003e\n\u003ctd\u003eUser-defined programmable profiles with adjustable steps\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Holder\u003c\/td\u003e\n\u003ctd\u003eQuartz (plasma confined to sample zone)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl Interface\u003c\/td\u003e\n\u003ctd\u003ePC touch screen (optional) and panel control\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eClosed-cycle water cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePower Requirement\u003c\/td\u003e\n\u003ctd\u003e220V, 16A (110V is also available)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003e75 × 120 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard doorways\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280328392943,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/pecvd-tube-furnace1050291131.webp?v=1793011486"},{"product_id":"reactive-ion-etching-rie-system","title":"Reactive Ion Etching (RIE) System","description":"\u003ch2\u003eReactive Ion Etching (RIE) System – ToronRIE™ 300\u003c\/h2\u003e\n\u003cp\u003eThe ToronRIE™ 300 is a parallel-plate plasma dry etching platform designed for semiconductor and MEMS device fabrication. Its stainless steel cylindrical chamber accommodates substrates up to 3 inches. A 300 W RF power supply with fully automatic impedance matching generates plasma between the parallel electrodes, producing reactive ions that etch materials with high selectivity and uniformity. A DC bias voltage readout provides real-time process monitoring. The PLC-controlled system includes a graphical HMI interface and supports both manual and fully automatic etching modes.\u003c\/p\u003e\n\u003cp\u003eA water-chilled sample holder with mechanical clamping keeps the substrate at a steady temperature and securely in position throughout the etch. The sample-to-electrode distance is adjustable, so operators can tune etch parameters for different process chemistries and substrate configurations. Process pressure is controlled independently of gas flow, and the automatic fast-acting pressure regulation responds to changing process conditions without interrupting the etch. The standard pump configuration reaches a base pressure of 5×10⁻² mbar, which meets the vacuum requirements of reactive ion etching processes.\u003c\/p\u003e\n\u003cp\u003eThe system etches Si, SiO₂, Si₃N₄, poly-Si, and selected metals. It also supports organic processes, including photoresist descumming, stripping, and polymeric film patterning. An optimized reaction chamber and electrode geometry deliver high etch rate uniformity across the substrate. With a compact W60×D95 cm footprint and a clean-room-compatible design, the system fits semiconductor laboratories and MEMS fabrication environments. A dry pump option is offered for oil-free vacuum system configurations.\u003c\/p\u003e\n\u003ch2\u003eReactive Ion Etching (RIE) System – ToronRIE™ 300 Applications\u003c\/h2\u003e\n\u003cp\u003eThe ToronRIE™ 300 reactive ion etching system supports semiconductor device fabrication, MEMS research, and academic thin film laboratories that need plasma dry etching with anisotropic etch profiles and high material selectivity. Its clean-room-compatible design and PLC automation make it a good fit for research programs as well as small-volume production environments.\u003c\/p\u003e\n\u003ch3\u003eSemiconductor Device Fabrication\u003c\/h3\u003e\n\u003cp\u003eDry etching of Si, SiO₂, Si₃N₄, and poly-Si layers for transistor gate patterning, via formation, and trench definition in semiconductor research and prototyping.\u003c\/p\u003e\n\u003ch3\u003eMEMS Device Fabrication\u003c\/h3\u003e\n\u003cp\u003eAnisotropic etching of silicon and oxide layers to create suspended structures, sensor membranes, and actuator elements in microelectromechanical device research.\u003c\/p\u003e\n\u003ch3\u003ePhotoresist Descumming and Stripping\u003c\/h3\u003e\n\u003cp\u003eOxygen plasma removal of photoresist residues, scum layers, and post-etch organic contamination, with no wet chemical processing required.\u003c\/p\u003e\n\u003ch3\u003ePolymeric Thin Film Etching and Patterning\u003c\/h3\u003e\n\u003cp\u003ePlasma etching of polymer films, organic device layers, and coatings for printed electronics, biosensor, and flexible device applications.\u003c\/p\u003e\n\u003ch3\u003eSurface Activation and Wettability Modification\u003c\/h3\u003e\n\u003cp\u003ePlasma treatment of substrate surfaces to improve adhesion, wettability, or surface energy ahead of subsequent coating or bonding steps.\u003c\/p\u003e\n\u003ch3\u003eAcademic and University Cleanroom Research\u003c\/h3\u003e\n\u003cp\u003eA compact RIE platform for thin film materials research, device prototyping, and cleanroom teaching environments.\u003c\/p\u003e\n\u003ch2\u003eReactive Ion Etching (RIE) System – ToronRIE™ 300 Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronRIE™ 300 reactive ion etching system combines a 300 W RF plasma source, water-chilled electrode, automatic impedance matching, independent pressure control, and PLC automation in a compact, clean-room-compatible dry etch platform for semiconductor and MEMS research.\u003c\/p\u003e\n\u003ch3\u003eUp to 3-Inch Wafer and Substrate Processing\u003c\/h3\u003e\n\u003cp\u003eThe system handles wafers and substrate pieces up to 3 inches, covering standard research wafer sizes for semiconductor and MEMS applications.\u003c\/p\u003e\n\u003ch3\u003e300 W RF Power Supply\u003c\/h3\u003e\n\u003cp\u003eA high-power RF source covers the full range of etch rates and plasma conditions required by the system's supported process chemistries.\u003c\/p\u003e\n\u003ch3\u003eFully Automatic Impedance Matching\u003c\/h3\u003e\n\u003cp\u003eAn automatic matching network optimizes power transfer between the RF generator and the plasma load, keeping conditions stable as pressures and gas chemistries change.\u003c\/p\u003e\n\u003ch3\u003eDC Bias Voltage Readout\u003c\/h3\u003e\n\u003cp\u003eA real-time display of self-bias voltage gives a continuous indication of ion energy at the substrate surface throughout the etch.\u003c\/p\u003e\n\u003ch3\u003eWater-Chilled Sample Holder\u003c\/h3\u003e\n\u003cp\u003eActive electrode cooling removes the heat generated by ion bombardment, protecting photoresist masks and temperature-sensitive samples from thermal damage during extended etch cycles.\u003c\/p\u003e\n\u003ch3\u003eMechanical Sample Clamping\u003c\/h3\u003e\n\u003cp\u003ePositive mechanical clamping holds wafers and substrate pieces firmly in place, preserving stable positioning and thermal contact with the chilled electrode surface.\u003c\/p\u003e\n\u003ch3\u003eAdjustable Sample-to-Electrode Distance\u003c\/h3\u003e\n\u003cp\u003eA variable electrode gap allows etch rate, uniformity, and ion energy distribution to be tuned for different process chemistries and substrate geometries.\u003c\/p\u003e\n\u003ch3\u003eAutomatic Fast-Acting Pressure Control\u003c\/h3\u003e\n\u003cp\u003eFast-response pressure regulation keeps etch conditions stable through changes in gas consumption and during process transitions.\u003c\/p\u003e\n\u003ch3\u003eProcess Pressure Control Independent from Gas Flow\u003c\/h3\u003e\n\u003cp\u003eDecoupled pressure and flow control lets operators adjust each parameter separately, widening the accessible process window.\u003c\/p\u003e\n\u003ch3\u003e5×10⁻² mbar Base Pressure\u003c\/h3\u003e\n\u003cp\u003eThe achievable base pressure meets the vacuum requirements for RIE plasma generation and limits surface contamination on the substrate before etching begins.\u003c\/p\u003e\n\u003ch3\u003eHigh Etch Rate Uniformity\u003c\/h3\u003e\n\u003cp\u003eAn optimized reaction chamber and electrode geometry deliver uniform etch rates across the substrate area, as confirmed by etch uniformity mapping data.\u003c\/p\u003e\n\u003ch3\u003eHigh Selectivity Between Materials\u003c\/h3\u003e\n\u003cp\u003ePlasma chemistry and RF parameters can be tuned to achieve high etch selectivity between the target material and the mask or underlying layers.\u003c\/p\u003e\n\u003ch3\u003eStainless Steel Cylindrical Chamber\u003c\/h3\u003e\n\u003cp\u003eStainless steel construction creates a durable, corrosion-resistant process environment compatible with oxygen and other non-corrosive plasma chemistries.\u003c\/p\u003e\n\u003ch3\u003ePLC Control with Graphical HMI Interface\u003c\/h3\u003e\n\u003cp\u003ePLC-based automation paired with an intuitive graphical HMI supports both manual and fully automatic etching operation.\u003c\/p\u003e\n\u003ch3\u003eFast Process Cycles\u003c\/h3\u003e\n\u003cp\u003eRapid pump-down and quick process setup shorten the time between successive etch runs, improving laboratory throughput.\u003c\/p\u003e\n\u003ch3\u003eDry Pump Option\u003c\/h3\u003e\n\u003cp\u003eAn oil-free vacuum pumping option removes the risk of hydrocarbon backstreaming, making it well suited to cleanroom and contamination-sensitive applications.\u003c\/p\u003e\n\u003ch3\u003eW60×D95 cm Compact Footprint\u003c\/h3\u003e\n\u003cp\u003eThe small floor footprint allows installation in standard laboratory and cleanroom spaces without dedicated bay infrastructure.\u003c\/p\u003e\n\u003ch3\u003eClean Room Compatible\u003c\/h3\u003e\n\u003cp\u003eThe system design meets the requirements for installation and operation in semiconductor and MEMS cleanroom environments.\u003c\/p\u003e\n\u003ch2\u003eReactive Ion Etching (RIE) System – ToronRIE™ 300 Theory and Method\u003c\/h2\u003e\n\u003ch3\u003ePrinciple of Reactive Ion Etching\u003c\/h3\u003e\n\u003cp\u003eReactive ion etching removes material from a substrate through a combination of chemical reaction and directional ion bombardment. At low pressure, an RF electric field creates a plasma between parallel electrodes, generating reactive species that include ions, radicals, and neutrals. These species attack the substrate chemically through surface reactions and physically through directional ion impact, which yields anisotropic etch profiles. Because it blends chemical and physical mechanisms, RIE offers greater selectivity and profile control than purely chemical wet etching.\u003c\/p\u003e\n\u003ch3\u003eRF Plasma Generation and Ion Energy Control\u003c\/h3\u003e\n\u003cp\u003eThe 300 W RF supply applies voltage across the parallel electrodes at 13.56 MHz to sustain the plasma between them. The substrate electrode is electrically isolated from the chamber and self-biases negative relative to the plasma potential, which accelerates positive ions toward the substrate with controlled directionality. A DC bias voltage readout lets the operator monitor ion energy continuously during processing. Fully automatic impedance matching maximizes power transfer between the RF generator and the plasma load, keeping conditions stable for the duration of the etch.\u003c\/p\u003e\n\u003ch3\u003ePressure Control and Process Flexibility\u003c\/h3\u003e\n\u003cp\u003eProcess pressure is regulated independently of gas flow rate, and automatic fast-acting pressure control maintains stable etch conditions throughout the process. This separation lets the operator adjust pressure and gas composition individually, widening the parameter space available for different material systems. The system is designed for non-corrosive chemistry processes, making it well suited to oxygen-based photoresist stripping, polymeric film patterning, and surface modification without the need for aggressive halogen gas infrastructure. Water cooling of the sample holder carries away the heat deposited by ion bombardment during sustained etch cycles.\u003c\/p\u003e\n\u003ch2\u003eReactive Ion Etching (RIE) System - ToronRIE™ 300 Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Size\u003c\/td\u003e\n\u003ctd\u003eUp to 3-inch wafer and substrate pieces\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRF Power Supply\u003c\/td\u003e\n\u003ctd\u003e300 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRF Frequency\u003c\/td\u003e\n\u003ctd\u003e13.56 MHz\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImpedance Matching\u003c\/td\u003e\n\u003ctd\u003eFully automatic\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDC Bias\u003c\/td\u003e\n\u003ctd\u003eSelf-bias voltage (continuously measured and displayed)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e5×10⁻² mbar\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePressure Control\u003c\/td\u003e\n\u003ctd\u003eAutomatic, fast-acting; independent from gas flow\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Construction\u003c\/td\u003e\n\u003ctd\u003eStainless steel, cylindrical\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Holder\u003c\/td\u003e\n\u003ctd\u003eWater-chilled\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Clamping\u003c\/td\u003e\n\u003ctd\u003eMechanical\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eElectrode Gap\u003c\/td\u003e\n\u003ctd\u003eAdjustable\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003ePLC with graphical HMI interface\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Modes\u003c\/td\u003e\n\u003ctd\u003eManual and fully automatic\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Pump\u003c\/td\u003e\n\u003ctd\u003eStandard configuration; dry pump option available\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCompatible Chemistries\u003c\/td\u003e\n\u003ctd\u003eNon-corrosive processes (O₂, Ar, N₂, and similar)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaterial Applications\u003c\/td\u003e\n\u003ctd\u003eSi, SiO₂, Si₃N₄, poly-Si, selected metals, photoresist, polymeric films\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003eW60 × D95 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eClean Room Compatible\u003c\/td\u003e\n\u003ctd\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280340582639,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/reactive-ion-etching-rie-system9.webp?v=1793011836"},{"product_id":"turbo-pumped-carbon-coater-and-thermal-evaporator-dct-t-300","title":"Turbo Pumped Carbon Coater and Thermal Evaporator – DCT-T-300","description":"\u003ch2\u003eTurbo Pumped Carbon Coater and Thermal Evaporator – DCT-T-300\u003c\/h2\u003e\n\u003cp\u003eThe DCT-T-300 turbo pumped carbon coater and thermal evaporator has a spacious chamber, making it a strong choice for preparing samples for FE-SEM, EDS\/WDS, TEM, and EBSD analysis, as well as thin film applications. It runs under high vacuum to deposit uniform carbon and metal films with fine grain sizes, which suits specimens that need high-resolution, high-quality characterization.\u003c\/p\u003e\n\u003cp\u003eThe system's cylindrical chamber measures 300 mm in diameter. It supports extended deposition runs on samples up to 15 cm across, or on several small specimens at once. A fully automatic, programmable carbon coating routine keeps results simple, precise, and repeatable.\u003c\/p\u003e\n\u003cp\u003eThe coater can also thermally evaporate low-melting-point materials in either direction, upward or downward. Because the distance between the thermal source and the substrate is adjustable, it adapts easily to different coating setups.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cp\u003eThe DCT-T-300 deposits carbon films for SEM, FE-SEM, EDX, and TEM sample preparation and can also produce conductive layers. Users may optionally run plasma treatment on TEM grids to improve hydrophilicity. The thermal source holder also makes it possible to clean TEM apertures.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSEM \u0026amp; FE-SEM Sample Preparation\u003c\/strong\u003e – Applies uniform carbon coatings for high-resolution imaging and accurate microstructural analysis.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEDS\/WDS Elemental Analysis\u003c\/strong\u003e – Creates fine-grain conductive films that improve X-ray microanalysis performance.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTEM \u0026amp; EBSD Studies\u003c\/strong\u003e – Delivers ultra-thin, uniform coatings that support crystallographic work and transmission electron microscopy.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThin Film Deposition\u003c\/strong\u003e – Thermally evaporates low-melting-point metals in upward or downward directions to meet varied coating needs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTEM Grid Treatment\u003c\/strong\u003e – Provides plasma treatment of TEM grids to increase hydrophilicity and improve imaging quality.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAperture Cleaning\u003c\/strong\u003e – Cleans TEM apertures with the integrated thermal source holder, helping extend instrument lifespan and usability.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003ch3\u003eHardware\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eA built-in Leybold turbo pump delivers high vacuum, backed by a two-stage rotary vane pump available in diaphragm or scroll versions.\u003c\/li\u003e\n\u003cli\u003eAn optional internal 500 W switching DC power supply is available for carbon fiber deposition.\u003c\/li\u003e\n\u003cli\u003eAn external 1.2 kW high-current DC power supply handles metal evaporation and carbon rod deposition.\u003c\/li\u003e\n\u003cli\u003eA quartz crystal thickness monitor with 1 nm precision and 1 Å resolution tracks deposition thickness accurately.\u003c\/li\u003e\n\u003cli\u003eAn automatic venting valve releases vacuum pressure in a controlled manner.\u003c\/li\u003e\n\u003cli\u003eSample rotation, height, and tilt are adjustable, a design intended especially for small sample holder stages.\u003c\/li\u003e\n\u003cli\u003eAn optional planetary sample holder adds versatility.\u003c\/li\u003e\n\u003cli\u003eTwo high-current electrical feed-throughs make it easy to install thermal sources.\u003c\/li\u003e\n\u003cli\u003eA movable thermal source holder supports both upward and downward deposition configurations.\u003c\/li\u003e\n\u003cli\u003eS-Clip sample holders on the thermal head enable upward deposition.\u003c\/li\u003e\n\u003cli\u003eAn electronic shutter gives precise control over the deposition process.\u003c\/li\u003e\n\u003cli\u003eSpecimen stages are quick to swap, and a rotation stage comes standard.\u003c\/li\u003e\n\u003cli\u003eThe system carries a two-year warranty and meets CE conformity standards.\u003c\/li\u003e\n\u003cli\u003eWorldwide public and product liability insurance covers property damage and personal injury.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eAutomation\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eAn intuitive touch screen interface simplifies control of the coating process and speeds up data entry.\u003c\/li\u003e\n\u003cli\u003eUser-friendly software can be updated over the network for ongoing improvements and better compatibility.\u003c\/li\u003e\n\u003cli\u003eAn optional semi-full automatic coating process increases efficiency.\u003c\/li\u003e\n\u003cli\u003eAutomatic mode runs repeatable, programmable carbon coating cycles for consistent results.\u003c\/li\u003e\n\u003cli\u003eOptional pulsed or flash carbon fiber coating modes serve specialized applications.\u003c\/li\u003e\n\u003cli\u003eOptional pulsed or ramped carbon rod coating modes address specific requirements.\u003c\/li\u003e\n\u003cli\u003eCarbon fiber, carbon rod, and thermal deposition run automatically to a preset thickness value, streamlining the workflow.\u003c\/li\u003e\n\u003cli\u003eCoating parameters are recorded and plotted as graphs for analysis and optimization.\u003c\/li\u003e\n\u003cli\u003eCoating recipes can be stored for quick access and repeatable depositions, supporting efficiency and consistency.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/1.webp?v=1793014449\" alt=\"Turbo Pumped Carbon Coater and Thermal Evaporator – DCT-T-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003ePulsed Carbon Fiber Evaporation\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eEvaporates carbon fiber in short, controlled bursts.\u003c\/li\u003e\n\u003cli\u003eOffers tighter deposition control than conventional methods.\u003c\/li\u003e\n\u003cli\u003eReduces debris and delivers cleaner coating results.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/2.webp?v=1793014442\" alt=\"Turbo Pumped Carbon Coater and Thermal Evaporator – DCT-T-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eCarbon Rod Evaporation (Optional)\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eAn optional carbon rod head provides an alternative deposition method.\u003c\/li\u003e\n\u003cli\u003eAn external 0–100 A high-current power supply is required.\u003c\/li\u003e\n\u003cli\u003eOffers greater flexibility than carbon fiber evaporation alone.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/3.webp?v=1793014434\" alt=\"Turbo Pumped Carbon Coater and Thermal Evaporator – DCT-T-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eThermal Evaporation\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eA high-current, low-voltage resistive thermal platform drives the evaporation process.\u003c\/li\u003e\n\u003cli\u003eAccommodates a wide range of materials while keeping deposition tightly controlled.\u003c\/li\u003e\n\u003cli\u003eWorks with several source types, including boats, baskets, and coils.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/4.webp?v=1793014434\" alt=\"Turbo Pumped Carbon Coater and Thermal Evaporator – DCT-T-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eClean Vacuum\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eThe cylindrical Pyrex chamber measures 300 mm in diameter and 200 mm in height.\u003c\/li\u003e\n\u003cli\u003eAn internal turbo molecular pump maintains a contamination-free vacuum.\u003c\/li\u003e\n\u003cli\u003eAn optional 6 m³\/h rotary vane pump is available for improved performance.\u003c\/li\u003e\n\u003cli\u003eOil backstreaming, a common issue with diffusion pumps, is eliminated.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/5.webp?v=1793014433\" alt=\"Turbo Pumped Carbon Coater and Thermal Evaporator – DCT-T-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eTouch Screen Control\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eA 7-inch color touch screen runs intuitive control software.\u003c\/li\u003e\n\u003cli\u003eVacuum levels and deposition sequences appear as numerical data or curves.\u003c\/li\u003e\n\u003cli\u003eThe history of the last 300 coatings is stored and can be exported easily over USB.\u003c\/li\u003e\n\u003cli\u003eDeposition parameters can be adjusted with precision.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eSample Holder Stages\u003c\/h2\u003e\n\u003cp\u003eThe DCT-T-300 offers a range of customized sample stage configurations to fit different user needs. The standard rotation stages turn freely and feature adjustable height and angle, making them easy to use and versatile. An optional rotary planetary sample stage is ideal for achieving uniform coatings on porous specimens. For larger samples, an optional 6-inch rotatable sample holder stage is recommended. It does not include incline adjustment, but it offers ample space for sizable specimens.\u003c\/p\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a4_2.webp?v=1793014601\" alt=\"Turbo Pumped Carbon Coater and Thermal Evaporator – DCT-T-300\"\u003e\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"aa91a57\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003eThe Turbo Pumped Carbon Coater and Thermal Evaporator offers an optional turbo molecular pump with various pumping speeds, enhancing its performance capabilities. Key specifications include:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eVacuum chamber dimensions of 300 mm outer diameter and 200 mm height.\u003c\/li\u003e\n\u003cli\u003eUltimate vacuum of less than 8 x 10-6 Torr.\u003c\/li\u003e\n\u003cli\u003eOverall dimensions measuring 580 x 500 x 630 mm (height x width x depth).\u003c\/li\u003e\n\u003cli\u003eUtilities requirement of 220\/110 V, 50\/60 Hz with a power rating of 2 kW.\u003c\/li\u003e\n\u003cli\u003eAutomatic control of pressure-independent coating processes.\u003c\/li\u003e\n\u003cli\u003ePrecise vacuum pressure adjustment facilitated by an automatic leak valve.\u003c\/li\u003e\n\u003cli\u003eReal-time visualization of coating parameters through plotted data.\u003c\/li\u003e\n\u003cli\u003eEasy transfer of coating data plots to a PC via a USB port.\u003c\/li\u003e\n\u003cli\u003eShipping weight of 46 kg.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"7683e06\" data-element_type=\"widget\" data-widget_type=\"eael-data-table.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv data-table_id=\"7683e06\" id=\"eael-data-table-wrapper-7683e06\" data-custom_responsive=\"false\"\u003e\n\u003ctable class=\"table\" id=\"eael-data-table-7683e06\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003ePumping Speed\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e90 l\/s\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e250 l\/s\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e350 l\/s\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003eUltimate Pressure\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e8×10\u003csup\u003e-6\u003c\/sup\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e3×10\u003csup\u003e-6\u003c\/sup\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003ctd colspan=\"\" rowspan=\"\" id=\"\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003e8×10\u003csup\u003e-7\u003c\/sup\u003e\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"73230e7\" data-element_type=\"widget\" data-widget_type=\"heading.default\"\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"8c7e718\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cp\u003eThe Turbo Pumped Carbon Coater and Thermal Evaporator system includes the following components and accessories:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eHead and power supply for carbon rod evaporation\u003c\/li\u003e\n\u003cli\u003ePlasma rod and high-voltage power supply for plasma treatment\u003c\/li\u003e\n\u003cli\u003eQuartz crystal sensor for precise monitoring\u003c\/li\u003e\n\u003cli\u003ePlanetary sample rotation mechanism for uniform coating\u003c\/li\u003e\n\u003cli\u003eSpare cylindrical vacuum glass chamber for backup or replacement\u003c\/li\u003e\n\u003cli\u003eCarbon fiber for deposition purposes\u003c\/li\u003e\n\u003cli\u003eSealing gaskets to ensure vacuum integrity\u003c\/li\u003e\n\u003cli\u003eSource boats and baskets for material containment during deposition processes\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280361423087,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/turbo-pumped-carbon-coater-and-t.webp?v=1793014782"},{"product_id":"advanced-reactive-ion-etching-rie-system","title":"Advanced Reactive Ion Etching (RIE) System","description":"\u003ch2\u003eAdvanced Reactive Ion Etching (RIE) System - ToronRIE™ 400\u003c\/h2\u003e\n\u003cp\u003eThe ToronRIE™ 400 is a high-performance reactive ion etching platform designed for 3-inch and 4-inch wafer formats. Its fluorine-based chemistry etches Si, SiOx, SixNy, dielectrics, and metals. A turbomolecular pump brings the chamber down to a base pressure of 10⁻⁷ mbar, while a process pressure window of 2×10⁻³ to 100×10⁻³ mbar supports steady plasma conditions. A 300 W RF generator with automatic matching at 13.56 MHz, combined with a tuned showerhead electrode, delivers etch rate non-uniformity under 4%. Strong DC self-bias capability produces improved anisotropic etch profiles.\u003c\/p\u003e\n\u003cp\u003eA recipe-driven HMI touchscreen runs automatic processing, giving dependable automation and repeatable results throughout semiconductor research and production workflows. Integrated interlocks keep every stage of the process safe, and a PLC-based architecture controls the full etch sequence, from pump-down through process execution. Up to 8 gas lines allow flexible configurations for different etch chemistries, and pressure control stays precise and independent throughout. Photoresist stripping and descum etching are supported in addition to the core dielectric and silicon etch processes.\u003c\/p\u003e\n\u003cp\u003eA mechanically clamped chuck with substrate cooling holds substrate temperature and position steady during etching, and sample heating is also offered for specific process needs. The adjustable chuck-to-electrode gap lets users fine-tune etch parameters for different chemistries and substrate geometries. The compact footprint and large viewing window allow visual inspection of the plasma and substrate while processing runs. A 10-inch HMI touchscreen provides an intuitive graphical interface for both process development and routine production runs.\u003c\/p\u003e\n\u003ch2 dir=\"ltr\" aria-level=\"4\"\u003eAdvanced Reactive Ion Etching (RIE) System - ToronRIE™ 400 Applications\u003c\/h2\u003e\n\u003cp dir=\"ltr\"\u003eThe ToronRIE™ 400 serves advanced semiconductor research and MEMS fabrication programs that call for fluorine-based dry etching, high-vacuum process conditions, and wafer-scale uniformity below 4%. It delivers all of this in a compact, cleanroom-compatible platform. Its fluorine chemistry and 8-line gas configuration cover a wider process range than basic non-corrosive RIE systems.\u003c\/p\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003e\n\u003cstrong\u003eSilicon and Silicon Dioxide Dry Etching:\u003c\/strong\u003e Fluorine-based plasma etching of Si and SiO₂ layers for transistor gate patterning, trench definition, and contact via formation in semiconductor device research.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSilicon Nitride Etch for MEMS and Device Isolation:\u003c\/strong\u003e Precise removal of SixNy layers for isolation structures, etch-stop applications, and suspended element fabrication in MEMS device programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMetal Thin Film Etching:\u003c\/strong\u003e Plasma etching of aluminum, titanium, and related metal films for metallization patterning in semiconductor and advanced materials device fabrication.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePhotoresist Descumming and Stripping:\u003c\/strong\u003e Oxygen plasma removal of photoresist residues and scum layers on 3-inch and 4-inch wafers, with no wet chemical processing required.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDielectric Patterning for Advanced Structures:\u003c\/strong\u003e Fluorine-based etching of SiO₂ and SixNy gate dielectrics and inter-layer dielectrics for MOS, bipolar, and MEMS device research programs.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh-Anisotropy Silicon Feature Etching:\u003c\/strong\u003e High DC self-bias operation produces deep, anisotropic silicon etch profiles for trench capacitors, shallow trench isolation, and MEMS microstructure fabrication.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdvanced Semiconductor and University Research:\u003c\/strong\u003e A recipe-controlled, multi-step etch platform for silicon, oxide, nitride, and metallic material systems in academic and industrial research programs.\u003cbr\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eAdvanced Reactive Ion Etching (RIE) System - ToronRIE™ 400 Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronRIE™ 400 is a compact parallel-plate RIE platform for 3-inch and 4-inch semiconductor and MEMS research. It combines fluorine-compatible chemistry, turbomolecular vacuum, showerhead gas distribution, high DC self-bias, and recipe-based HMI automation in a single system.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003e3-Inch and 4-Inch Wafer Configuration Support:\u003c\/strong\u003e Compatibility with two wafer sizes allows flexible processing across standard semiconductor research and production substrate formats.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFluorine-Based Chemistry for Si, SiOx, SixNy, Dielectrics, and Metals:\u003c\/strong\u003e Supports fluorine etch chemistries such as CF₄, SF₆, and related gases to pattern silicon and dielectric materials, extending capability beyond RIE systems limited to non-corrosive processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptimized Showerhead Electrode Design:\u003c\/strong\u003e Even gas distribution across the substrate reduces concentration gradients and supports a consistent etch rate and chemistry throughout the process zone.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEtch Rate Non-Uniformity Below 4%:\u003c\/strong\u003e Etch uniformity across 3-inch and 4-inch wafers is verified by etch rate uniformity mapping data.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHigh DC Self-Bias Capability:\u003c\/strong\u003e A high self-bias voltage raises ion energy at the substrate, producing anisotropic etch profiles with vertical sidewalls in Si and dielectric films.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTurbomolecular Vacuum System, 10⁻⁷ mbar Base Pressure:\u003c\/strong\u003e A deep base vacuum lowers residual gas contamination, supporting high-quality plasma etching across fluorine and oxygen chemistries.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eProcess Pressure Range of 2×10⁻³ to 100×10⁻³ mbar:\u003c\/strong\u003e A wide pressure window with precise, independent control accommodates a broad variety of plasma etch conditions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eUp to 8 Gas Lines for Flexible Chemistry:\u003c\/strong\u003e Generous gas line capacity handles complex multi-species process chemistries and gas configurations for sequential etch steps.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e300 W Auto-Matching RF Power Supply (13.56 MHz):\u003c\/strong\u003e Automatic impedance matching keeps RF power delivery stable across the full range of plasma conditions and gas chemistries.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10-Inch HMI Touchscreen Interface:\u003c\/strong\u003e A large graphical interface offers intuitive process control, real-time monitoring, and recipe management.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRecipe-Based Automatic Processing:\u003c\/strong\u003e Stored recipes enable one-touch execution of multi-step etch sequences, with no manual parameter changes between steps.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePLC-Controlled Architecture for Reliable Automation:\u003c\/strong\u003e PLC management of all system functions delivers repeatable results across semiconductor research and production workflows.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eBuilt-In Safety Interlock System:\u003c\/strong\u003e Comprehensive interlocks track RF, vacuum, and gas system status and automatically halt the process under unsafe conditions.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMechanically Clamped Chuck with Substrate Cooling:\u003c\/strong\u003e Positive clamping and active cooling protect temperature-sensitive substrates and photoresist masks during extended etch cycles.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSample Cooling and Heating Options:\u003c\/strong\u003e The temperature-controlled chuck cools sensitive samples and heats substrates for process chemistries that call for elevated temperatures.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAdjustable Chuck-to-Electrode Distance:\u003c\/strong\u003e Fine adjustment of the electrode gap optimizes etch parameters for different process chemistries and target film configurations.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePhotoresist Stripping and Descum Etching:\u003c\/strong\u003e Oxygen plasma cleaning and photoresist removal are available alongside the primary fluorine etch processes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCompact Footprint with Large Observation Window:\u003c\/strong\u003e The laboratory-friendly footprint includes a direct viewing window into the chamber, so the plasma and substrate can be monitored during development.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp\u003eReactive ion etching pairs chemical selectivity with directional ion bombardment, achieving an anisotropy that wet chemical etching cannot match. A 300 W RF source at 13.56 MHz generates plasma between the showerhead electrode and the substrate, creating reactive fluorine species from fluorine-containing gases. Fluorine radicals react with Si, SiO₂, and SixNy to form volatile etch products, which the turbomolecular system pumps away. Simultaneous ion bombardment strengthens directionality, producing the vertical profiles required for semiconductor and MEMS device patterning.\u003c\/p\u003e\n\u003cp\u003eThe optimized showerhead electrode spreads process gases evenly across the substrate, reducing the concentration gradients that lead to etch non-uniformity. The turbomolecular vacuum system reaches a 10⁻⁷ mbar base pressure, and the 2×10⁻³ to 100×10⁻³ mbar process range keeps plasma conditions stable throughout the etch. Together, these factors contribute to etch rate non-uniformity below 4% across 3-inch and 4-inch wafers. Up to 8 gas lines support complex multi-species chemistries under PLC control.\u003c\/p\u003e\n\u003cp\u003eHigh DC self-bias accelerates ions with enough energy to etch vertical sidewalls anisotropically in Si, SiO₂, and dielectric films. The mechanically clamped chuck with substrate cooling carries away heat generated by ion bombardment, while the optional heating configuration widens the accessible substrate temperature range. Recipe-based processing through the 10-inch HMI touchscreen runs multi-step sequences without operator intervention between steps. Built-in interlocks monitor vacuum, RF, and gas system status to keep the entire etch process safe.\u003c\/p\u003e\n\u003ch2\u003eAdvanced Reactive Ion Etching (RIE) System - ToronRIE™ 400 Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"526\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eSupported Wafer Sizes\u003c\/td\u003e\n\u003ctd\u003e3-inch and 4-inch\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRF Power Supply\u003c\/td\u003e\n\u003ctd\u003e300 W, auto-matching\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eRF Frequency\u003c\/td\u003e\n\u003ctd\u003e13.56 MHz\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ mbar (turbomolecular pump)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eProcess Pressure Range\u003c\/td\u003e\n\u003ctd\u003e2×10⁻³ to 100×10⁻³ mbar\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eEtch Rate Non-Uniformity\u003c\/td\u003e\n\u003ctd\u003eBelow 4%\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDC Self-Bias\u003c\/td\u003e\n\u003ctd\u003eHigh self-bias capability\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Lines\u003c\/td\u003e\n\u003ctd\u003eUp to 8\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eElectrode Type\u003c\/td\u003e\n\u003ctd\u003eOptimized showerhead\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCompatible Chemistries\u003c\/td\u003e\n\u003ctd\u003eFluorine-based (CF₄, SF₆, etc.) and oxygen-based\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaterial Applications\u003c\/td\u003e\n\u003ctd\u003eSi, SiO₂, SixNy, metals, photoresist, polymers\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChuck\u003c\/td\u003e\n\u003ctd\u003eMechanically clamped; water-cooled\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChuck Temperature Control\u003c\/td\u003e\n\u003ctd\u003eCooling standard; heating available as option\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eElectrode Gap\u003c\/td\u003e\n\u003ctd\u003eAdjustable\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003ePLC with 10\" HMI touchscreen\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOperating Mode\u003c\/td\u003e\n\u003ctd\u003eManual and recipe-based automatic\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSafety\u003c\/td\u003e\n\u003ctd\u003eBuilt-in interlock system (RF, vacuum, gas)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePressure Control\u003c\/td\u003e\n\u003ctd\u003ePrecise; independent from gas flow\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280478535919,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/advanced-reactive-ion-etching-ri.webp?v=1793017299"},{"product_id":"desk-carbon-coater-dcr","title":"Desk Carbon Coater - DCR","description":"\u003ch2\u003eDesk Carbon Coater - DCR\u003c\/h2\u003e\n\u003cp\u003eThe Desk Carbon Coater - DCR is a compact carbon fiber coating system built for sample preparation in scanning electron microscopy (SEM), transmission electron microscopy (TEM), and X-ray analysis (EDX).\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eScanning Electron Microscopy (SEM):\u003c\/strong\u003e Deposits thin, uniform conductive carbon coatings that prevent charging on non-conductive samples.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTransmission Electron Microscopy (TEM):\u003c\/strong\u003e Prepares specimens with precisely controlled carbon coatings for high-resolution imaging.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eX-ray Analysis (EDX\/EDS):\u003c\/strong\u003e Produces carbon films that minimize interference and improve the accuracy of elemental detection.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eMaterial Science Research:\u003c\/strong\u003e Provides dependable coatings for porous, polymeric, or fragile samples that require uniform conductivity.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eNanotechnology and Advanced Materials:\u003c\/strong\u003e Supports exact sample preparation for microstructural and surface characterization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and Industrial Laboratories:\u003c\/strong\u003e Delivers repeatable, controlled coatings, with a stored coating history to support quality assurance.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eQuality Control and R\u0026amp;D:\u003c\/strong\u003e Enables more accurate testing by reducing charging effects and strengthening analytical performance.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures and Advantages\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal monitoring system for real-time thickness measurement with 1 nm precision\u003c\/li\u003e\n\u003cli\u003eBoth pulsed and flash carbon fiber coating modes\u003c\/li\u003e\n\u003cli\u003eIntuitive touchscreen interface for simple control and monitoring of the coating process, with rapid data entry\u003c\/li\u003e\n\u003cli\u003eUser-friendly software that can be updated over the network\u003c\/li\u003e\n\u003cli\u003eAbility to record coating parameters and plot them as graphs\u003c\/li\u003e\n\u003cli\u003eEasily interchangeable specimen stages, with a rotation stage included as standard\u003c\/li\u003e\n\u003cli\u003eTwo-year warranty for added peace of mind\u003c\/li\u003e\n\u003cli\u003eCE conformity, confirming compliance with safety standards\u003c\/li\u003e\n\u003cli\u003eGlobal public and product liability insurance coverage for all Vac Coat products, protecting against property damage or personal injury caused by Vac Coat systems\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eDCR Options and Accessories\u003c\/h3\u003e\n\u003cp\u003eThe carbon coating system is available with the following options and accessories:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003eOptional sample planetary rotation system\u003c\/li\u003e\n\u003cli\u003eSpare cylindrical vacuum glass chamber\u003c\/li\u003e\n\u003cli\u003eCarbon fiber\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003ePulsed Carbon Fiber Evaporation\u003c\/h3\u003e\n\u003cp\u003eThe DCR desk vacuum carbon coating system can perform pulsed carbon fiber evaporation. Short pulses allow more precise deposition and significantly cut the debris commonly produced by conventional carbon deposition methods.\u003c\/p\u003e\n\u003ch3\u003eColor Touchscreen Control\u003c\/h3\u003e\n\u003cp\u003eThe desk carbon coater features a 7-inch color touchscreen that provides fully automatic control and straightforward data entry, making it easy to operate even for first-time users. Vacuum level, current, and deposition information can be viewed as digital readouts or as curves on the display. The system also stores data from the last 300 coatings, which can be reviewed on the history page.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcr1_81792976-f0b9-4767-ba84-a2edba472033.webp?v=1793017716\" alt=\"Desk Carbon Coater - DCR\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcr2_ea21384d-d4de-49a1-8836-c5bfdacdf0f0.webp?v=1793017714\" alt=\"Desk Carbon Coater - DCR\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eSample Holder\u003c\/h3\u003e\n\u003cp\u003eThe DCR can be configured with a range of sample stage options to suit specific user requirements. Each stage rotates and offers adjustable height for easy customization. The rotary planetary sample stage is especially effective for achieving uniform coatings on porous specimens and is the recommended choice for those applications.\u003c\/p\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcrslider3_2.webp?v=1793017713\" alt=\"Desk Carbon Coater - DCR\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcs2_2.webp?v=1793017712\" alt=\"Desk Carbon Coater - DCR\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcs3_2.webp?v=1793017711\" alt=\"Desk Carbon Coater - DCR\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/dcrslider1-1_2.webp?v=1793017707\" alt=\"Desk Carbon Coater - DCR\"\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cul\u003e\n\u003cli\u003eTwo-stage, direct drive rotary vane pump with a 4 m³\/h capacity\u003c\/li\u003e\n\u003cli\u003eUltimate vacuum: Less than 50 millitorr\u003c\/li\u003e\n\u003cli\u003eChamber dimensions: 170 mm outer diameter (OD) x 140 mm Pyrex cylinder\u003c\/li\u003e\n\u003cli\u003ePower supply: 0-25A switching pulsed DC power supply\u003c\/li\u003e\n\u003cli\u003eDimensions: 450 mm (height) x 500 mm (width) x 370 mm (depth)\u003c\/li\u003e\n\u003cli\u003ePower requirements: 220V-240V, 50\/60Hz, 10A\u003c\/li\u003e\n\u003cli\u003eFeatures a rotational sample holder with adjustable tilt and height\u003c\/li\u003e\n\u003cli\u003eOptional sample holder with planetary rotation\u003c\/li\u003e\n\u003cli\u003eElectronic shutter for added convenience\u003c\/li\u003e\n\u003cli\u003eOffers both manual and full automatic control options\u003c\/li\u003e\n\u003cli\u003ePrecision electronic leak valve for fine control of vacuum pressure\u003c\/li\u003e\n\u003cli\u003eReal-time plots display coating parameters\u003c\/li\u003e\n\u003cli\u003eEasy transfer of coating data plots via the USB port to a PC\u003c\/li\u003e\n\u003cli\u003eShipping weight: 46 kilograms\u003c\/li\u003e\n\u003cli\u003eIncludes Plasma Cleaning functionality\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280567828719,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/desk-carbon-coater-dcr1420787925.webp?v=1793017593"},{"product_id":"large-desk-turbo-pumped-carbon-coater-dct-300","title":"Large Desk Turbo-Pumped Carbon Coater – DCT-300","description":"\u003ch2\u003eLarge Desk Turbo-Pumped Carbon Coater – DCT-300\u003c\/h2\u003e\n\u003cp\u003eThe DCT-300 is a large desk turbo-pumped carbon coater built with a spacious chamber for preparing samples for FE-SEM, EDS\/WDS, TEM, and EBSD analysis, as well as thin film work. It produces high-quality, uniform carbon films with fine grain sizes, making it a strong choice for specimens that demand excellent resolution and detailed characterization.\u003c\/p\u003e\n\u003cp\u003eIts cylindrical chamber measures 300 mm in diameter, which supports extended deposition runs on samples up to 15 cm across or on several small specimens at once. A fully automated, programmable carbon coating process keeps results simple, accurate, and consistent from run to run.\u003c\/p\u003e\n\u003cp\u003eUsers can mount carbon fiber threads or rods on separate chamber heads and coat samples in flash, pulsed, or ramped modes. Ramped mode is available only with carbon rods and can be controlled either manually or automatically during deposition.\u003c\/p\u003e\n\u003ch2\u003eApplications\u003c\/h2\u003e\n\u003cp\u003eThe DCT-300 deposits fine-grain carbon films that suit sample preparation for SEM, FE-SEM, EDX, and TEM applications. It can also be used to form conductive layers.\u003c\/p\u003e\n\u003cp\u003eFor improved hydrophilicity, TEM grid plasma treatment is available as an optional feature.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eSEM \u0026amp; FE-SEM Sample Preparation\u003c\/strong\u003e – Creates uniform, fine-grain carbon coatings for high-resolution imaging and structural characterization.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEDS\/WDS Elemental Analysis\u003c\/strong\u003e – Improves microanalysis accuracy with stable, conductive films that keep contamination to a minimum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eTEM \u0026amp; EBSD Research\u003c\/strong\u003e – Supports advanced crystallographic and transmission electron microscopy work with ultra-thin, consistent coatings.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThin Film Preparation\u003c\/strong\u003e – Deposits fine carbon layers for thin film and surface science applications.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eConductive Layer Formation\u003c\/strong\u003e – Applies dependable conductive coatings to non-conductive specimens, improving imaging performance.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional Plasma Treatment\u003c\/strong\u003e – Allows TEM grid plasma treatment to increase hydrophilicity and optimize imaging conditions.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eFeatures\/Advantages\u003c\/h2\u003e\n\u003ch3\u003eHardware\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eA built-in Leybold turbo pump with a pumping speed of 90 liters per second achieves a high vacuum level.\u003c\/li\u003e\n\u003cli\u003eA two-stage rotary vane backing pump is included, available as either a diaphragm or scroll pump.\u003c\/li\u003e\n\u003cli\u003eA 500-watt switching DC power supply is provided for carbon fiber deposition.\u003c\/li\u003e\n\u003cli\u003eA 1.2-kilowatt high-current DC power supply is available as an option for carbon rod deposition.\u003c\/li\u003e\n\u003cli\u003eA quartz crystal thickness monitor offers 1 nanometer precision and 1 angstrom resolution.\u003c\/li\u003e\n\u003cli\u003eAn automatic venting valve adds convenience.\u003c\/li\u003e\n\u003cli\u003eSample rotation, height, and tilt are adjustable to suit the needs of small sample holder stages.\u003c\/li\u003e\n\u003cli\u003eAn optional planetary sample holder adds versatility.\u003c\/li\u003e\n\u003cli\u003eAn electronic shutter provides improved process control.\u003c\/li\u003e\n\u003cli\u003eSpecimen stages are quick to change, and a rotation stage comes standard.\u003c\/li\u003e\n\u003cli\u003eThe system carries a two-year warranty and meets CE standards.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch3\u003eAutomation\u003c\/h3\u003e\n\u003cul\u003e\n\u003cli\u003eAn intuitive touch screen interface makes it easy to control the coating process and enter data quickly.\u003c\/li\u003e\n\u003cli\u003eUser-friendly software can be updated over the network to deliver ongoing improvements.\u003c\/li\u003e\n\u003cli\u003eA semi-full automatic coating process is available as an option.\u003c\/li\u003e\n\u003cli\u003eIn automatic mode, the coating process is programmable and repeatable for consistent results.\u003c\/li\u003e\n\u003cli\u003ePulsed and flash carbon fiber coating modes are supported.\u003c\/li\u003e\n\u003cli\u003ePulsed or ramped carbon rod coating modes are available as an option.\u003c\/li\u003e\n\u003cli\u003eCarbon fiber or rod is deposited automatically to the specified thickness value.\u003c\/li\u003e\n\u003cli\u003eCoating parameters are recorded and plotted in graphs for analysis.\u003c\/li\u003e\n\u003cli\u003eCoating recipes can be stored for easy retrieval and repeatable depositions.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/9-1.webp?v=1793018045\" alt=\"Large Desk Turbo-Pumped Carbon Coater – DCT-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003ePulsed Carbon Fiber Evaporation\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eShort, controlled pulses drive the carbon fiber evaporation process.\u003c\/li\u003e\n\u003cli\u003ePrecise deposition delivers consistent, repeatable coating results.\u003c\/li\u003e\n\u003cli\u003eDebris is reduced compared with conventional carbon coating methods.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/10-1.webp?v=1793018078\" alt=\"Large Desk Turbo-Pumped Carbon Coater – DCT-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eCarbon Rod Evaporation (Optional)\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eA carbon rod head is available as an option for specific applications.\u003c\/li\u003e\n\u003cli\u003eAn external 0–100 A high-current power supply is required for operation.\u003c\/li\u003e\n\u003cli\u003eThis external supply takes the place of the internal supply designed for carbon fiber evaporation.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/15.webp?v=1793018112\" alt=\"Large Desk Turbo-Pumped Carbon Coater – DCT-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eClean Vacuum\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eA durable Pyrex cylindrical chamber provides a sturdy, dependable build.\u003c\/li\u003e\n\u003cli\u003eA 90 L\/s turbo molecular pump generates the vacuum.\u003c\/li\u003e\n\u003cli\u003eA 6 m³\/h two-stage rotary vane pump is available as an option for added capacity.\u003c\/li\u003e\n\u003cli\u003eOil contamination common to diffusion pump systems is eliminated.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/5_2.webp?v=1793018137\" alt=\"Large Desk Turbo-Pumped Carbon Coater – DCT-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eTouch Screen Control\u003c\/h3\u003e\n\u003cul dir=\"ltr\"\u003e\n\u003cli\u003eA 7-inch color touch screen runs the system through automatic software control.\u003c\/li\u003e\n\u003cli\u003eVacuum levels and coating sequences appear on screen as data readouts or curves.\u003c\/li\u003e\n\u003cli\u003eThe history of the last 300 coatings is stored for easy reference.\u003c\/li\u003e\n\u003cli\u003eAn integrated USB port makes it simple to transfer data to a PC.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ctable width=\"100%\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/11.webp?v=1793018190\" alt=\"Large Desk Turbo-Pumped Carbon Coater – DCT-300\"\u003e\u003c\/td\u003e\n\u003ctd\u003e\n\u003ch3 dir=\"ltr\" aria-level=\"4\"\u003eSample Holder Stages of DCT-300\u003c\/h3\u003e\n\u003cp dir=\"ltr\"\u003eThe Large Desk Turbo-Pumped Carbon Coater – DCT-300 supports several sample stage configurations to match a range of user requirements. Each stage rotates, offers adjustable height and angle, and can be exchanged quickly.\u003c\/p\u003e\n\u003cp dir=\"ltr\"\u003eFor even coating of porous specimens, an optional rotary planetary sample stage is available. When depositing on large samples, the optional 6-inch rotatable sample holder stage is the recommended choice. Note that this stage does not include angle adjustment.\u003c\/p\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp class=\"accordion-button icon-link icon-link-hover\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/a5_65448f49-4bd2-468e-af87-762b45f4e86a.webp?v=1793018251\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ch2 class=\"accordion-button icon-link icon-link-hover\" id=\"accordion-field-technical-specifications\" data-group=\"group_specifications\" data-bs-toggle=\"collapse\" data-controls=\"field_technical_specifications\" aria-expanded=\"true\" role=\"button\" data-bs-target=\"#field-technical-specifications\" aria-controls=\"field-technical-specifications\"\u003eTechnical Specifications\u003c\/h2\u003e\n\u003ch2 class=\"accordion-header\" id=\"heading_field_technical_specifications\"\u003e\u003c\/h2\u003e\n\u003cdiv id=\"field-technical-specifications\" class=\"accordion-collapse collapse show\" aria-labelledby=\"heading_field_technical_specifications\" data-bs-parent=\"#group-specifications\"\u003e\n\u003cdiv class=\"accordion-body\"\u003e\n\u003cdiv class=\"clearfix text-formatted field field--name-field-technical-specifications field--type-text-long field--label-hidden field--item\"\u003e\n\u003cdiv data-id=\"a809dd7\" data-element_type=\"widget\" data-settings='{\"tabs_justify_horizontal\":\"stretch\",\"horizontal_scroll_mobile\":\"enable\",\"horizontal_scroll\":\"enable\"}' data-widget_type=\"nested-tabs.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv data-widget-number=\"176\" aria-label=\"Tabs. Open items with Enter or Space, close with Escape and navigate using the Arrow keys.\" data-touch-mode=\"false\"\u003e\n\u003cdiv\u003e\n\u003cdiv id=\"e-n-tab-content-1763\" role=\"tabpanel\" aria-labelledby=\"e-n-tabs-title-1763\" data-tab-index=\"3\" data-id=\"dd32341\" data-element_type=\"container\" data-settings='{\"background_background\":\"classic\"}'\u003e\n\u003cdiv\u003e\n\u003cdiv data-id=\"8a245c7\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eFull range vacuum gauge (Leybold)\u003c\/li\u003e\n\u003cli\u003e300 mm OD × 200 mm H vacuum chamber\u003c\/li\u003e\n\u003cli\u003eUltimate vacuum: Less than 8 x 10-6 Torr\u003c\/li\u003e\n\u003cli\u003eDimensions: 580 x 500 x 630 mm (H × W × D)\u003c\/li\u003e\n\u003cli\u003eUtilities: 220\/110 V, 50\/60 HZ – 2 kW\u003c\/li\u003e\n\u003cli\u003eAutomatically controlled pressure-independent coating\u003c\/li\u003e\n\u003cli\u003eFine control of vacuum pressure with automatic leak valve\u003c\/li\u003e\n\u003cli\u003eReal-time plots of coating parameters\u003c\/li\u003e\n\u003cli\u003eSimple transfer of coating data plots via USB port to PC\u003c\/li\u003e\n\u003cli\u003eShipping weight: 46 Kg\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"367121e\" data-element_type=\"widget\" data-widget_type=\"heading.default\"\u003e\n\u003cdiv\u003e\n\u003ch3\u003eOptions and Accessories\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv data-id=\"9470cfd\" data-element_type=\"widget\" data-widget_type=\"elementskit-heading.default\"\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cdiv\u003e\n\u003cul\u003e\n\u003cli\u003eHead and power supply for carbon rod\u003c\/li\u003e\n\u003cli\u003ePlasma rod and high voltage power supply for plasma treatment\u003c\/li\u003e\n\u003cli\u003eQuartz crystal sensor\u003c\/li\u003e\n\u003cli\u003ePlanetary sample rotation\u003c\/li\u003e\n\u003cli\u003eSpare cylindrical vacuum glass chamber\u003c\/li\u003e\n\u003cli\u003eCarbon fiber\u003c\/li\u003e\n\u003cli\u003eSealing gaskets\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280577724655,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/large-desk-turbo-pumped-carbon-c.webp?v=1793018353"},{"product_id":"hybrid-pvd-deposition-system","title":"Hybrid PVD Deposition System","description":"\u003ch2\u003eHybrid PVD Deposition System – ToronPVD™ DS\u003c\/h2\u003e\n\u003ch3\u003eCombined Thermal Evaporation and Magnetron Sputtering System\u003c\/h3\u003e\n\u003cp\u003eThe ToronPVD™ DS is a hybrid PVD deposition system that places four-channel thermal evaporation and DC\/RF magnetron sputtering inside a single SS304L chamber. It is designed for multilayer thin film deposition and co-deposition research. Four thermal sources rated from 10V to 250A, built around a proprietary boxed co-evaporation design, run alongside DC\/RF sputtering sources in 1, 2, and 3-inch configurations. The system reaches a base pressure of 10⁻⁸ Torr, and a loaded chamber pumps down to 10⁻⁷ Torr within one hour. A 1.5-hour cycle and LabVIEW touch screen control make four to six experiments per day possible.\u003c\/p\u003e\n\u003cp\u003eRF (13.6 MHz, 300 to 1200 W) and DC (0 to 1000 V, 2000 W) power supplies handle both insulating and conductive targets in every deposition mode. A digital MFC regulates Ar, N₂, O₂, He, CH₄, and H₂ at 0.1 SCCM, enabling reactive oxide and nitride deposition. Working pressure is tightly controlled from 1 to 100 mTorr for stable plasma generation. An optional PID heater, operating from 50 to 700 °C (±1 °C), accommodates 3\", 4\", and 6\" wafers.\u003c\/p\u003e\n\u003cp\u003eA dual-channel thickness controller supports 1 to 4 QCMs at 0.1 Å\/s precision and tracks deposition rate and cumulative thickness across both thermal and sputtering sources. Optional ICP, CCP, and DC-RF plasma cleaning can prepare the substrate before deposition. The SS304L chamber is available in prismatic or cylindrical form and features electro-polished surfaces, standard 1\", QF, CF, and ISO feedthrough ports, a UV-blocking observation window, and a rotatable shutter. At L120×W80×H180 cm, the system rolls on lockable wheels and fits through standard doorways.\u003c\/p\u003e\n\u003ch2\u003eHybrid PVD Deposition System – ToronPVD™ DS Applications\u003c\/h2\u003e\n\u003cp\u003eThe ToronPVD™ DS is built for research and production PVD laboratories that need thermal evaporation and magnetron sputtering in the same vacuum system. Running both deposition modes within one pump-down cycle shortens processing time and protects interface cleanliness. Its four-source co-evaporation capability and configurable sputtering guns make it a strong fit for heterogeneous multilayer and alloy film research programs.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eMultilayer Organic\/Inorganic Device Research:\u003c\/strong\u003e Deposit organic or metallic layers by thermal evaporation, then sputtered oxide or nitride films, all in one vacuum cycle with no venting between layers.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOLED and Organic Device Fabrication:\u003c\/strong\u003e Thermally evaporate organic emitter and transport layers, then add sputter-deposited conductive contact films for OLED and OPV device development.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eCo-Evaporation Alloy and Compound Film Research:\u003c\/strong\u003e Run multiple thermal sources at the same time to co-evaporate composition-controlled alloy and compound films that demand precise multi-material flux control.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eHard Coating and Multi-Material Stack Research:\u003c\/strong\u003e Combine reactive sputtering of nitride and oxide films with thermally evaporated metallic seed or functional layers on a single deposition platform.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSemiconductor Device Prototyping:\u003c\/strong\u003e Deposit metal contacts by thermal evaporation and dielectric films by RF sputtering on wafer substrates up to 6 inches, all in one pump-down session.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptical Thin Film Research:\u003c\/strong\u003e Pair thermally evaporated metallic reflector layers with reactive RF-sputtered oxide coatings to build optical filter, anti-reflective, and mirror film stacks.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAcademic and University Multi-Source PVD Research:\u003c\/strong\u003e Give research programs a flexible platform for evaporation and sputtering without switching tools between deposition steps.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eHybrid PVD Deposition System – ToronPVD™ DS Key Features\u003c\/h2\u003e\n\u003cp\u003eThe ToronPVD™ DS brings together four-source thermal co-evaporation, DC\/RF magnetron sputtering, MFC gas control, PLC automation, and dual-channel thickness monitoring on one high-vacuum platform for multilayer and multi-material thin film research.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003eFour 10V to 250A Thermal Sources in a 2×2 Co-Evaporation Configuration:\u003c\/strong\u003e High-current co-evaporation sources in a proprietary boxed design that prevents cross-contamination and makes boat and basket replacement easy.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eProprietary Boxed Source Design:\u003c\/strong\u003e The enclosed source geometry keeps evaporant from reaching neighboring crucibles, preserving composition purity in co-deposited films.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC\/RF Sputtering Sources (1\", 2\", 3\"), 85 mm Flex-Head Design:\u003c\/strong\u003e Handles magnetic and non-magnetic target materials, with a flex-head that allows flexible mounting and target alignment at every source position.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eRF Power Supply (13.6 MHz, 300 to 1200 W):\u003c\/strong\u003e Supports insulating targets and reactive sputtering of oxide and nitride films at both research and production power levels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDC Power Supply (0 to 1000 V, 2000 W):\u003c\/strong\u003e A high-power DC supply for sputtering metallic targets and for powering thermal co-evaporation sources.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e10⁻⁸ Torr Base Pressure, 10⁻⁷ Torr in One Hour (Loaded):\u003c\/strong\u003e A turbomolecular and mechanical pump stack, with cryo and dry pump options, delivers the rapid pump-down behind the 1.5-hour experiment cycle.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eWide-Range Vacuum Control (1000 to 10⁻⁹ Torr):\u003c\/strong\u003e One measurement system spans the full pressure range needed for both thermal evaporation and sputtering deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePrecise Plasma Pressure Control (1 to 100 mTorr):\u003c\/strong\u003e Independent pressure setting maintains stable plasma conditions during sputtering and reactive deposition.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDigital MFC Gas Control (Ar, N₂, O₂, He, CH₄, H₂) at 0.1 SCCM Sensitivity:\u003c\/strong\u003e Six-gas MFC delivery supports inert and reactive deposition in both evaporation and sputtering modes.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e0.1 Å\/s Dual-Channel Thickness Monitoring with 1 to 4 QCMs:\u003c\/strong\u003e Measures rate and thickness simultaneously and precisely across active thermal and sputtering source channels.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional 50 to 700 °C PID Substrate Heater (±1 °C):\u003c\/strong\u003e Controls substrate temperature to support film crystallinity and adhesion, and works with 3\", 4\", and 6\" wafers as well as 1 to 10 cm sample attachments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e2 to 30 rpm Sample Rotation:\u003c\/strong\u003e Continuously adjustable rotation promotes uniform film thickness across the substrate surface.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOptional ICP, CCP, and DC-RF Substrate Plasma Cleaning:\u003c\/strong\u003e Prepares the substrate surface in situ before deposition, without breaking vacuum.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eAutomatic Closed-Loop Water Cooling with Interlock:\u003c\/strong\u003e Thermal management blocks source operation unless coolant is flowing, protecting plasma sources and thermal source assemblies.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eThrottle, Vent, and Isolation Valve Configuration:\u003c\/strong\u003e Enables precise process pressure management, and the isolation valve lets the chamber hold vacuum between experiments.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eSS304L Chamber (Prismatic or Cylindrical) with Electro-Polished Surfaces:\u003c\/strong\u003e Exceptionally clean surfaces and standard 1\", QF, CF, and ISO feedthrough ports allow flexible integration.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eInternal Lighting, 100 °C Baking, UV-Blocking Window, and Rotatable Shutter:\u003c\/strong\u003e A complete set of chamber accessories for process monitoring, conditioning, and moisture removal.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eEasily Upgradeable with Additional Thermal and Sputtering Sources:\u003c\/strong\u003e The modular architecture lets you add sources as research requirements grow.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eLabVIEW Touch Screen Control with Full Panel Backup:\u003c\/strong\u003e Automates sequence management for all source, gas, vacuum, and rotation functions, with a manual panel backup always available.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003e1.5-Hour Experiment Cycle, 4 to 6 Experiments Per Day:\u003c\/strong\u003e Fast pump-down and process cycles support multiple runs each day.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eL120×W80×H180 cm Mobile Platform on Lockable Wheels:\u003c\/strong\u003e A full-size combined system whose footprint still passes through standard doorways, allowing flexible laboratory placement.\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eOne-Year Warranty for Design, Materials, and Workmanship:\u003c\/strong\u003e Annual coverage for system components, design quality, and manufacturing.\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003ch2\u003eTheory and Method\u003c\/h2\u003e\n\u003cp\u003eThermal evaporation and magnetron sputtering each suit material classes and deposition conditions the other cannot match, so combining them in one chamber is practical for complex multilayer device structures. Thermal evaporation heats a resistive source until it vaporizes, producing a clean metallic or organic flux well suited to contact metals and organic emitters. Magnetron sputtering uses plasma to eject atoms from a solid target, covering refractory metals, oxides, and nitrides. Performing both in a single vacuum cycle removes air-exposure contamination at organic-inorganic and metal-dielectric interfaces.\u003c\/p\u003e\n\u003cp\u003eFour thermal sources in a 2×2 co-evaporation configuration permit simultaneous multi-material deposition for alloy, composition-graded, and compound films. The proprietary boxed source design prevents cross-contamination between neighboring crucibles and simplifies source material replacement. DC\/RF sputtering in 1, 2, and 3-inch flex-head configurations handles magnetic and non-magnetic targets alongside the thermal sources. A dual-channel thickness controller with 1 to 4 QCMs tracks the combined deposition at 0.1 Å\/s across all active sources.\u003c\/p\u003e\n\u003cp\u003eThe turbomolecular and mechanical pump combination achieves a base pressure of 10⁻⁸ Torr and reaches 10⁻⁷ Torr within one hour in a loaded chamber. Wide-range vacuum control from 1000 to 10⁻⁹ Torr, together with precise 1 to 100 mTorr pressure control for plasma generation, covers every operating condition. LabVIEW touch screen control with full panel backup manages source power, gas, vacuum, and rotation sequences. An optional ICP, CCP, or DC-RF plasma cleaning unit readies substrate surfaces before deposition.\u003c\/p\u003e\n\u003ch2\u003eHybrid PVD Deposition System - ToronPVD™ DS Technical Specifications\u003c\/h2\u003e\n\u003ctable class=\"table\" border=\"1\" cellspacing=\"0\" cellpadding=\"0\" width=\"610\"\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eParameter\u003c\/th\u003e\n\u003cth\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eRF Power Supply\u003c\/td\u003e\n\u003ctd\u003e13.6 MHz, 300 to 1200 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDC Power Supply\u003c\/td\u003e\n\u003ctd\u003e0 to 1000 V DC, 2000 W\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBase Pressure\u003c\/td\u003e\n\u003ctd\u003e10⁻⁸ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWorking Vacuum (Loaded, 1 hour)\u003c\/td\u003e\n\u003ctd\u003e10⁻⁷ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eVacuum Control Range\u003c\/td\u003e\n\u003ctd\u003e1000 to 10⁻⁹ Torr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePump Configuration\u003c\/td\u003e\n\u003ctd\u003eTurbomolecular + Mechanical (cryo and dry pump as options)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Pressure Range\u003c\/td\u003e\n\u003ctd\u003e1 to 100 mTorr\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Evaporation Sources\u003c\/td\u003e\n\u003ctd\u003e4 (10V to 250A; 2×2 co-evaporation configuration)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSource Design\u003c\/td\u003e\n\u003ctd\u003eProprietary boxed (cross-contamination prevention)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSputtering Sources\u003c\/td\u003e\n\u003ctd\u003eDC\/RF; 1\", 2\", 3\" targets; 85 mm flex-head\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMagnetic\/Non-Magnetic Sputtering\u003c\/td\u003e\n\u003ctd\u003eYes\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGas Inputs\u003c\/td\u003e\n\u003ctd\u003eAr, N₂, O₂, He, CH₄, H₂; digital MFC; 0.1 SCCM sensitivity\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChamber Material\u003c\/td\u003e\n\u003ctd\u003eSS304L (prismatic or cylindrical); electro-polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFeedthrough Ports\u003c\/td\u003e\n\u003ctd\u003eStandard 1-inch, QF, CF, ISO\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSubstrate Heating (Optional)\u003c\/td\u003e\n\u003ctd\u003e50 to 700 °C (PID, ±1 °C)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWafer Compatibility\u003c\/td\u003e\n\u003ctd\u003e3\", 4\", 6\"; 1 to 10 cm sample attachments\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSample Rotation Speed\u003c\/td\u003e\n\u003ctd\u003e2 to 30 rpm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePlasma Cleaning (Optional)\u003c\/td\u003e\n\u003ctd\u003eICP, CCP, DC-RF\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Monitoring\u003c\/td\u003e\n\u003ctd\u003eDual-channel; 0.1 Å\/s; 1 to 4 QCMs\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eInternal Baking\u003c\/td\u003e\n\u003ctd\u003eUp to 100 °C\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eObservation Window\u003c\/td\u003e\n\u003ctd\u003eUV-blocking; rotatable shutter\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling System\u003c\/td\u003e\n\u003ctd\u003eAutomatic closed-loop water cooling (interlock protected)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eControl System\u003c\/td\u003e\n\u003ctd\u003eLabVIEW touch screen; full panel backup\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eExperiment Cycle Time\u003c\/td\u003e\n\u003ctd\u003e1.5 hours (4 to 6 experiments per day)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFootprint\u003c\/td\u003e\n\u003ctd\u003eL120 × W80 × H180 cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDoor Clearance\u003c\/td\u003e\n\u003ctd\u003ePasses through standard doors\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMobility\u003c\/td\u003e\n\u003ctd\u003eLockable wheels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWarranty\u003c\/td\u003e\n\u003ctd\u003e1 year (design, materials, and workmanship)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e","brand":"Torontech","offers":[{"title":"Default Title","offer_id":51280617242863,"sku":null,"price":100.0,"currency_code":"CAD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/files\/hybrid-pvd-deposition-system6890.webp?v=1793018573"}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/5291\/9023\/collections\/sputter-coaters-vacuum-coating-s.webp?v=1792774016","url":"https:\/\/shop.torontech.com\/collections\/sputter-coaters-carbon-coaters-thermal-evaporators.oembed?page=2","provider":"Torontech","version":"1.0","type":"link"}